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Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof

A polyhydroxyl resin, polyhydroxyl technology, applied in the field of epoxy resin, can solve the problem of no polyhydroxyl resin and molecular weight distribution research of epoxy resin, etc.

Active Publication Date: 2015-02-04
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are no examples of detailed studies on the molecular weight distribution of polyhydroxy resins and epoxy resins.

Method used

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  • Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof
  • Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof
  • Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof

Examples

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Embodiment

[0100] Hereinafter, the present invention will be described more specifically through examples. The unit of hydroxyl equivalent and epoxy equivalent is g / eq.

Synthetic example 1

[0102] Into a 1 L four-necked flask, 250 g of phenol and 0.75 g of oxalic acid dihydrate as an acid catalyst were charged, stirred while introducing nitrogen gas, and heated to raise the temperature. Dropwise addition of 47.4 g of 37.4% formalin was started at 80° C., and the dropwise addition was completed over 30 minutes. Further, the reaction temperature was kept at 92° C., and the reaction was performed for 3 hours. The temperature was raised to 110° C. while removing the reaction product water to the outside of the system while raising the temperature. Residual phenol was recovered under reduced pressure at 160°C. A part of the dinuclear body was recovered by further raising the temperature. The hydroxyl equivalent of the obtained polyvalent hydroxy compound was 104, the softening point was 68°C, and the melt viscosity at 150°C was 0.07 Pa·s. The content rate of n=1 component measured by GPC was 8.1%, the total content rate of n=2 and n=3 components was 71.7%, and Mw / M...

Synthetic example 2

[0104] 250 g of phenol, 47.4 g of 7.4% formalin, and 150 g of 89% phosphoric acid as an acid catalyst were added to a 1 L four-necked flask, and heated under the cloudy state (two-phase mixture) formed by stirring and mixing. heat up. Further maintaining the reflux temperature, the reaction was carried out for 6 hours. Next, methyl isobutyl ketone was added to dissolve the resin portion, and then it was left still to separate into a resin solution phase and a phosphoric acid aqueous solution phase. After the phosphoric acid solution phase was removed, water washing was further performed. Next, remaining phenol was collected under reduced pressure at 160°C. A part of the dinuclear body was recovered by further raising the temperature. The hydroxyl equivalent of the obtained polyvalent hydroxy compound was 103, the softening point was 65°C, and the melt viscosity at 150°C was 0.06 Pa·s. The content rate of n=1 component measured by GPC was 2.0%, the total content rate of n=2...

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Abstract

Provided are an epoxy resin, a polyvalent hydroxy resin and a composition thereof which have excellent curability, which provide cured products with excellent mechanical strength, flame resistance, humidity resistance, low elasticity, etc., and which are suitable for applications such as encapsulation of electronic components, circuit board material, etc. This polyvalent hydroxy resin is an aralkyl denatured polyvalent hydroxy resin which is obtained by reacting a narrow disperse polyvalent hydroxy compound with an aralkylating agent of styrenes, etc., the narrow disperse polyvalent hydroxy compound comprising 15% or less of n=1 component, and 50% or more of a total of n=2 and n=3 components, and having Mw / Mn of 1.2 or less. In addition, the present invention is an epoxy resin obtained by reacting the aralkyl denatured polyvalent hydroxy resin with epichlorohydrin. Furthermore, the present invention is an epoxy resin composition which contains, as an essential component, the aralkyl denatured polyvalent hydroxy resin or the epoxy resin.

Description

technical field [0001] The present invention relates to an epoxy resin that is excellent in curability and provides a cured product that is excellent in mechanical strength, flame retardancy, moisture resistance, and low elasticity, polyvalent hydroxyl resins suitable as intermediates thereof, methods for producing them, and methods using them The epoxy resin composition and its cured product are suitable for use as insulating materials in the electrical and electronic fields such as semiconductor sealing materials and printed circuit boards. Background technique [0002] Epoxy resins are used in a wide range of applications industrially, and their required performance has become increasingly advanced in recent years. For example, there are semiconductor sealing materials in the representative field of resin compositions with epoxy resin as the main agent. With the improvement of the integration level of semiconductor elements, the package size is becoming larger and thinner...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G10/04C08G59/08
CPCC08G59/08
Inventor 山田尚史青柳荣次郎渡边圭介冈崎丰朝荫秀安
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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