Heat-dissipating resin composition, substrate for LED mounting, reflector, and substrate for LED mounting having reflector portion

A resin composition and thermoplastic resin technology, applied in the field of heat-dissipating resin compositions, can solve the problems of temperature rise, shortened life of LED elements, and reduced brightness, and achieve temperature rise suppression, excellent mechanical strength, and excellent reflection characteristics. Effect

Inactive Publication Date: 2009-11-18
TECHNO POLYMER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the LED element emits heat when it emits light, in this type of LED lighting device, the temperature rise of the LED element when it emits light leads to a decrease in luminance, shortening the life of the LED element, etc.

Method used

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  • Heat-dissipating resin composition, substrate for LED mounting, reflector, and substrate for LED mounting having reflector portion
  • Heat-dissipating resin composition, substrate for LED mounting, reflector, and substrate for LED mounting having reflector portion
  • Heat-dissipating resin composition, substrate for LED mounting, reflector, and substrate for LED mounting having reflector portion

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～15 and comparative example 1～3

[0126] (2) Evaluation method

[0127] [2] Thermal conductivity (unit: W / (m K))

[0128] [3] Heat distortion temperature (unit: ℃)

[0129] [5] Pendulum impact strength (unit: kJ / m 2 )

[0130] [6] Surface intrinsic resistance (unit: Ω)

[0131] [7] Whiteness (unit: %)

[0132] [8] MFR (unit: g / 10 minutes)

[0133] [10] Curability of transparent sealant composition

Embodiment 16～22

[0139] (2) Evaluation method

[0141] 1-9. Evaluation of heat-dissipating resin composition (III)

Embodiment 23

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PUM

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Abstract

Disclosed is a heat-dissipating resin composition which is used for forming a substrate for LED mounting or a reflector provided on the substrate for LED mounting, and excellent in heat dissipation, electrical insulation, heat resistance and light resistance during the time when an LED element emits light. Also disclosed are a substrate for LED mounting and a reflector respectively containing such a heat-dissipating resin composition. Specifically disclosed is a composition containing a thermoplastic resin such as a modified PBT and a thermally conductive filler such as a flake boron nitride. The composition has a heat distortion temperature of not less than 120 DEG C, a thermal conductivity of not less than 2.0 W / (m K) and a thermal emissivity of not less than 0.7.

Description

technical field [0001] The present invention relates to a heat-dissipating resin composition and a molded article containing the composition, and more specifically, to an LED mounting substrate constituting a surface mount type LED package (LED package) and an LED mounting substrate disposed on the LED mounting substrate. The heat-dissipating resin composition applicable to the formation of the reflector and each of the above-mentioned articles. Background technique [0002] Conventionally, LED elements have been used as light sources such as display lamps because of their small size, long life, and excellent power saving properties. In addition, in recent years, since LED elements with higher luminance can be manufactured at a lower cost, their use as a substitute light source for fluorescent lamps and incandescent bulbs has been studied. When used in such a light source, in order to obtain a large illuminance, it is often used to arrange two or more LED elements on a surf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08K3/00H01L33/00H01L33/32H01L33/56H01L33/58H01L33/60H01L33/62H01L33/64
CPCC08L101/12H05K1/0373H01L33/644F28F21/06H01L33/56H01L33/641H01L2924/0002H01L2924/00
Inventor 藤冈真佑北田房充
Owner TECHNO POLYMER CO LTD
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