The invention relates to an LED
chip and a
processing technology thereof, and belongs to the technical field of manufacturing of photoelectron devices. The technology comprises the following steps: a P-type
nitride layer on an epitaxial
wafer substrate is etched to
expose an N-type
nitride layer; a current
blocking layer is manufactured under a P-type
electrode bonding pad area, an insulating substance under the P-type
electrode bonding pad area, an insulating substance in direct contact with an N-type
electrode bonding pad, and an expanding electrode and the P-type
nitride layer, and an insulating substance on the side walls of a
quantum well and P-type nitride are reserved through
etching; an ITO film deposits on the surface of the substrate, a current expanding layer and
alloy are manufactured through photoetching, a
metal layer is formed on the surface of the substrate through vapor deposition, and after a part of the
metal layer is stripped, a P-type electrode bonding pad, an N-type electrode bonding pad and an N
metal expanding electrode are formed. Both the P-type electrode bonding pad and the N-type electrode bonding pad of the product are positioned on a P-type light-emitting surface and are the same in height; a part or all of the N metal expanding electrode is in direct contact with the N-type nitride layer. The invention has the advantages that the routing is convenient, the light-emitting efficiency and the brightness of the LED
chip on the nitride substrate can be improved.