Leadframe for optical semiconductor device, method for manufacturing leadframe for optical semiconductor device, and optical semiconductor device

A technology for optical semiconductor devices and lead frames, which is applied to semiconductor devices, semiconductor/solid-state device components, optics, etc., and can solve problems such as reflectivity decline and reflectivity degradation.
CN102844897AInactive Publication Date: 2012-12-26FURUKAWA ELECTRIC CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
FURUKAWA ELECTRIC CO LTD
Publication Date
2012-12-26
Estimated Expiration
Not applicable · inactive patent

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Abstract

A lead frame for an optical semiconductor device, having a reflection layer at least on one side or each side of the outermost surface of a substrate, partially or entirely, in which the reflection layer has, on the outermost surface at least in a region where light emitted by an optical semiconductor element is reflected, a microstructure with at least the surface thereof having been mechanically deformed, which is converted from a plating microstructure formed of a metal or an alloy thereof; a method of producing the same, and an optical semiconductor device having the same.
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Description

technical field

[0001] The present invention relates to a lead frame for an optical semiconductor device, a manufacturing method thereof, and an optical semiconductor device. Background technique

[0002] Lead frames for optical semiconductor devices are widely used as constituent members of various display / illumination light sources using light emitting elements such as LED (Light Emitting Diode) elements as light-emitting elements of optical semiconductor elements as light sources. Regarding this optical semiconductor device, for example, a lead frame is arranged on a substrate, and after a light emitting element is mounted on the lead frame, in order to prevent deterioration of the light emitting element or its surrounding parts caused by external factors such as heat, moisture, oxidation, etc., use The light-emitting element and its surroundings are sealed with resin or ceramics.

[0003] In the case of an LED using a lead frame, a raw material such as a copper strip is...

Claims

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