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64results about How to "Increase the effective luminous area" patented technology

LED chip and processing technology thereof

The invention relates to an LED chip and a processing technology thereof, and belongs to the technical field of manufacturing of photoelectron devices. The technology comprises the following steps: a P-type nitride layer on an epitaxial wafer substrate is etched to expose an N-type nitride layer; a current blocking layer is manufactured under a P-type electrode bonding pad area, an insulating substance under the P-type electrode bonding pad area, an insulating substance in direct contact with an N-type electrode bonding pad, and an expanding electrode and the P-type nitride layer, and an insulating substance on the side walls of a quantum well and P-type nitride are reserved through etching; an ITO film deposits on the surface of the substrate, a current expanding layer and alloy are manufactured through photoetching, a metal layer is formed on the surface of the substrate through vapor deposition, and after a part of the metal layer is stripped, a P-type electrode bonding pad, an N-type electrode bonding pad and an N metal expanding electrode are formed. Both the P-type electrode bonding pad and the N-type electrode bonding pad of the product are positioned on a P-type light-emitting surface and are the same in height; a part or all of the N metal expanding electrode is in direct contact with the N-type nitride layer. The invention has the advantages that the routing is convenient, the light-emitting efficiency and the brightness of the LED chip on the nitride substrate can be improved.
Owner:YANGZHOU ZHONGKE SEMICON LIGHTING

Transparent array substrate, transparent display panel, display panel and display terminal

The invention discloses a transparent array substrate, a transparent display panel, a display panel and a display terminal. The transparent array substrate comprises a substrate, a pixel circuit, a first electrode, scanning lines and data lines, wherein the pixel circuit is arranged on the substrate, the first electrode is arranged on the pixel circuit and comprises a plurality of first electrodes, the scanning lines and the data lines are connected with the pixel circuit, the data lines and / or the scanning lines are arranged below the first pixel layer, the projection of the data lines on thesubstrate is first projection, the projection of the scanning lines is second projection, the projection of the plurality of first electrodes on the substrate is third projection, the first projection and the third projection are partially coincided and / or the second projection and the third projection are partially coincided, and the first electrodes, the scanning lines and the data lines are all transparent conductive materials. The data lines, the scanning lines and the first electrodes are arranged at different layers, the projection are arranged at edges of the first electrodes, thus, diffraction is reduced, meanwhile, the effective light-emitting areas of the first electrodes are expanded, and the aperture can be improved.
Owner:KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD

Electroluminescent device with high light emitting efficiency

The invention provides an electroluminescent device with high light emitting efficiency, which comprises a transparent substrate, a light scattering layer positioned on the transparent substrate, a surface smooth layer positioned on the light scattering layer and an electroluminescent layer positioned on the surface smooth layer. The electroluminescent device has the following technical effects: 1, light scattering particles are exposed out of an adhesive, each of the light scattering layer and the surface smooth layer is provided with a waved surface, light emitted from the light emitting layer is directly scattered by the waved light scattering particles after passing through the waved surface smooth layer with a high refractive index, parts of light rays which are less than a critical angle are directly emitted out, the light rays which are greater than or equal to the critical angle are reflected back, are reflected again by a reflection electrode layer, passes through the surface smooth layer and are scattered again, another part of light is extracted, and extraction is repeatedly carried out, so that the light extraction efficiency is greatly improved, and the waved surface of the light scattering layer increases an effective light emitting area; 2, the electroluminescent device adopts is simple in preparation process and facilitates scale mass production.
Owner:FIRST O LITE

Production method of free nanometer columnar array for improving luminescence of OLED device

The invention discloses a production method of a free nanometer columnar array for improving luminescence of an OLED device. The method comprises the steps that firstly, an ITO substrate is cleaned byusing a laboratory ITO conductive glass cleaning agent with a certain concentration and an ultraviolet light cleaning machine in sequence; then even PMMA/PS thin film is prepared by using a common technology, the ITO substrate with the PMMA/PS thin film is annealed, and a free nanometer columnar array is obtained; finally, an organic layer and an electrode layer of the OLED device are subjected to vapor deposition in sequence, and the OLED device is obtained after being packaged. According to the production method, the phase separation process of the PMMA/PS thin film is regulated and controlled, and a free nanometer columnar array structure is prepared and obtained on the ITO substrate and is applied to the OLED device; the manufacturing technology is simple, the cost is low, meanwhile,the surface area of the thin film is effectively improved, and the effective luminescence area of the device is increased; meanwhile, the light emergence angle is changed, the total reflection loss isreduced, the light emergence rate is improved, and luminescence of the OLED device is improved.
Owner:HEFEI UNIV OF TECH

Display substrate, manufacturing method thereof and display device comprising display substrate

The invention relates to a display substrate, a manufacturing method thereof and a displaying device comprising the display substrate. A pixel unit in the display substrate comprises a first electrode and a first connecting part which is connected with the first electrode. The first connecting part is connected with a first connecting wire through a first via hole. The first connecting line of the pixel unit is connected with the first connecting line of another pixel unit above the pixel unit and the first connecting line of another pixel unit below the pixel unit. According to the technical solution of the display substrate, the first connecting line is connected with the first connecting part through the first via hole and furthermore is connected with a common electrode. Because the first connecting line is also used for connecting with the first connecting lines of another pixel unit above the pixel unit and another pixel unit below the pixel unit, thereby connecting with the common electrode in the longitudinal pixel unit. Compared with a manner of connecting with the common electrode in the longitudinal pixel unit through two via holes and two connecting lines in prior art, the manner of the display substrate is advantageous in that only one via hole is required; and relatively small reserved area for the via hole on the pixel electrode is realized, thereby enlarging an effective light emitting area and furthermore increasing an aperture ratio.
Owner:CHONGQING BOE OPTOELECTRONICS +1

Solid state light source device

The invention relates to a solid state light source device, which comprises a hollow optical component which has a cavity containing air, vacuum or other light-transmitting mediums. The optical component provided with a light outlet is polyhedron-shaped and is provided with at least one light inlet, at least one light guide prism corresponding to the light inlet, and a surface illuminator corresponding to the bottom surface of the light guide prism. Reflection parts are arranged inside the optical component or inside and outside the optical component. A frustum-shaped light guide part of which the light incident area is larger than the light emergent area is arranged between the light inlet of the optical component and the surface illuminator; and after passing through the frustum-shaped light guide part, the light emitted by the surface illuminator is refracted or completely reflected by the light guide prism, and then is reflected by the reflection parts or directly emitted via the light outlet. As the frustum-shaped light guide part of which the light incident area is larger than the light emergent area is arranged between the light inlet of the optical component and the surface illuminator, the solid state light source device can enlarge the effective light-emitting area of the surface illuminator without changing the sizes of the optical component and the light inlet.
Owner:曹嘉灿

Integrated LED (Light Emitted Diode) chip and manufacturing method thereof

The invention discloses an Integrated LED (Light Emitted Diode) chip and a manufacturing method thereof. The method comprises the following steps of: S1, growing an epitaxial layer on a substrate to form a wafer matrix; S2, on the wafer matrix, forming an isolation groove for isolating adjacent mono-cells by laser cutting, wherein the bottom of the isolation groove stretches to the substrate of the wafer matrix; S3, removing a part of a second semiconductor layer and a emitting layer to enable a first semiconductor layer under the second semiconductor layer and the emitting layer to be exposed; S4, forming a transparent conductive film on the surface of the second semiconductor layer; S5, forming a passivation layer on a side wall and in the isolation groove, wherein the side wall formed by the superposition of the first semiconductor layer, the second semiconductor layer and the emitting layer; and S6, forming metal connecting wires among the mono-cells isolated by the isolation groove, so as to form the integrated LED chip. According to the Integrated LED (Light Emitted Diode) chip and the manufacturing method thereof disclosed by the invention, by forming the isolation groove by means of laser cutting, the manufacturing process is simplified, the production efficiency is improved, and the effective light-emitting area of the chip is increased.
Owner:XIANGNENG HUALEI OPTOELECTRONICS

Organic light emitting display panel, method of manufacturing same, and organic light emitting display device

The invention provides an organic light-emitting display panel, a manufacturing method thereof and an organic light-emitting display device, and the organic light-emitting display panel comprises a display region and a camera region. Each of the camera shooting area and the display area comprises a substrate and a plurality of pixel units formed on the substrate, and an organic light emitting diode of each pixel unit comprises a stacked structure formed by an anode, an organic light emitting layer and a cathode; in the camera shooting area, the stacked structure of at least one organic light-emitting diode is a curved surface structure or a wave structure, and the curved surface structure faces the substrate or is opposite to the substrate. According to the organic light-emitting display panel, the manufacturing method thereof and the organic light-emitting display device, the OLED device in the camera shooting area is designed to be of the curved surface structure or the wave structure, so that the effective light-emitting area is increased, the photoelectric performance and the brightness of the OLED device in the camera shooting area are improved, the parallax problem is solved, and the user experience is improved.
Owner:EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD

A flip-chip light-emitting diode chip and its manufacturing method

The invention provides an inverted light emitting diode chip and a manufacturing method thereof. The inverted light emitting diode chip comprises a substrate, an epitaxy structure, a transparent conducting layer, a reflecting mirror, an insulation groove, an insulation barrier layer, a mesa structure, a reflective conducting layer, a passivation layer, an N electrode and a P electrode. According to the inverted light emitting diode chip and the manufacturing method thereof provided by the invention, a channel for insulation is formed on the periphery of the inverted light emitting diode chip, so that a leakage current of the chip can be reduced; the reflecting mirror is additionally arranged at a scribe line area, so that the product brightness is improved favorably; in addition, the derivation of N-GaN is manufactured on the side wall of the N-GaN and the scribe line area, so that the effective light emitting area of a light emitting diode can be greatly increased, and the brightness is improved; by means of an N reflective conducting layer and a P electrode reserving area, the N electrode and the P electrode can be directly manufactured after the passivation layer is tapped, so that the process step is reduced, and the production cost is reduced.
Owner:山东影响力智能科技有限公司
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