684results about How to "Reduce height difference" patented technology

The invention discloses a display module and a display device, and relates to the technical field of display. The display module is provided with a display area and a non-display area arranged aroundthe display area, the display module comprises a display panel and a cover plate, and the display panel and the cover plate are attached through optical glue; the display panel comprises an array substrate and a polarizer which are sequentially arranged, and the polarizer is located on the side, close to the cover plate, of the array substrate; the display module comprises at least two layers of ink layers, and the ink layers are located in the non-display area and surround the display area; the at least two layers of ink layers comprise the first ink layer and at least one second ink layer, the first ink layer is arranged on the surface, close to one side of the display panel, of the cover plate, and at least one second ink layer is arranged between the optical glue and the array substrate. Therefore, the height difference between the ink layer on the cover plate and the display panel is effectively reduced so that the phenomena that bubbles are generated in the attaching process andcolor cast is generated in the display process can be avoided, and the requirement for the thinning tendency of the display module and the display device can be met.

A sintering furnace type cooling device relates to the technology field of sintering cooling devices. An outlet of a sintering machine is provided with a single roll crusher; an outlet of the single roll crusher is provided with a hot sinter screen; the hot sinter screen is connected with an inlet of a chute; an outlet of the chute is connected with a furnace opening of a cooling furnace; a distributing device is arranged inside the furnace opening of the cooling furnace; a ventilation device is arranged at the bottom of the cooling furnace; a discharging device is connected under the ventilation device; a belt conveyer is arranged under the discharging device; the cooling furnace comprises a pre-store area which is arranged on the upper portion, a cooling area which is arranged on the lower portion and an annular flue area which is arranged on the periphery of the pre-store area; radial supporting columns which are integrally and radially distributed are arranged at the bottom of the annular flue area; a high-temperature flue gas adjustment plate is coated on two adjacent radial supporting columns; and the high-temperature flue gas adjustment plate is capable of sliding along a diametrical direction of the annular flue. The sintering furnace type cooling device has the advantages of effectively overcoming the defects that an existing sintering cooling system is serious in air infiltration and low in waste heat utilization rate, achieving efficient heat replacement, improving the temperature of the flue gas and reducing energy consumption in cooling.

The invention discloses an array substrate and a preparation method thereof, a display panel and a display device, which relate to the technical field of display and are invented for solving the problem that the brightness of the light emitted by an organic light emitting unit in the array substrate in the related art is attenuated greatly. The array substrate, include multiple pixels, each of thepixels includes a plurality of sub-pixels, for each of the sub-pixels, the sub-pixel includes a substrate, an insulating layer, a color filter layer, a flat layer and an organic light emitting unit,At least a part of that color filtering layer is filled in the first opening; the flat layer covers the insulate layer and covers the surface of the color filter layer; and the organic light emittingunit is arranged on the flat layer. The invention can be used in an OLED display device.

A liquid crystal display (LCD) includes a first substrate including a display area displaying images and a peripheral area surrounding the display area, a common pad formed in the peripheral area of the first substrate, an insulating layer formed on the common pad and having a common contact hole exposing the common pad, an assistance common pad formed on the insulating layer of the peripheral area and contacting the common pad through the common contact hole, a second substrate corresponding to the first substrate, and a common electrode formed on the second substrate, and a conductive sealant disposed between the assistance common pad and the common electrode of the peripheral area, the conductive sealant electrically connecting the assistance common pad and the common electrode, wherein the common contact hole is disposed between the conductive sealant and the display area.

The invention discloses a scissor type lift and a lifting device thereof. The lifting device comprises a protective supporting plate, a lock, a bumper, a head shaft and at least two parallel engine-driven telescopic devices, wherein each engine-driven telescopic device comprises a telescopic rod at one end thereof respectively; the head shaft is pivoted with tail ends of telescopic rods of the at least two parallel engine-driven telescopic devices respectively; the two ends of the protective supporting plate are fixed to the at least two parallel engine-driven telescopic devices respectively; the lock is arranged on the protective supporting plate between the two engine-driven telescopic devices; one end of the bumper is pivoted with the head shaft; the rod is close to the lock and is provided with a plurality of notches distributed along the axial direction; and the notches and the lock forms a self-locked structure locked in one way. The scissor type lift and the lifting device thereof of the invention can ensure the safety of the lifting operation, reduce the height difference between two platforms of the scissor type lift and meet the standard requirement.

The invention discloses a manufacturing method and a fine-adjustment device for apyrexia arrayed waveguide grating based on planar waveguide moving. The method is that: a AWG chip is reliably coupled with an input fiber array and an output fiber array; the AWG chip is cut into a movable part and a fixed part along a cutting line; and then the fixed part is stuck on a base board; the movable part is arranged on the base board; the cut faces of the two parts are tightly coupled; one side edge of a temperature compensating lever is tightly stuck to the movable part along the connection line of the two parts of the AWG chip; the fine-adjustment device is used to adjust the position of the temperature compensating lever so that the length of the output wave of the apyrexia arrayed waveguide grating satisfies the stipulation of ITU-T; and after the spectrum of the apyrexia arrayed waveguide grating has the same spectrum with the AWG, the other side edge of the temperature compensating lever is fixedly stuck to the fixed part. The fine-adjustment device of the invention is of a structure that the base board is fixedly stuck the AWG chip and the fine-adjustment device can adjust the position of the temperature compensating lever on the base. The invention is of easy operation, and greatly simplifies the technique of manufacturing apyrexia arrayed waveguide grating.

A photoelectric conversion sensor according to the invention comprises: a substrate; a plurality of organic photoelectric conversion pixel parts arranged on the substrate for converting incident light to an electric signal; a light transmissive substrate for transmitting incident light; an optical filter arranged on the light transmissive substrate for limiting the wavelength range of incident light to the plurality of organic photoelectric conversion pixel parts; and a support part for supporting the substrate and the light transmissive substrate in a state where the organic photoelectric conversion pixel parts are separated from the optical filter.

The invention discloses a sintered ore cooling furnace device. The device is composed of a pre-storage area, an annular air flue area, a chute area, a cooling area and an air chamber. High-temperature sintered ores are continuously and evenly distributed into a cooling furnace for cooling through a charging port above the pre-storage area by a material distribution device, high-temperature sintered ores are subjected to counter-flow heat exchange with low-temperature air blown from the bottom of the furnace in the cooling area of the cooling furnace, sintered ores are cooled to below 180 DEG C, low-temperature ores are discharged by a discharging device, the low-temperature air is heated to about 600 DEG C through counter-flow heat exchange and enters a waste heat recycling system through an air outlet, and hot air and hot sintered ores are effectively sealed inside the cooling furnace in the whole process. By the aid of the device, on the premise that the quality of sintered ores is guaranteed or improved and the return fine rate is reduced, the efficiency of recycling of waste heat of sintered ores is improved to the maximum extent.

The invention discloses a method, an optical mask and a photoreaction layer for making a substrate of a color filter. The method comprises the following steps of: providing the substrate; providing the photoreaction layer, wherein the photoreaction layer is coated on the substrate; providing the optical mask, wherein the optical mask is arranged above the photoreaction layer; and providing light of different frequency ranges to irradiate the photoreaction layer through the optical mask so as to respectively form a color resistance area and a black shading area on the photoreaction layer. The invention also provides the optical mask and the photoreaction layer for making a color resistance layer of the substrate of the color filter. By adopting the mode, the method has the advantages of shortening the cycle period of processing and improving the aperture opening ratio and the display contrast ratio.

A light-emitting device includes: a light-emitting element which is disposed in a display region of a base body and includes a first electrode, a second electrode, and a light-emitting functional layer; a first conductor; a first insulating layer which covers the first conductor; a second conductor; and a second insulating layer which covers the second conductor. The second electrode is formed on a surface of the first insulating layer and is electrically connected to the first conductor via a first conduction hole of the first insulating layer, the first conductor is formed on a surface of the second insulating layer and is electrically connected to the second conductor via a second conduction hole of the second insulating layer, and the first conduction hole and the second conduction hole are configured not to overlap each other in a plan view.

A semiconductor device includes: a semiconductor substrate having first and second areas; an STI isolation region being made of an isolation trench formed in the semiconductor substrate and an insulating film burying the isolation trench and defining a plurality of active regions in the first and second areas; a first structure formed on an area from the active region in the first area to a nearby STI isolation region and having a first height; and a second structure formed on an area from the active region in the second area to a nearby STI isolation region and having a second height, wherein the surface of the said STI isolation region in the first area is lower than the surface of said STI isolation region in the second area.

The invention relates to an LED chip and a processing technology thereof, and belongs to the technical field of manufacturing of photoelectron devices. The technology comprises the following steps: a P-type nitride layer on an epitaxial wafer substrate is etched to expose an N-type nitride layer; a current blocking layer is manufactured under a P-type electrode bonding pad area, an insulating substance under the P-type electrode bonding pad area, an insulating substance in direct contact with an N-type electrode bonding pad, and an expanding electrode and the P-type nitride layer, and an insulating substance on the side walls of a quantum well and P-type nitride are reserved through etching; an ITO film deposits on the surface of the substrate, a current expanding layer and alloy are manufactured through photoetching, a metal layer is formed on the surface of the substrate through vapor deposition, and after a part of the metal layer is stripped, a P-type electrode bonding pad, an N-type electrode bonding pad and an N metal expanding electrode are formed. Both the P-type electrode bonding pad and the N-type electrode bonding pad of the product are positioned on a P-type light-emitting surface and are the same in height; a part or all of the N metal expanding electrode is in direct contact with the N-type nitride layer. The invention has the advantages that the routing is convenient, the light-emitting efficiency and the brightness of the LED chip on the nitride substrate can be improved.

Provided is a hybrid integrated circuit module and a manufacturing method thereof. The manufacturing method comprises the steps that a substrate, a heat radiator and a glass fiber plate with through holes arranged at preset positions are manufactured, and an insulating layer is covered on one of the surfaces of the substrate; the glass fiber plate and the heat radiator are arranged on the surface of the insulating layer; a circuit wiring layer is arranged on the surface of the glass fiber plate; power elements and non-power elements are respectively distributed on the heat radiator and the corresponding positions of the circuit wiring layer; and metal wires are connected between the circuit wiring layer, the heat radiator, the power elements and the non-power elements. Contact reliability of bonding points is enhanced, length of bonding wires is reduced and height difference of the bonding wires is reduced so that wire punching rate in molding can be effectively reduced, and thus qualified rate of manufacturing and long-term reliability of an intelligent power module are enhanced.

The invention relates to the technological field of display, and particularly relates to a flexible display module and a preparation method thereof. The flexible display module and the preparation method thereof solve the problems that sharp corners of protective cover plates squeeze back films due to segment differences, the back films are prone to fold, and seal packaging layers in flexible display screens are prone to fracture in the prior art. The flexible display module comprises a back film, a flexible display screen and a protective cover plate, wherein the flexible display screen and the protective cover plate are arranged on the back film in sequence in a stacked mode; and one side edge of the protective cover plate is provided with an arc extension part relative to the flexible display screen and the back film, and the arc extension part extends along one side of the back film, one end of the arc extension part extending along one side of the back film is the free end, an arcconcaved face of the arc extension part is arranged towards the side faces of the flexible display screen and the back film at the same side of the arc extension part, and a gap is formed between thearc concaved face of the arc extension part and the side faces of the flexible display screen and the back film at the same side.

An isotropic-diffusion filling method uses a thermal process on a result structure comprising a photoresist layer and an organic material layer to create a cross-linking layer there between, which minimizes step height differences between isolated and dense via-pattern regions for optimizing a subsequent trench process and simplifying process steps.

The invention relates to a liquid crystal display substrate and a manufacturing method thereof. The liquid crystal display substrate comprises a substrate; patterns of various conductive structures are formed on the substrate; and the conductive structures are mutually spaced or insulated through an insulating layer, wherein trenches are formed on the insulating layer with the conductive structures, and the patterns of the conductive structures are at least partially formed in the trenches. By adopting a technical means of forming the conductive structures in the trenches of the insulating layer, the height difference of the conductive structures on the surface of the insulating layer below the conductive structures is reduced, so that the limitation for the thickness of the conductive structures is reduced.

The invention provides a split-gate flash memory unit and a forming method thereof. The split-gate flash memory unit comprises a semiconductor substrate, a source line polycrystalline silicon layer which is located on the surface of the semiconductor substrate, a source electrode which is located in the semiconductor substrate aligned to the source line polycrystalline silicon layer, a coupling oxide layer and a floating gate which are sequentially located on the semiconductor substrate surfaces at two sides of the source polycrystalline silicon layer, a side wall medium layer which is used for electrically isolating the source wire line polycrystalline silicon from the coupling oxide layer and the floating gate, a coupling oxide layer which is located on the side wall of the floating gate far away from the source line polycrystalline silicon layer, an epitaxial layer which is located on the surface of the semiconductor substrate at one side of the coupling oxide layer far away from the source line polycrystalline silicon layer, tunneling oxide layers which are located on the surface of the epitaxial layer and on the side wall of the side medium layer far away from the source line polycrystalline silicon layer, word line polycrystalline silicon layers which are located on the surfaces of the tunneling oxide layers, and drainage electrodes which are located in the epitaxial layer at one side of the word line polycrystalline silicon layer far away from the floating gate and the semiconductor substrate. With the adoption of the split-gate flash memory unit provided by the invention, the programming efficiency of the split-gate flash memory unit can be improved and the miniaturization is easy to realize.

Occurrence of wrinkles due to neck-in processing is reduced and drop in coating strength of an overlap portion is prevented by reducing the level difference between the overlap portion and an ink layer at a part continuous to the overlap portion. A seamless can is produced by transferring an ink layer onto the can body by cylindrical printing in such a manner that the transferred ink layer has an overlap portion where the ink layer is overlapped at the front and rear ends of the can body in the circumferential direction, and the ink area ratio of the ink layer at at least one of the front or rear end is smaller than that of the ink layer at a part continuous to the overlap portion excluding the overlap portion.

A touch panel providing a touch signal is disclosed. The touch panel includes a substrate, a first visual masking layer, an electrode layer, a metal material layer, and a second visual masking layer. The substrate has a surface. The first visual masking layer is disposed on at least one edge area of the surface. A part of the electrode layer is disposed at a display area on the surface adjacent to the edge area, and another part of the electrode layer covers at least a portion of the first visual masking layer. The metal material layer is disposed at the edge area and electrically connected with the electrode layer. The second visual masking layer is disposed at the edge area and stacked on the first visual masking layer. The said another part of the electrode layer is sandwiched between the first visual masking layer and the second visual masking layer.

The invention relates to an automatic medicine taking cabinet and a medicine taking method. The automatic medicine taking cabinet comprises a cabinet body, the cabinet body comprises a medicine placing rack, a front panel located in front of the medicine placing rack, a cabinet door located on the rear side of the medicine placing rack, a medicine taking mechanism and a control system. The invention further discloses the medicine taking method. According to the automatic medicine taking cabinet, a medicine taking trolley hopper of the medicine taking mechanism can reach the lower portions of medicine containing bins along medicine taking rail units, walk to the left side of the medicine taking rail units after taking medicines and pour the medicines into an adjacent medicine hopper, and then a medicine collecting trolley reaches the designated medicine outlet position through a lifting unit and a horizontal moving rail unit. By adopting the cooperation of conveyor belts and correlationsensors, the problems of a medicine feeding mode and counting are well solved, and when the medicines are placed, only the cabinet door needs to be opened, the medicines are pushed in from the back,the previous medicines are in the front, the current medicines are in the back, the operation is simple and convenient, and the situation that the previous medicines are out of date due to unreasonable medicine placement can be prevented.

The present disclosure discloses a device having multiple printing layers and a printing method thereof, wherein said method comprises: seriatim stack-printing at least one printing layer on a protective substrate in an ascending order of size, wherein the protective substrate has an open surface exposed outward and a laminating surface laminated with a plate, and wherein the printing layer is printed on a part of the laminating surface and the closer the printing layer is to the laminating surface, the smaller area the printing layer has so as to reduce height difference between printing layers and make for the following lamination.

The invention belongs to the technical field of power equipment and in particular relates to a power equipment transporting vehicle convenient to load and unload. The power equipment transporting vehicle convenient to load and unload comprises a base; a handrail is fixedly connected to the upper end of the base; a lifting plate is arranged at the upper end of the base; a lifting mechanism is arranged between the lifting plate and the base; a clamping mechanism is arranged at the upper end of the lifting plate; telescopic rods are fixedly connected to the four corners of the lower end of the base; a same mounting plate is fixedly connected to the lower ends of the multiple telescopic rods; springs sleeving the telescopic rods; the two ends of the spring are fixedly connected with the base and the mounting plate; and running mechanisms are arranged on the two sides of the lower end of the mounting plate. The power equipment transporting vehicle convenient to load and unload has the advantages that the height difference between the power equipment transporting vehicle and a large-sized transporting vehicle is reduced by using the lifting plate to be convenient for conveying and transferring power equipment; as the clamping plate is arranged, the power equipment is convenient to clamp and fix so that additional fixing tools such as ropes do not need to use; and the vehicle is simple and convenient.

Manufacturing yield of integrated circuits having differentiated areas such as array and support areas of a memory is improved by reducing height / step height difference between structures in the respective differentiated areas and is particularly effective in conjunction with top-oxide-early (TOE) and top-oxide-late processes. A novel planarization technique avoids damage of active devices, isolation structures and the like due to scratching, chipping or dishing which is particularly effective to improve manufacturing yield using TON processes and also using TOE and TOL processes when average height / step height is substantially equalized. Alternative mask materials such as polysilicon may also be used to simplify and / or improve control of processes.

This invention provides a semiconductor device (in particular, microphone) having a small mounting area. A package is formed by overlapping a cover (44) and a substrate (45) one over the other. A microphone chip (42) is mounted on a top surface of a recess (46) of the cover (44), and a circuit element 43 is mounted on an upper surface of a recess (66) of the substrate (45), where the microphone chip (42) is positioned perpendicularly, on the upper side of the circuit element (43). The microphone chip (42) is connected to a bonding pad arranged on the lower surface of the cover (44) by a bonding wire, the circuit element (43) is connected to a bonding pad (68) arranged on the upper surface of the substrate (45) by a bonding wire (80), and a cover side joining portion (49) conducted to the bonding pad on the lower surface of the cover (44) and a substrate side joining portion (69) conducted t to the bonding pad (68) on the upper surface of the substrate (45) are joined by a conductive material (86).

This invention discloses the pels and motherboard of a kind of transverse electric field liquid crystal display and the pels technics. Its reflecting board has nanometer rank rough surface to diffuse lamp-house and increase the contrast. Besides, because the rough surface is nanometer rank, it will have bigger disheveled angle and planar effect in the aspect of disheveled effect. That is the reflectivity won't acutely change with the visual angle, and has good resist glaring effect. Furthermore the rough surface are formed by using the crystal and the characteristic of the material itself, and don't need additive light sheltering modulus.