Hybrid integrated circuit module and manufacturing method thereof

Abstract

Provided is a hybrid integrated circuit module and a manufacturing method thereof. The manufacturing method comprises the steps that a substrate, a heat radiator and a glass fiber plate with through holes arranged at preset positions are manufactured, and an insulating layer is covered on one of the surfaces of the substrate; the glass fiber plate and the heat radiator are arranged on the surface of the insulating layer; a circuit wiring layer is arranged on the surface of the glass fiber plate; power elements and non-power elements are respectively distributed on the heat radiator and the corresponding positions of the circuit wiring layer; and metal wires are connected between the circuit wiring layer, the heat radiator, the power elements and the non-power elements. Contact reliability of bonding points is enhanced, length of bonding wires is reduced and height difference of the bonding wires is reduced so that wire punching rate in molding can be effectively reduced, and thus qualified rate of manufacturing and long-term reliability of an intelligent power module are enhanced.

Description

technical field [0001] The invention belongs to the field of electronic device manufacturing technology, and in particular relates to a hybrid integrated circuit module and a manufacturing method thereof. Background technique [0002] Intelligent Power Module (IPM) is a power drive product that combines power electronics and integrated circuit technology. IPM integrates power switching devices and high-voltage drive circuits, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the IPM receives the control signal from the MCU to drive the subsequent circuits to work, and on the other hand, sends the system status detection signal back to the MCU. Compared with the traditional discrete solution, IPM wins more and more markets with its advantages of high integration and high reliability. It is especially suitable for frequency converters and various inverter power supplies for driving motors. An ideal power electronic d...

AI Technical Summary

Problems solved by technology

[0010] The present invention aims to solve the deficiencies of the prior art, and provides a hybrid integrated circuit module that uses conductive substances to electrically connect the circuit wiring layer and the substrate, and solves the problem that the excessive height difference between the power device and the circuit wiring will cause the bonding line to be flushed , off-line, resulting in low product yield and reliability

Images