1916results about "Handling discharged material" patented technology

A thermal treatment apparatus includes a processing container, a substrate holding unit for holding a plurality of substrates at predetermined intervals in a direction inside the processing container, a heating unit for heating the processing container, a supply unit for supplying gas, a plurality of supply ports provided respectively at different locations in the direction, and a cooling unit for cooling the processing container by supplying the gas into the processing container by the supply unit via each of the supply ports, wherein the supply unit is provided in such a way that the supply unit independently controls flow rates of the gases supplied via each of the supply ports.

A method and apparatus for heat treating a photovoltaic device. The apparatus includes a heating module, a processing module, and a cooling module in which the operating temperatures of the modules may be controlled separately. The heating module is configured to pre-heat a substrate and stabilize the substrate at the desired target temperature, the processing module is configured to thermally process the substrate, and the cooling module is configured for post-treatment cooling of the substrate.

A substrate heat treatment apparatus includes a heat-treating plate having a flat upper surface, support devices formed of a heat-resistant resin for contacting and supporting a substrate, a seal device disposed annularly for rendering gastight a space formed between the substrate and heat-treating plate, and exhaust bores for exhausting gas from the space. The support devices are formed of resin, and the upper surface of the heat-treating plate is made flat, whereby a reduced difference in the rate of heat transfer occurs between contact parts and non-contact parts on the surface of the substrate. Consequently, the substrate is heat-treated effectively while suppressing variations in heat history over the surface of the substrate.

A cooling apparatus for a fired body includes a transporting member for transporting a firing jig in which a ceramic fired body is housed; a plurality of blowers for cooling the ceramic fired body; and a suction mechanism for changing the atmosphere inside the firing jig from an inert gas atmosphere to an air atmosphere.

A method and apparatus for treating a selected region of a metal layer, used to form a metal card, by annealing the selected metal region so the selected region becomes soft and ductile, while the rest of the metal layer remains stiff. The softened, ductile, selected metal region can be embossed with reduced power and with reduced wear and tear on the embossing equipment. Alternatively, the annealed metal layer can undergo additional processing steps to form an assembly which can then be embossed. The method may include the use of a fixture for holding the metal layer, with the fixture having a window region for enabling heat to be applied to soften the region of the metal layer within the window region. The fixture includes apparatus for cooling the portion of the metal layer outside of the window region and for preventing the temperature of the metal layer outside the window region from rising above predetermined limits.

A solder reflow oven for the processing of ball grid array substrates bearing solder balls is described, comprising: input means for introducing substrates into the oven, a processing chamber within which the substrates are subject to a solder reflow process, and output means for discharging substrates from the oven for further processing or handling, and means for transferring the substrates through the processing chamber in a first direction towards the output means. The processing chamber comprises a plurality of heating and cooling zones arranged with a constant pitch in the first direction, and the transferring means is adapted to move the substrates in the first direction in stages, with each component moving a distance equal to the pitch between two zones in each stage, whereby the components are moved from zone to zone in stages. In addition each block of each heating zone and each block of each cooling zone is connected to a source of fresh gas, and each block of each heating zone is provided with means for heating the gas, and each block of each cooling zone is provided with means for cooling the gas, and each block is formed with a serpentine channel between the source of fresh gas and at least one opening through which the gas is discharged from the block towards a substrate.

The invention relates to the physical heat recovery field of solid high temperature materials. The system can be applied in the waste heat recovery of extra-large high-temperature particles such as high-temperature sintering ore and the like and the process is as follows: the high-temperature sintering ore from a sintering machine falls into a cold sinter furnace through a feeding system, gradually falls with ore discharge and enters a cooling section to radiate heat. The cooled sintering ore enters a vibrator feeder discharging system through a blanking hopper and a regulating gate. The process can be adopted to cool the sintering ore from about 700-800 DEG C to about 100 DEG C. Cold air provided by an air blower enters the cold sinter furnace through an air inlet and a blast cap, absorbs heat in the cooling section and then enters an annular channel, the high-temperature gas from the annular channel enters a waste heat boiler through a dust remover, the heat is transferred to a working medium and then pumped by the draft fan through the dust remover, and the gas is discharged in a chimney when reaching the dedusting standard. The heat-absorbing working medium (usually water) is converted to superheated steam with a certain parameter in the waste heat boiler to do work in a turbine and drive a generator to generate power. Dead steam after doing work enters a condenser and is sent back to the waste heat boiler through a circulating water pump, thus, a thermal cycle is completed.

The invention relates to a method and an apparatus for cooling a material to be removed from the grate of a fluidized bed furnace. Material at a high temperature is passed from the grate of the fluidized bed furnace into a fluidized bed cooler in charges of a given size by measuring the quantity of the material accumulating in the fluidized bed cooler. When the quantity of the material in the cooler has reached a predetermined limit value, the supply of material into the fluidized bed cooler is prevented. The charge is cooled in the fluidized bed cooler by fluidization air and via heat transfer into a cooling liquid circulation system and the temperature of the charge is measured. The charge is removed when the temperature of the charge has fallen to a predetermined limit value. The second end (5) of a supply conduit (3) is provided with a supply valve (15) actuated by a power means (16). A discharge conduit (14) is provided with a discharge valve (17) actuated by a second power means (18). Quantity detection means (19, 20) are provided to produce quantity data regarding the amount of material in a fluidized bed space (11), and temperature measuring means (21) are provided to produce temperature data. A control device (22) controls the first power means (16) to open and close the supply valve (15) and the second power means (18) to open and close the discharge valve (17) on the basis of the quantity data and temperature data and the predetermined limit values of quantity and temperature so that the loading of material into the fluidized bed space and its cooling and removal from the fluidized bed space take place in a charge-by-charge and cyclic manner.

The present invention discloses an improved rotary forced-air cooler, which comprises a double layer trolley, a supporting beam structure, a material blocking proof air duct sealing plate arranged at the connecting part of the double layer trolley and an air supplying system, a double layer trolley unit static seal device and an air duct device. The supplying system structure is based on a rectangular beam, a triangle beam is arranged on the rectangular beam, and a plurality of ventilation channels are arranged on the bevel edge steel plates at the both waists; an air duct pipe is arranged on the air vent of the material blocking proof air duct sealing plate, an inclined plate inclining upwards from the air vent at the bottom part of the air duct pipe has a transition to a horizontal plate, a stopping ventilation fence is added to the air duct pipe at the side of the trolley; two rubber sealing parts with extended bottom edges are arranged at the outer sides of the lower parts of inner and outer sealing plates of the double layer trolley unit static seal device, an ash baffle plate which can move up and down is hung at the inner side; an air water sealing wave subduing device adopting a damping plate is arranged on the air duct device. The present invention further improves the sealing performance of the equipment, and reduces energy consumption and pollution.

A method of solidifying a steel-making slag is performed by subjecting a mixture of a steel-making slag containing at least about 50% by weight of a powdery steel-making slag having a particle size not greater than about 5 mm and a substance containing at least about 30% by weight of SiO2 (e.g., a fly ash and/or the fine powder of a granulated blast furnace slag) to a hydration reaction. The resulting solidified material contains at least about 20% of a tobermorite phase, has high strength and is suitable as an inorganic material useful as a roadbed material, building and civil engineering materials, etc.

The invention provides a low mass and size thermal focusing device for a gas phase analytical device. The device has two or more plates bonded together. The device also has at least one channel with an entrance and exit is formed within allowing ingress and egress of a gas stream. The device also has a temperature reduction module in thermal contact with at least one plate of the device. Thermal focusing devices with additional plates and/or channels are also disclosed.

A substrate thermal processing system. The system has at least one substrate holding module having a housing configured for holding an isolated environment therein. A substrate heater is located in the housing and has a substrate heating surface. A substrate cooler is located in the housing and having a substrate cooling surface. A gas feed opening into the housing and feeding inert or reducing gas into the housing when the substrate is heated by the heating surface. A gas restrictor is within the housing restricting the fed gas between the substrate heating surface and a surrounding atmospheric region substantially surrounding the substrate heating surface in the housing and forming an aperture through which the fed gas communicates with the atmospheric region.

An improved method and apparatus for cooling the under-car channel of a tunnel kiln while minimizing migration of air between the above-car and under-car channels involves controlling or equalizing the mass flow of cooling air directed through the under-car channel and in particular through individual undercarriage cooling zones which can match individual heating zones of the tunnel kiln.

An object of the present invention is to perform temperature setting of a heating plate so that a wafer is uniformly heated in an actual heat processing time. The temperature of a wafer is measured during a heat processing period from immediately after a temperature measuring wafer is mounted on the heating plate to the time when the actual heat processing time elapses. Whether the uniformity in temperature within the wafer is allowable or not is determined from the temperature of the wafer in the heat processing period, and if the determination result is negative, a correction value for a temperature setting parameter of the heating plate is calculated using a correction value calculation model from the measurement result, and the temperature setting parameter is changed.

A heat treatment table is divided into two or more regions, a heater is disposed for each region. On a predetermined portion of the heat treatment table, a plurality of sensors are disposed separately each other. A relation between temperatures of the respective portions on the heat treatment table and temperatures detected by the sensors is grasped in advance, thereby enables to surmise a temperature of the respective portion of the heat treatment table from the temperature detected by the sensors. In the case of an wafer being actually treated by placing on the heat treatment table, the temperatures detected by the sensors are observed, from these detected temperatures, the temperatures of the respective portions on the heat treatment table, that is, temperatures affecting the wafer, are surmised.