The invention relates to novel oxidizing-resistant nanometer
copper soldering paste and a preparation method and application thereof. By adopting a magnetron
sputtering process, the surface of nanometer
copper powder is evenly coated with a
metal film. Silver, gold and the like can be selected as the components of the
metal film as required; then a traditional nanometer
copper soldering paste formula continues to be used, a proper amount of forming auxiliaries are added; and finally, the novel oxidizing-resistant nanometer copper
soldering paste resistant to oxidizing and cracks is prepared. Compared with the prior art, according to the novel nanometer copper soldering paste, mutual connection between a
chip and a substrate can be achieved by means of a low-temperature
sintering process or a pressurizing low-temperature
sintering process, a traditional nanometer copper soldering paste function is achieved; and oxidizing resistance,
crack initiation resistance and an extending performance are achieved at the same time, the novel oxidizing-resistant nanometer copper soldering paste can be used in large-power high-temperature electronic device packaging, and is especially suitable for packaging of third-generation
semiconductor devices, after packaging, a connector is good in performance, fault-free service under high temperature can be achieved for a long time, and the novel nanometer copper soldering paste is matched with an existing lead-free solder packaging process.