37 results about "High temperature electronics" patented technology

The invention relates to a silicon nitride crystal based on high static nitrogen pressure and active nitrogen regulation and a growth method thereof. The silicon nitride crystal is prepared by the growth method, and the method adopts a physical gas phase transmission process and specifically comprises the following steps: introducing high static pressure nitrogen (1-3 bar) and trace NH3 / N2 mixed gas into source powder formed by mixing high-purity beta-Si3N4 and polycrystalline silicon, and dynamically maintaining the gas phase N / Si molar ratio to be (1.33 + / -0.1): 1, thereby inhibiting the decomposition of the source powder and stabilizing the crystal growth; carrying out spray granulation on the source powder, carrying out compression molding, placing the obtained product in a graphite crucible with the inner wall coated with TaC, and carrying out ordered epitaxial growth by controlling the temperature difference of a temperature zone at 1800-2000 DEG C and the axial temperature gradient; according to the method, the dislocation density and the carbon impurity content of the silicon nitride crystal can be remarkably reduced, then the high-purity silicon nitride crystal with a complete structure and a smooth surface is obtained, and the method is suitable for the fields of high-temperature electronic devices and deep ultraviolet light electronics.

A high temperature electronic device thermal management system. Data centers contain many large racks of computer servers with electronic devices that generate heat. For the devices to function properly, they must not exceed a maximum temperature. Typical techniques for thermal management of data center electronics involve using sub-ambient temperature coolants via refrigeration cycles, requiring significant input energy to operate. The present thermal management system includes a flow management system to produce elevated coolant temperatures while sustaining safe device temperatures. This allows the coolant to reject to ambient temperatures globally and year-round, enabling reduced energy usage by no longer requiring refrigeration cycles. Further, operation at or above 55°C would allow for implementation of additional waste heat recovery processes with increased energy efficiency.

The invention provides a heat-conducting insulating electromagnetic shielding composite material and a preparation method and application thereof, and belongs to the technical field of heat management. The composite material comprises a matrix Kevlar 1414 and a heat-conducting filler carbon nano tube, the Kevlar 1414 and the carbon nano tube are placed in a concentrated sulfuric acid medium, ultrasonic and mechanical stirring is carried out until uniform dispersion is achieved, a composite heat-conducting film is formed after drying and hot pressing, the in-plane heat conductivity of the composite heat-conducting film is 9.6 W / m.K to 23.8 W / m.K, and the in-plane heat conductivity of the composite heat-conducting film is 23.6 W / m.K to 23.8 W / m.K. The composite material can be used for heat dissipation of high-temperature electronic devices under extreme conditions, especially for COB lamp beads with the heat emission reaching 180 DEG C or above and the color temperature being 6000K. The Pi-Pi anchoring effect between the multi-walled carbon nanotubes and the Kevlar 1414 enhances the acting force at the interface of the matrix and the heat-conducting filler, so that the heat-conducting composite film has high heat conductivity, good machinability, high temperature resistance, flexibility, insulativity and electromagnetic shielding performance, and is suitable for application requirements of heat dissipation of highly-integrated and high-power electronic devices.

The present invention relates to the technical field of electronic tags and discloses a method for producing high-temperature-resistant electronic tags. A first sealant layer, a second sealant layer, and a third sealant layer having successively decreasing melting points are provided above a radio frequency chip of the electronic tag produced by the present invention, and the melting point of the lowest sealant layer is not less than 230 degrees. When the electronic tag produced by the present invention is continuously used in a high-temperature environment of 230 degrees or above, even if the third sealant layer and the second sealant layer melt and flow, the first sealant layer does not melt, thereby preventing damage and impact to the radio frequency chip caused by heat conduction and high temperature. Furthermore, because the first sealant layer remains in a solid state, the radio frequency chip can be prevented from falling off, thereby preventing the problem of failure or severe weakening of the tag performance due to high temperature.

A high temperature electronic device thermal management system. Data centers contain many large racks of computer servers with electronic devices that generate heat. For the devices to function properly, they must not exceed a maximum temperature. Typical techniques for thermal management of data center electronics involve using sub-ambient temperature coolants via refrigeration cycles, requiring significant input energy to operate. The present thermal management system includes a flow management system to produce elevated coolant temperatures while sustaining safe device temperatures. This allows the coolant to reject to ambient temperatures globally and year-round, enabling reduced energy usage by no longer requiring refrigeration cycles. Further, operation at or above 55° C. would allow for implementation of additional waste heat recovery processes with increased energy efficiency.

The present application relates to the technical field of high-temperature-resistant electronic components, and particularly relates to a high-temperature-resistant electronic component, which adopts the following technical scheme: a frame body is provided with a glue-filling sealed electromagnetic coil at the center of the frame body, and the frame body is made of high-temperature-resistant plastic material; a manufacturing process of the high-temperature-resistant electronic component comprises the following steps: S1, selecting a suitable coil body and an outer frame with a pin; S2, sealing the middle part of the coil body in the outer frame to provide mechanical support, heat dissipation and electrical connection; and S3, connecting the coil motor and the inner lead of the outer frame by using a fine metal wire (gold wire, aluminum wire or copper wire) to realize electrical conduction. The molten material in the discharge bucket can be dispersed into different cavities respectively, and the bubbles in the dispersed molten material are more easily extracted, so that the residual bubbles in the molten material are reduced.

The application relates to the field of charging equipment, in particular to a constant-temperature device and a constant-temperature control method for charging equipment, which comprises a circuit board, first components arranged on the circuit board, a heat dissipation assembly arranged on the circuit board, a mounting surface arranged on the heat dissipation assembly and perpendicular to the circuit board, high-temperature electronic components arranged on the mounting surface, a heat dissipation auxiliary assembly arranged on the heat dissipation assembly, the heat dissipation assembly comprises a plurality of heat dissipation fins arranged in layers, ventilation channels are formed between adjacent heat dissipation fins, a cover box is arranged on the mounting surface and covers all the high-temperature electronic components on the mounting surface, and a temperature sensor is arranged on the mounting surface and located in the cover box. The application has the effects of guaranteeing the working efficiency of the high-temperature electronic components and reducing the probability of damage to other components.

The invention discloses a 105 DEG C irradiation crosslinking low-smoke halogen-free flame-retardant polyolefin cable material for UL electronic wires and a preparation method thereof, and belongs to the technical field of cable material preparation. Polydimethyl-methyl vinyl-methyl beta-cyanoethyl polysiloxane rubber is matched with linear low-density polyethylene, an ethylene-octylene copolymer and an ethylene-vinyl acetate copolymer according to a reasonable proportion, so that the tensile property and the processability of the material are improved, and a prepared cable can pass an FT2 level combustion test; the flame-retardant cable material is low in smoke density and good in light transmittance and can be used for high-temperature-resistant electronic wire products, the strength of the cable material is greatly improved while the cable material keeps a good flame-retardant effect, the strength and the tensile property of a base material are greatly improved, and the compatibility between resin and resin and the compatibility between the resin and the flame retardant are improved through matched use of the compatilizer; the anti-aging performance is improved by compounding the antioxidant, and the material has outstanding high-temperature pressure performance and high flame retardance, and is simple in process, relatively low in cost, environment-friendly and energy-saving.

The invention discloses a method for regulating and controlling the thermal stability of a CuInP2S6 device based on a non-ferroelectric phase, which is characterized in that a method for regulating and controlling Cu ion defects and charge accumulation at an interface between a ferroelectric phase and a non-ferroelectric phase in a CuInP2S6 thin layer is adopted, and the thermal stability of the device is improved through a strong pinning effect. The method specifically comprises the following steps: preparing a CuInP2S6 thin layer, determining a phase change behavior and a strong pinning effect in the CuInP2S6 thin layer to promote the thermal stability of the CuInP2S6 thin layer, and the like. Compared with the prior art, the thermal stability of CuInP2S6 is remarkably improved, a new way is provided for development of controllable ferroelectric polarization switches and design of high-reliability and durable multifunctional devices, and the problem that in the prior art, the thermal stability of CIPS materials is insufficient in a high-temperature environment is effectively solved. Technical support is provided for application of the material in high-temperature electronic devices, and the material has a good application prospect.

The present invention relates to a high-temperature probe for a rotary steering system, and to the technical field of oil drilling equipment. The present invention includes a left suspended propeller, a pressure-resistant tube, a right suspended propeller, a battery pressure-resistant tube and a circuit board rack. The two ends of the pressure-resistant tube are respectively connected to the left suspended propeller and the right suspended propeller. The battery pressure-resistant tube is assembled at the other end of the right suspended propeller, and the circuit board rack is located in the pressure-resistant tube; a battery is arranged in the battery pressure-resistant tube, and an accelerometer, a temperature sensor, a flux gate, a filter circuit, an acquisition and transmission circuit, a single bus conversion circuit and a power supply control circuit are arranged on the circuit board rack. All electronic components in the high-temperature probe of the present invention are high-temperature resistant electronic components, which can adapt to the high-temperature environment underground, so that the probe can better perform drilling operations at deeper wells. At the same time, the probe of the present invention adds a battery. When the system is powered off, the battery can be seamlessly connected in time to energize the circuit of the probe to ensure the normal operation of the probe.

The invention provides ink for ink-jet printing, a flexible high-temperature-resistant electronic system and a preparation method of the flexible high-temperature-resistant electronic system. The material for preparing the ink is selected from at least one of ammonium molybdate, ammonium tungstate, ammonium niobate, niobium oxalate and tantalum ethoxide; a solvent for preparing the ink is a mixed solvent of at least three of water, propylene glycol, ethanol, ethylene glycol and isopropanol; the viscosity of the ink is less than 20 CPS, and the particle size of the solution is less than 1 [mu] m. According to the preparation method, an extreme temperature resistant circuit is directly printed on the surface of the flexible substrate through ink-jet printing and thermal annealing, precise manufacturing of a flexible electronic system with extreme temperature resistance, super-strong interface bonding energy and high light transmittance is achieved, and stress mismatch and microcrack formation of the electronic system in a high-temperature environment can be remarkably inhibited.

This invention relates to a cooling system for the secondary use of motor coolant and a hybrid vehicle. The cooling system includes a water tank. One outlet of the water tank is connected to the inlet of a three-way reversing valve via a low-temperature electronic water pump. Another outlet of the three-way reversing valve is connected in series with the cooling water circuits for the low-temperature and mid-temperature components, and then connected to one inlet of the three-way valve. The other outlet of the three-way reversing valve is connected to the other inlet of the three-way valve. The outlet of the three-way valve is connected to the cooling water circuit for the mid-temperature components, and then to the inlet of the water tank. The other outlet of the water tank is connected to the cooling water circuit for the high-temperature components via a high-temperature electronic water pump, and then to the inlet of the water tank. This invention uses a coupled design based on the coolant flow requirements of each temperature zone component. By reusing the motor coolant, it reduces the total coolant flow requirement of the hybrid vehicle while improving the efficiency of the hybrid vehicle's cooling system.

The invention belongs to the field of new energy power systems, pulse power technologies and high-temperature electronic devices, and particularly relates to tungsten bronze energy storage ceramic and a preparation method thereof.The tungsten bronze energy storage ceramic has the chemical formula of Gd < 0.03 > Ba < 0.47 > Sr < 0.485-1.5 x > Bi < x > NbO6, and x ranges from 0.02 to 0.06. The tungsten bronze energy storage ceramic has the energy storage density of 1.6-2.57 J / cm < 3 > and the energy storage efficiency of 75.36%-96.22% under the voltage of 215 kV / cm, and has an excellent energy storage coefficient (Wre / E = 0.012 J cm <-2 > kV <-1 >). And the requirement that the electronic capacitor operates in a low electric field at present is met.

The utility model relates to the technical field of universal testing machines, in particular to a high-temperature electronic universal testing machine, which provides a sealing environment for a test workpiece through a sealing device, reduces heat loss in the high-temperature operation process of equipment, and provides heat for an inner body of the sealing device through a heating device. The auxiliary device is matched with the heating device to quickly and uniformly distribute heat in the sealing device, so that the practicability of the device is improved; comprising a rack, a lifting platform, a sensor seat and a clamp mounting seat, the lifting platform is mounted in the rack, the lower end face of the lifting platform is connected with the sensor seat through a connecting rod, and the clamp mounting seat is mounted on the lower end face of the sensor seat; comprising a sealing device, a heating device and an auxiliary device, the sealing device is installed in a rack, the heating device is installed on the sealing device, and the auxiliary device is installed on the sealing device.

The invention belongs to the technical field of electronic materials, and particularly relates to thermocuring high-temperature-resistant electronic paste and a preparation method thereof.The electronic paste is prepared from, by weight, 35-45 parts of silane A, 1-2.25 parts of silane B, 1-5 parts of silane C, 25-35 parts of silica sol, 0.5-1 part of a pH regulator, 25-35 parts of a solvent A, 1-3 parts of a chain extender, 20-40 parts of a solvent B, 2-5 parts of glass powder and 22-44 parts of filler. The electronic paste prepared by the invention has good high temperature resistance, and can still maintain good electrical properties under a high temperature condition.

The invention discloses an aluminum nitride substrate with a low edge and angle cracking rate and a preparation method of the aluminum nitride substrate, and belongs to the technical field of aluminum nitride substrate preparation. The preparation method of the aluminum nitride substrate comprises the following steps that aluminum nitride powder and a composite sintering aid are mixed in proportion to prepare tape casting slurry, a green body is obtained through tape casting, the green body is put into a calcining furnace to be sintered after glue discharging treatment, a porous plate airflow screen is arranged at a hearth air inlet, and nitrogen flow, flow velocity and pressure are regulated and controlled in a staged mode. According to the preparation method, on the basis of improving the performance index of the substrate, the edge and corner cracking rate of the substrate is greatly reduced, the prepared aluminum nitride substrate has the characteristics of high heat conductivity, high density and low edge and corner cracking rate, and the requirements of electronic manufacturing fields such as high-temperature electronic devices and high-power module packaging on the high-performance aluminum nitride substrate are met.

The application discloses a ceramic coating material with high-temperature low infrared emissivity and a preparation method thereof, and belongs to the technical field of functional ceramic coating materials. 3+ The material is prepared by radius mismatch and charge compensation effects of A-site La, Pr, Sr and Ca quaternary ions, so that B-site manganese ions form Mn 4+ Mixed valence, activate double exchange effect, improve high-temperature electronic conductivity of the material on the basis of maintaining the stability of the main phase perovskite lattice, and induce the physical transformation of the material from an insulator to a metalloid phase; the strong shielding of high-concentration free carriers generated under the metalloid characteristics to the infrared band and the plasma oscillation reflection mechanism break the traditional law that the high-temperature infrared emissivity of ceramic increases with temperature, realize the significant reduction of the high-temperature infrared emissivity of the material, and obtain the ceramic with excellent high-temperature structural stability and infrared radiation regulation ability, which is suitable for infrared stealth protection and thermal characteristic management of high-temperature hot end components in the fields of aviation and spaceflight.

The utility model relates to the technical field of electronic tag processing, in particular to a coating head for a high-temperature-resistant electronic tag screening agent. According to the technical scheme, an arc-shaped baffle is arranged in an upper die head, a blocking piece is fixed in a material distribution cavity, the arc-shaped baffle can move into the material distribution cavity and abut against the blocking piece to block a material passing gap, discharging openings are formed in the two ends of the material passing gap of a lower die head, and through holes are formed in the two ends of the arc-shaped baffle. According to the utility model, the material passing gap is arranged in a blocking manner, so that the material passing gap is different in discharge quantity during operation in different areas, the coating mode of an electronic tag screening agent is better met, the discharge quantity can be controlled, and the situation that the material in the middle overflows to the edge to cause excessive material at the edge is prevented.

The invention discloses an n-type semiconductor polymer composite material with high environmental stability and a preparation method thereof. The method comprises the following steps: mixing a PBFDO solution with an ionic micromolecule additive solution to form a uniform precursor solution, forming a film from the precursor solution, and performing thermal annealing treatment in a nitrogen environment to obtain the PBFDO composite material. The PBFDO composite material disclosed by the invention has excellent environmental stability, thermal stability and high electronic conductivity, and can meet the strict requirements of organic thermoelectric and high-temperature electronic devices and the like on material stability.

The utility model relates to electronic connecting line technical field discloses a kind of high-temperature-resistant electronic connecting line, including core wire, the outside of the core wire is fixedly connected with high-temperature-resistant mechanism, the outside of the high-temperature-resistant mechanism is fixedly connected with fire-retardant mechanism;The high-temperature-resistant mechanism includes conducting component, the inside of the conducting component is fixedly connected in the outside of the core wire, the outside of the conducting component is fixedly connected with double-layer polyimide film belt, the inside of the double-layer polyimide film belt is fixedly connected with aluminium oxide filling layer, the outside of the double-layer polyimide film belt is fixedly connected with stainless steel wire braided cover, the outside of the aluminium oxide filling layer is fixedly connected with fluorine rubber outer layer.In the utility model, product can continuously work efficiently under high-temperature environment, greatly improve the service life and high-temperature-resistant ability of electronic connecting line, not only reduce cost, while effectively maintaining the flexibility of cable.

The invention discloses an adipic acid-sebacic acid binary eutectic phase change material and a preparation method thereof, and belongs to the field of phase change energy storage materials. The eutectic phase change material is composed of two compounds which are respectively adipic acid and sebacic acid. The eutectic phase change material with the melting point of 124.1 DEG C and the phase change enthalpy of 216.1 J / g is provided by adjusting the molar percentage of adipic acid and sebacic acid in a binary system, and the eutectic phase change material has potential application in the scenes of medium-high temperature electronic device heat management, mold temperature control, solar energy and industrial waste heat energy storage and the like. The adipic acid / sebacic acid eutectic phase-change material has the advantages that (1) the phase-change temperature of the prepared adipic acid / sebacic acid eutectic phase-change material is 124.1 DEG C, and the adipic acid / sebacic acid eutectic phase-change material is suitable for a thermal management scene of medium-high temperature electronic equipment; (2) the adipic acid / sebacic acid eutectic phase change material prepared by the method is homogeneous, free of phase separation and high in phase change enthalpy value; and (3) the preparation method provided by the invention is simple, green, environment-friendly and pollution-free.

The invention provides an aluminum nitride single crystal growth device and method based on near-suspended seed crystals, and the device and method are characterized in that after metal or a metal compound is deposited on the aluminum nitride single crystal seed crystals to form coated seed crystals, a high-temperature-resistant metal strip is bound on the surfaces of the coated seed crystals, so that the coated seed crystals suspend in the device; according to the invention, the coating seed crystal does not directly contact with the crucible wall, the mechanical stress between the coating seed crystal and the crucible wall is reduced, the stress concentration is further reduced, the heat resistance and the stability of the material are improved, the defect density in the crystal is obviously reduced, and a better thermal management effect is shown in a high-temperature environment. Besides, by accurately controlling the position and the temperature gradient of the coated seed crystal in the crucible, the seed crystal grows in a nearly suspended state, and the growth rate is stable, so that the growth environment of the crystal is greatly optimized, the aluminum nitride single crystal grows more close to a free state, and defects caused by fluctuation of growth conditions are avoided. According to the device and the method, the growth quality of the aluminum nitride single crystal is remarkably improved, the defect density is reduced, and the device and the method can be widely applied to growth of the high-quality aluminum nitride single crystal, are suitable for the fields of deep ultraviolet LEDs, lasers, high-power microwave devices, high-temperature electronic devices and the like, and are suitable for industrial popularization.

The invention discloses riveting pressure detection equipment for high-temperature-resistant electronic components, and relates to the technical field of detection, the riveting pressure detection equipment comprises a detection table, a speed reducer is mounted at the bottom of the detection table, a machine base is fixedly mounted on the outer side of the circumference of the speed reducer, a driving table is movably mounted on the surface of the detection table, and a limiting seat covers the surface of the driving table; a riveting detection mechanism is installed above the limiting seat, an intermittent transmission mechanism is installed on one side of the riveting detection mechanism, a transmission disc is arranged on the intermittent transmission mechanism, a rotating shaft is installed in the middle of the transmission disc, a bearing is installed on the outer side of the bottom of the rotating shaft, and meanwhile a bearing platform is movably installed at the bottom of the rotating shaft through the bearing. According to the riveting pressure detection equipment for the high-temperature-resistant electronic components, the four groups of component carrying tables can be switched for use; the components do not need to be manually placed and moved one by one, a large amount of time is saved, continuous and efficient detection operation can be achieved, and the detection number in unit time is greatly increased.

The utility model relates to the technical field of electronic devices, and discloses a water-cooled heat dissipation module, which comprises a water-cooled plate arranged on a high-temperature electronic device and provided with a water-cooled pipe groove, the water-cooled pipe groove is provided with a water outlet and a water inlet, and the height of the water outlet in the vertical direction is lower than that of the water inlet; the water cooling pipe is installed in the water cooling pipe groove in the water cooling plate, the water cooling pipe comprises a water inlet pipeline, the water inlet pipeline is arranged close to the upper surface of the high-temperature electronic device, the water inlet pipeline is provided with a water inlet end so that cooling liquid can flow into the water inlet pipeline, and the water inlet end is arranged at the water inlet; the connecting pipeline is communicated with the water inlet pipeline, the connecting pipeline at least comprises a top pipeline, the top pipeline is horizontally arranged close to the top of the water cooling plate, and the height of the top pipeline in the vertical direction is higher than that of the water inlet pipeline; the water outlet pipeline is communicated with the connecting pipeline, the end, communicated with the connecting pipeline, of the water outlet pipeline is higher than the water inlet pipeline, one water outlet end of the water outlet pipeline is located at the water outlet and lower than the water inlet pipeline, and the heat dissipation effect is good.

The present invention relates to a test device for the fire prevention performance of a tire, which includes a box body with an air flow hood provided on its side wall; a fire door; a carbon dioxide gas storage tank, which is arranged outside the box body and is connected to the air flow hood inside the box body through pipe fittings, and a pressure gauge and a flow switch are arranged on the pipe fittings; a ventilation window; a filter screen, which is arranged at a position flush with the ventilation window on the inner wall of the box body, and a conveyor belt is fixedly connected between the filter screen and the air flow hood; a measurement window and a viewing window are arranged on the same side wall of the box body, an infrared thermometer is arranged outside the measurement window, and a high-definition camera is arranged outside the viewing window; a sliding window is opened on the side wall of the box body, and a smoke sensor is arranged obliquely above it; a high-temperature electronic scale is arranged at the bottom of the box body and is connected to a computer through a data line; a K-type thermocouple. The test device for the fire prevention performance of the tire of the present invention can simulate the heat receiving conditions of each part during the operation of the tire by setting a high-definition camera and a K-type thermocouple, and the test data is accurate.

The invention relates to the field of reliable interconnection between carbon nanotube fiber bundles and metal wires, in particular to a carbon nanotube fiber bundle-metal wire connection method suitable for a space electric propulsion thermal control system. Comprising the following steps: (1) carrying out chemical nickel plating pretreatment and chemical nickel plating treatment on the ends of carbon nanotube fiber tows; (2) sealing the tube and carrying out heat treatment at 200-400 DEG C; (3) connecting the carbon nanotube fiber bundle with the nickel-plated layer with a metal wire in a lap joint or winding joint mode; and (4) welding the joint by adopting a micro spot welding process. According to the method, efficient connection is achieved through low-energy input, the contact resistance of a welding spot is smaller than or equal to 0.01 omega, and the welding spot can bear thermal shock of minus 40 DEG C to 180 DEG C for hundreds of times. The method solves the problems of poor interface wettability, unstable contact resistance, insufficient mechanical strength and the like of a carbon material and a metal material in a traditional welding method at high temperature, and is suitable for long-term stable application in extreme environments of aerospace thermal control systems, high-temperature electronic equipment and the like.

The invention relates to a high-temperature-resistant and recyclable TPEE film as well as a preparation method and application thereof, and belongs to the technical field of high-performance environment-friendly high polymer materials. The thermoplastic polyester elastomer composite material is composed of thermoplastic polyester elastomer (TPEE) matrix resin, a high-temperature-resistant reinforcing filler, a high-thermal-stability auxiliary agent and a recycled compatilizer. The TPEE resin with a specific structure is selected to be compounded with the high-temperature-resistant inorganic filler, and an efficient thermal stability and hydrolysis resistance system is introduced, so that the thermal deformation temperature (HDT) and the long-term thermal aging performance of the film are remarkably improved, and meanwhile, the thermoplastic nature of the TPEE is kept, so that excellent recyclability is realized. The mechanical property retention rate of the film after long-term use at 180 DEG C is greater than or equal to 85%, and the key performance attenuation rate of the film after at least three times of melting recovery processing is less than 15%, so that the technical problem that the material cannot be recovered due to traditional high-temperature-resistant modification is successfully solved. The film is particularly suitable for the fields of new energy automobile battery assembly insulation, high-temperature electronic tags, recyclable environment-friendly packaging, heat-resistant special fabrics and the like.

The utility model discloses a special high-temperature-resistant electronic wire for an automobile sensor, and relates to the field of electronic wires, the special high-temperature-resistant electronic wire comprises a flame-retardant wire harness tube, a wire clamping frame is arranged in the flame-retardant wire harness tube, a wire groove and a wire hole are formed in the surface of the wire clamping frame, and the inner wall of the wire groove and the inner wall of the wire hole are both slidably connected with wire cores; the outer side of the wire clamping frame is sleeved with a sealing insulating cylinder, the outer side of the sealing insulating cylinder is sleeved with an anti-cracking net pipe, and the anti-cracking net pipe is located on the inner side of the flame-retardant wire harness pipe. The cable cores are arranged in order through the wire grooves and the wire holes in the wire clamping frame, winding interference is avoided, the high temperature resistance is achieved, graphene particles filled between the anti-cracking net pipe and the flame-retardant wire harness pipe rapidly dissipate heat, the flame-retardant wire harness pipe made of the glass fiber material bears the high temperature, the anti-cracking net pipe made of the polyamide fiber material enhances the stability, and the protection effect is good. The sealing insulating cylinder prevents electrical short circuit and impurity invasion, the service life is prolonged, and the rubber elastic piece between the anti-cracking net pipe and the sealing insulating cylinder absorbs vibration energy.

The utility model discloses a GGH on -line cleaning device, including heat exchanger main part, the one side top of heat exchanger main part is fixedly connected with the air inlet channel, the top one side of air inlet channel is fixedly connected with high temperature pump, the output of high temperature pump is linked with the horizontal pipe, and the inner wall of horizontal pipe is linked with the high temperature resistance electronic tee bend valve, the bottom both sides of horizontal pipe all are linked with the spray pipe, and the outer wall of two spray pipes all is through the top of air inlet channel, the input of high temperature pump is linked with the catheter. The utility model discloses the cooperation of setting's air inlet channel, water tank, high temperature pump, catheter, horizontal pipe, high temperature resistance electronic tee bend valve and spray pipe can utilize high pressure water flow and carry out the washing to the deposit and the strong adhesion of pollutant and can effectively wash and clean, can also humidify the pollutant simultaneously, so that the influence of air current is avoided again and the quality of filter screen cleaning can be greatly improved.

The invention relates to the technical field of high-temperature-resistant electronic components, in particular to a high-temperature-resistant electronic component which adopts the following technical scheme that the high-temperature-resistant electronic component comprises a frame body, an electromagnetic coil sealed through glue pouring is installed at the center of the frame body, and the frame body is made of a high-temperature-resistant plastic material. Comprising the following steps: S1, selecting an adaptive coil main body and an outer frame with pins, S2, sealing the middle part of the coil main body in the outer frame, and providing mechanical support, heat dissipation and electrical connection; and S3, connecting the coil motor and the inner lead of the outer frame by using a thin metal wire (gold wire, aluminum wire or copper wire) to realize electrical conduction. According to the invention, molten materials in the discharging barrel can be dispersed and flow into different cavities, and bubbles in the dispersed molten materials can be extracted more easily, so that the residual bubbles in the molten materials are reduced.