16 results about "High temperature electronics" patented technology

The invention relates to a silicon nitride crystal based on high static nitrogen pressure and active nitrogen regulation and a growth method thereof. The silicon nitride crystal is prepared by the growth method, and the method adopts a physical gas phase transmission process and specifically comprises the following steps: introducing high static pressure nitrogen (1-3 bar) and trace NH3 / N2 mixed gas into source powder formed by mixing high-purity beta-Si3N4 and polycrystalline silicon, and dynamically maintaining the gas phase N / Si molar ratio to be (1.33 + / -0.1): 1, thereby inhibiting the decomposition of the source powder and stabilizing the crystal growth; carrying out spray granulation on the source powder, carrying out compression molding, placing the obtained product in a graphite crucible with the inner wall coated with TaC, and carrying out ordered epitaxial growth by controlling the temperature difference of a temperature zone at 1800-2000 DEG C and the axial temperature gradient; according to the method, the dislocation density and the carbon impurity content of the silicon nitride crystal can be remarkably reduced, then the high-purity silicon nitride crystal with a complete structure and a smooth surface is obtained, and the method is suitable for the fields of high-temperature electronic devices and deep ultraviolet light electronics.

The present application relates to the technical field of high-temperature-resistant electronic components, and particularly relates to a high-temperature-resistant electronic component, which adopts the following technical scheme: a frame body is provided with a glue-filling sealed electromagnetic coil at the center of the frame body, and the frame body is made of high-temperature-resistant plastic material; a manufacturing process of the high-temperature-resistant electronic component comprises the following steps: S1, selecting a suitable coil body and an outer frame with a pin; S2, sealing the middle part of the coil body in the outer frame to provide mechanical support, heat dissipation and electrical connection; and S3, connecting the coil motor and the inner lead of the outer frame by using a fine metal wire (gold wire, aluminum wire or copper wire) to realize electrical conduction. The molten material in the discharge bucket can be dispersed into different cavities respectively, and the bubbles in the dispersed molten material are more easily extracted, so that the residual bubbles in the molten material are reduced.

This invention relates to a cooling system for the secondary use of motor coolant and a hybrid vehicle. The cooling system includes a water tank. One outlet of the water tank is connected to the inlet of a three-way reversing valve via a low-temperature electronic water pump. Another outlet of the three-way reversing valve is connected in series with the cooling water circuits for the low-temperature and mid-temperature components, and then connected to one inlet of the three-way valve. The other outlet of the three-way reversing valve is connected to the other inlet of the three-way valve. The outlet of the three-way valve is connected to the cooling water circuit for the mid-temperature components, and then to the inlet of the water tank. The other outlet of the water tank is connected to the cooling water circuit for the high-temperature components via a high-temperature electronic water pump, and then to the inlet of the water tank. This invention uses a coupled design based on the coolant flow requirements of each temperature zone component. By reusing the motor coolant, it reduces the total coolant flow requirement of the hybrid vehicle while improving the efficiency of the hybrid vehicle's cooling system.

The invention discloses an aluminum nitride substrate with a low edge and angle cracking rate and a preparation method of the aluminum nitride substrate, and belongs to the technical field of aluminum nitride substrate preparation. The preparation method of the aluminum nitride substrate comprises the following steps that aluminum nitride powder and a composite sintering aid are mixed in proportion to prepare tape casting slurry, a green body is obtained through tape casting, the green body is put into a calcining furnace to be sintered after glue discharging treatment, a porous plate airflow screen is arranged at a hearth air inlet, and nitrogen flow, flow velocity and pressure are regulated and controlled in a staged mode. According to the preparation method, on the basis of improving the performance index of the substrate, the edge and corner cracking rate of the substrate is greatly reduced, the prepared aluminum nitride substrate has the characteristics of high heat conductivity, high density and low edge and corner cracking rate, and the requirements of electronic manufacturing fields such as high-temperature electronic devices and high-power module packaging on the high-performance aluminum nitride substrate are met.

The application discloses a ceramic coating material with high-temperature low infrared emissivity and a preparation method thereof, and belongs to the technical field of functional ceramic coating materials. 3+ The material is prepared by radius mismatch and charge compensation effects of A-site La, Pr, Sr and Ca quaternary ions, so that B-site manganese ions form Mn 4+ Mixed valence, activate double exchange effect, improve high-temperature electronic conductivity of the material on the basis of maintaining the stability of the main phase perovskite lattice, and induce the physical transformation of the material from an insulator to a metalloid phase; the strong shielding of high-concentration free carriers generated under the metalloid characteristics to the infrared band and the plasma oscillation reflection mechanism break the traditional law that the high-temperature infrared emissivity of ceramic increases with temperature, realize the significant reduction of the high-temperature infrared emissivity of the material, and obtain the ceramic with excellent high-temperature structural stability and infrared radiation regulation ability, which is suitable for infrared stealth protection and thermal characteristic management of high-temperature hot end components in the fields of aviation and spaceflight.

The invention discloses an n-type semiconductor polymer composite material with high environmental stability and a preparation method thereof. The method comprises the following steps: mixing a PBFDO solution with an ionic micromolecule additive solution to form a uniform precursor solution, forming a film from the precursor solution, and performing thermal annealing treatment in a nitrogen environment to obtain the PBFDO composite material. The PBFDO composite material disclosed by the invention has excellent environmental stability, thermal stability and high electronic conductivity, and can meet the strict requirements of organic thermoelectric and high-temperature electronic devices and the like on material stability.

The utility model relates to electronic connecting line technical field discloses a kind of high-temperature-resistant electronic connecting line, including core wire, the outside of the core wire is fixedly connected with high-temperature-resistant mechanism, the outside of the high-temperature-resistant mechanism is fixedly connected with fire-retardant mechanism;The high-temperature-resistant mechanism includes conducting component, the inside of the conducting component is fixedly connected in the outside of the core wire, the outside of the conducting component is fixedly connected with double-layer polyimide film belt, the inside of the double-layer polyimide film belt is fixedly connected with aluminium oxide filling layer, the outside of the double-layer polyimide film belt is fixedly connected with stainless steel wire braided cover, the outside of the aluminium oxide filling layer is fixedly connected with fluorine rubber outer layer.In the utility model, product can continuously work efficiently under high-temperature environment, greatly improve the service life and high-temperature-resistant ability of electronic connecting line, not only reduce cost, while effectively maintaining the flexibility of cable.

The invention discloses an adipic acid-sebacic acid binary eutectic phase change material and a preparation method thereof, and belongs to the field of phase change energy storage materials. The eutectic phase change material is composed of two compounds which are respectively adipic acid and sebacic acid. The eutectic phase change material with the melting point of 124.1 DEG C and the phase change enthalpy of 216.1 J / g is provided by adjusting the molar percentage of adipic acid and sebacic acid in a binary system, and the eutectic phase change material has potential application in the scenes of medium-high temperature electronic device heat management, mold temperature control, solar energy and industrial waste heat energy storage and the like. The adipic acid / sebacic acid eutectic phase-change material has the advantages that (1) the phase-change temperature of the prepared adipic acid / sebacic acid eutectic phase-change material is 124.1 DEG C, and the adipic acid / sebacic acid eutectic phase-change material is suitable for a thermal management scene of medium-high temperature electronic equipment; (2) the adipic acid / sebacic acid eutectic phase change material prepared by the method is homogeneous, free of phase separation and high in phase change enthalpy value; and (3) the preparation method provided by the invention is simple, green, environment-friendly and pollution-free.

The invention relates to the field of reliable interconnection between carbon nanotube fiber bundles and metal wires, in particular to a carbon nanotube fiber bundle-metal wire connection method suitable for a space electric propulsion thermal control system. Comprising the following steps: (1) carrying out chemical nickel plating pretreatment and chemical nickel plating treatment on the ends of carbon nanotube fiber tows; (2) sealing the tube and carrying out heat treatment at 200-400 DEG C; (3) connecting the carbon nanotube fiber bundle with the nickel-plated layer with a metal wire in a lap joint or winding joint mode; and (4) welding the joint by adopting a micro spot welding process. According to the method, efficient connection is achieved through low-energy input, the contact resistance of a welding spot is smaller than or equal to 0.01 omega, and the welding spot can bear thermal shock of minus 40 DEG C to 180 DEG C for hundreds of times. The method solves the problems of poor interface wettability, unstable contact resistance, insufficient mechanical strength and the like of a carbon material and a metal material in a traditional welding method at high temperature, and is suitable for long-term stable application in extreme environments of aerospace thermal control systems, high-temperature electronic equipment and the like.

The invention relates to a high-temperature-resistant and recyclable TPEE film as well as a preparation method and application thereof, and belongs to the technical field of high-performance environment-friendly high polymer materials. The thermoplastic polyester elastomer composite material is composed of thermoplastic polyester elastomer (TPEE) matrix resin, a high-temperature-resistant reinforcing filler, a high-thermal-stability auxiliary agent and a recycled compatilizer. The TPEE resin with a specific structure is selected to be compounded with the high-temperature-resistant inorganic filler, and an efficient thermal stability and hydrolysis resistance system is introduced, so that the thermal deformation temperature (HDT) and the long-term thermal aging performance of the film are remarkably improved, and meanwhile, the thermoplastic nature of the TPEE is kept, so that excellent recyclability is realized. The mechanical property retention rate of the film after long-term use at 180 DEG C is greater than or equal to 85%, and the key performance attenuation rate of the film after at least three times of melting recovery processing is less than 15%, so that the technical problem that the material cannot be recovered due to traditional high-temperature-resistant modification is successfully solved. The film is particularly suitable for the fields of new energy automobile battery assembly insulation, high-temperature electronic tags, recyclable environment-friendly packaging, heat-resistant special fabrics and the like.

The utility model discloses a special high-temperature-resistant electronic wire for an automobile sensor, and relates to the field of electronic wires, the special high-temperature-resistant electronic wire comprises a flame-retardant wire harness tube, a wire clamping frame is arranged in the flame-retardant wire harness tube, a wire groove and a wire hole are formed in the surface of the wire clamping frame, and the inner wall of the wire groove and the inner wall of the wire hole are both slidably connected with wire cores; the outer side of the wire clamping frame is sleeved with a sealing insulating cylinder, the outer side of the sealing insulating cylinder is sleeved with an anti-cracking net pipe, and the anti-cracking net pipe is located on the inner side of the flame-retardant wire harness pipe. The cable cores are arranged in order through the wire grooves and the wire holes in the wire clamping frame, winding interference is avoided, the high temperature resistance is achieved, graphene particles filled between the anti-cracking net pipe and the flame-retardant wire harness pipe rapidly dissipate heat, the flame-retardant wire harness pipe made of the glass fiber material bears the high temperature, the anti-cracking net pipe made of the polyamide fiber material enhances the stability, and the protection effect is good. The sealing insulating cylinder prevents electrical short circuit and impurity invasion, the service life is prolonged, and the rubber elastic piece between the anti-cracking net pipe and the sealing insulating cylinder absorbs vibration energy.

The utility model discloses a GGH on -line cleaning device, including heat exchanger main part, the one side top of heat exchanger main part is fixedly connected with the air inlet channel, the top one side of air inlet channel is fixedly connected with high temperature pump, the output of high temperature pump is linked with the horizontal pipe, and the inner wall of horizontal pipe is linked with the high temperature resistance electronic tee bend valve, the bottom both sides of horizontal pipe all are linked with the spray pipe, and the outer wall of two spray pipes all is through the top of air inlet channel, the input of high temperature pump is linked with the catheter. The utility model discloses the cooperation of setting's air inlet channel, water tank, high temperature pump, catheter, horizontal pipe, high temperature resistance electronic tee bend valve and spray pipe can utilize high pressure water flow and carry out the washing to the deposit and the strong adhesion of pollutant and can effectively wash and clean, can also humidify the pollutant simultaneously, so that the influence of air current is avoided again and the quality of filter screen cleaning can be greatly improved.

The invention relates to the technical field of high-temperature-resistant electronic components, in particular to a high-temperature-resistant electronic component which adopts the following technical scheme that the high-temperature-resistant electronic component comprises a frame body, an electromagnetic coil sealed through glue pouring is installed at the center of the frame body, and the frame body is made of a high-temperature-resistant plastic material. Comprising the following steps: S1, selecting an adaptive coil main body and an outer frame with pins, S2, sealing the middle part of the coil main body in the outer frame, and providing mechanical support, heat dissipation and electrical connection; and S3, connecting the coil motor and the inner lead of the outer frame by using a thin metal wire (gold wire, aluminum wire or copper wire) to realize electrical conduction. According to the invention, molten materials in the discharging barrel can be dispersed and flow into different cavities, and bubbles in the dispersed molten materials can be extracted more easily, so that the residual bubbles in the molten materials are reduced.

The present application relates to the field of reliable interconnection between carbon nanotube fiber tows and metal wires, in particular to a carbon nanotube fiber tow-metal wire connecting method suitable for space electric propulsion thermal control system, comprising the following steps: (1) chemical nickel plating pretreatment and chemical nickel plating treatment on the end of carbon nanotube fiber tow; (2) sealing tube and performing 200-400 DEG C heat treatment; (3) connecting the carbon nanotube fiber tow with nickel plating layer and metal wire through lap joint or winding joint mode; (4) welding the joint by micro spot welding process. The method realizes efficient connection through low energy input, the welding spot contact resistance is less than or equal to 0.01 Ω, and can withstand 100 times -40-180 DEG C thermal shock. The present application solves the problems of poor interface wettability, unstable contact resistance and insufficient mechanical strength of carbon material and metal material at high temperature by traditional welding method, and is suitable for long-term stable application in extreme environment such as aerospace thermal control system and high temperature electronic equipment.

The utility model relates to the technical field of electronic adhesive tapes, in particular to a flame-retardant high-temperature-resistant electronic adhesive tape, which comprises a base surface layer, backing paper is glued on the lower surface of the base surface layer, a flame-retardant layer is glued on the upper surface of the base surface layer, the flame-retardant layer is a polyimide layer, a high-temperature-resistant layer is glued on the upper surface of the flame-retardant layer, and the high-temperature-resistant layer is a polyimide layer. The high-temperature-resistant layer is a glass fiber cloth layer, two tearing seams are formed in the surface of the base face layer, the upper surface of the high-temperature-resistant layer is coated with a coating layer, the coating layer is a magnesium hydroxide coating, a plurality of round holes are formed in the surface of the high-temperature-resistant layer, and a puncture-resistant layer is embedded in the flame-retardant layer. Through the arrangement of the structure, the flame-retardant and high-temperature-resistant performance of the electronic adhesive tape is improved, the possibility of fire disasters can be effectively reduced, the spreading of combustion can be slowed down or prevented even if the electronic adhesive tape encounters a fire source under an unexpected condition, time is won for taking fire extinguishing measures, and the use performance of the electronic adhesive tape is improved to a certain extent.

This invention belongs to the technical field of advanced ceramic materials and high-temperature electrical insulation materials, and relates to a high-temperature electrical insulating alumina ceramic with a high-density grain boundary network, its preparation method, and its application. This alumina ceramic has a relative density of not less than 99.5% and an average grain size of less than or equal to 0.53 μm. High-purity nanomaterials are used. α Using alumina powder as raw material, a homogeneous, high-density green body is obtained through dispersant dispersion, pH adjustment, high-solids slurry control, and centrifugal casting. This green body is then subjected to a three-step pressureless sintering process, prioritizing re-homogenization, to obtain a highly dense, fine-grained alumina ceramic. This alumina ceramic, without the introduction of additional sintering aids, dopants, or a high-resistivity second phase, forms a high-density grain boundary network, which is beneficial for suppressing high-temperature carrier migration across grain boundaries. Compared to coarse-grained alumina ceramics, it exhibits higher volume resistivity and electrical insulation stability in the temperature range from room temperature to 400°C, making it suitable for high-temperature electrical insulation components such as nuclear detectors, high-temperature electronic devices, and sensors.