Preparation method of silicon dioxide/silver core-shell composite powder for high temperature electronic paste

A silica, electronic slurry technology, applied in cable/conductor manufacturing, circuits, electrical components, etc., can solve the problems of wide particle size distribution, difficult to control sintering, powder pollution, etc. Good, high solids results

Active Publication Date: 2013-08-07
昆明高聚科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Reduction reaction rate is fast; therefore difficult to control and produces powder contaminated with residual alkali metal ions
Although the particle size of these powders is small, these powders are irregular

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] (1) According to the volume ratio of water: ethanol: ethyl orthosilicate: ammonia water is 40:2:45:5, after mixing analytical pure ammonia water, analytical pure ethanol, water and analytical pure ethyl orthosilicate, at room temperature Stir for 16 hours to obtain silica nanoparticles, then add nitric acid solution to adjust the pH value to 4, and continue to stir for 120 minutes, after centrifugal cleaning, obtain surface-modified silica microspheres;

[0020] (2) Ultrasonically disperse the surface-modified silica microspheres obtained in step (1) into water, then add a stannous chloride solution with a concentration of 0.5mol / L, stir for 50 minutes, and then redisperse to water; under ultrasonic conditions, add silica microspheres to 0.25mol / L silver ammonia solution for immersion for 15 minutes, and then centrifuge to form a layer of silver nanoparticles on the surface of silica microspheres;

[0021] (3) Disperse the silica microspheres obtained in step (2) into 0...

Embodiment 2

[0024] (1) According to the volume ratio of water: ethanol: ethyl orthosilicate: ammonia water is 50:10:35:2, after mixing analytical pure ammonia water, analytical pure ethanol, water and analytical pure ethyl orthosilicate, at room temperature Stir for 12 hours to obtain silica nanoparticles, then add nitric acid solution to adjust the pH value to 6, and continue to stir for 90 minutes, and after centrifugal cleaning, obtain surface-modified silica microspheres;

[0025] (2) Ultrasonic disperse the surface-modified silica microspheres obtained in step (1) into water, then add a stannous chloride solution with a concentration of 0.15mol / L, stir for 60 minutes, and then re-disperse to water; under ultrasonic conditions, add silica microspheres to 0.05mol / L silver ammonia solution for immersion for 30 minutes, and then centrifuge to form a layer of silver nanoparticles on the surface of silica microspheres;

[0026] (3) Disperse the silica microspheres obtained in step (2) into...

Embodiment 3

[0029] (1) According to the volume ratio of water: ethanol: ethyl orthosilicate: ammonia water is 60:8:25:10, after mixing analytical pure ammonia water, analytical pure ethanol, water and analytical pure ethyl orthosilicate, at room temperature Stir for 10 hours to obtain silica nanoparticles, then add nitric acid solution to adjust the pH value to 5, and continue to stir for 70 minutes, and after centrifugal cleaning, obtain surface-modified silica microspheres;

[0030] (2) Ultrasonic disperse the surface-modified silica microspheres obtained in step (1) into water, then add a stannous chloride solution with a concentration of 0.75mol / L, stir for 30 minutes, and then re-disperse to water; under ultrasonic conditions, add silica microspheres to 0.15mol / L silver ammonia solution for immersion for 20 minutes, and then centrifuge to form a layer of silver nanoparticles on the surface of silica microspheres;

[0031] (3) Disperse the silica microspheres obtained in step (2) into...

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PUM

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Abstract

The invention provides a preparation method of silicon dioxide/silver core-shell composite powder for high temperature electronic paste and belongs to the technical field of electronic paste. The preparation method includes: manufacturing silicon dioxide nano-particles firstly, adding a hydrogen nitrate solution to adjust pH value, adding a stannous chloride solution after centrifugal cleaning, adding silicon dioxide microspheres in a silver ammonia solution to be soaked under the condition of ultrasound and then performing centrifugal separation, and enabling a layer of silver nano-particles to be generated on the surfaces of the silicon dioxide microspheres; adding silver nitrate and a dispersing agent under the condition of stirring, and then adding ascorbic acid to obtain silver-plated silicon dioxide composite powder; and removing reaction residues by using a deionized water centrifugal sedimentation and ultrasonic dispersion cycle cleaning mode to obtained the silicon dioxide/silver core-shell composite powder. The preparation method of the silicon dioxide/silver core-shell composite powder for the high temperature electronic paste is simple to operate and low in cost, and particles obtained by the preparation method are remarkable in core-shell structure, even in particle size, high in solid content, ordered in height, good in dispersity and have various application prospects in the aspects of biological sterilization, chemistry, optical materials, electronic paste and the like.

Description

technical field [0001] The invention relates to an improved method for preparing highly dispersible spherical silver particles, in particular to a method for preparing silicon dioxide / silver core-shell composite powder for high-temperature electronic paste, and belongs to the technical field of electronic paste. Background technique [0002] Silver powder can be used in the electronics industry to manufacture conductive thick film paste. The thick-film paste is screen-printed on the substrate to form a pattern of conductive lines, and then these lines are dried and fired to evaporate the liquid organic carrier, and then the silver particles are sintered. [0003] Printed wiring technology requires denser and more precise electronic circuits. To meet these requirements, the width of the conductors has become narrower, and the spacing between the conductors has also been reduced. The silver powder needed to form dense close-packed fine lines must be as close as possible to a ...

Claims

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Application Information

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IPC IPC(8): B22F9/24B22F1/02C23C18/44H01B13/00H01B5/14
Inventor 黄惠黄茜
Owner 昆明高聚科技有限公司
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