Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of silicon dioxide/silver core-shell composite powder for high temperature electronic paste

A silica, electronic slurry technology, applied in cable/conductor manufacturing, circuits, electrical components, etc., can solve the problems of wide particle size distribution, difficult to control sintering, powder pollution, etc. Good, high solids results

Active Publication Date: 2013-08-07
昆明高聚科技有限公司
View PDF4 Cites 25 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Reduction reaction rate is fast; therefore difficult to control and produces powder contaminated with residual alkali metal ions
Although the particle size of these powders is small, these powders are irregular in shape with a wide particle size distribution and cannot be packed well
These types of silver powders show difficulty in controlling sintering and insufficient resolution of wires in thick film conductor lines

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] (1) According to the volume ratio of water: ethanol: ethyl orthosilicate: ammonia water is 40:2:45:5, after mixing analytical pure ammonia water, analytical pure ethanol, water and analytical pure ethyl orthosilicate, at room temperature Stir for 16 hours to obtain silica nanoparticles, then add nitric acid solution to adjust the pH value to 4, and continue to stir for 120 minutes, after centrifugal cleaning, obtain surface-modified silica microspheres;

[0020] (2) Ultrasonically disperse the surface-modified silica microspheres obtained in step (1) into water, then add a stannous chloride solution with a concentration of 0.5mol / L, stir for 50 minutes, and then redisperse to water; under ultrasonic conditions, add silica microspheres to 0.25mol / L silver ammonia solution for immersion for 15 minutes, and then centrifuge to form a layer of silver nanoparticles on the surface of silica microspheres;

[0021] (3) Disperse the silica microspheres obtained in step (2) into 0...

Embodiment 2

[0024] (1) According to the volume ratio of water: ethanol: ethyl orthosilicate: ammonia water is 50:10:35:2, after mixing analytical pure ammonia water, analytical pure ethanol, water and analytical pure ethyl orthosilicate, at room temperature Stir for 12 hours to obtain silica nanoparticles, then add nitric acid solution to adjust the pH value to 6, and continue to stir for 90 minutes, and after centrifugal cleaning, obtain surface-modified silica microspheres;

[0025] (2) Ultrasonic disperse the surface-modified silica microspheres obtained in step (1) into water, then add a stannous chloride solution with a concentration of 0.15mol / L, stir for 60 minutes, and then re-disperse to water; under ultrasonic conditions, add silica microspheres to 0.05mol / L silver ammonia solution for immersion for 30 minutes, and then centrifuge to form a layer of silver nanoparticles on the surface of silica microspheres;

[0026] (3) Disperse the silica microspheres obtained in step (2) into...

Embodiment 3

[0029] (1) According to the volume ratio of water: ethanol: ethyl orthosilicate: ammonia water is 60:8:25:10, after mixing analytical pure ammonia water, analytical pure ethanol, water and analytical pure ethyl orthosilicate, at room temperature Stir for 10 hours to obtain silica nanoparticles, then add nitric acid solution to adjust the pH value to 5, and continue to stir for 70 minutes, and after centrifugal cleaning, obtain surface-modified silica microspheres;

[0030] (2) Ultrasonic disperse the surface-modified silica microspheres obtained in step (1) into water, then add a stannous chloride solution with a concentration of 0.75mol / L, stir for 30 minutes, and then re-disperse to water; under ultrasonic conditions, add silica microspheres to 0.15mol / L silver ammonia solution for immersion for 20 minutes, and then centrifuge to form a layer of silver nanoparticles on the surface of silica microspheres;

[0031] (3) Disperse the silica microspheres obtained in step (2) into...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a preparation method of silicon dioxide / silver core-shell composite powder for high temperature electronic paste and belongs to the technical field of electronic paste. The preparation method includes: manufacturing silicon dioxide nano-particles firstly, adding a hydrogen nitrate solution to adjust pH value, adding a stannous chloride solution after centrifugal cleaning, adding silicon dioxide microspheres in a silver ammonia solution to be soaked under the condition of ultrasound and then performing centrifugal separation, and enabling a layer of silver nano-particles to be generated on the surfaces of the silicon dioxide microspheres; adding silver nitrate and a dispersing agent under the condition of stirring, and then adding ascorbic acid to obtain silver-plated silicon dioxide composite powder; and removing reaction residues by using a deionized water centrifugal sedimentation and ultrasonic dispersion cycle cleaning mode to obtained the silicon dioxide / silver core-shell composite powder. The preparation method of the silicon dioxide / silver core-shell composite powder for the high temperature electronic paste is simple to operate and low in cost, and particles obtained by the preparation method are remarkable in core-shell structure, even in particle size, high in solid content, ordered in height, good in dispersity and have various application prospects in the aspects of biological sterilization, chemistry, optical materials, electronic paste and the like.

Description

technical field [0001] The invention relates to an improved method for preparing highly dispersible spherical silver particles, in particular to a method for preparing silicon dioxide / silver core-shell composite powder for high-temperature electronic paste, and belongs to the technical field of electronic paste. Background technique [0002] Silver powder can be used in the electronics industry to manufacture conductive thick film paste. The thick-film paste is screen-printed on the substrate to form a pattern of conductive lines, and then these lines are dried and fired to evaporate the liquid organic carrier, and then the silver particles are sintered. [0003] Printed wiring technology requires denser and more precise electronic circuits. To meet these requirements, the width of the conductors has become narrower, and the spacing between the conductors has also been reduced. The silver powder needed to form dense close-packed fine lines must be as close as possible to a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B22F9/24B22F1/02C23C18/44H01B13/00H01B5/14
Inventor 黄惠黄茜
Owner 昆明高聚科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com