Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Single-component temperature-resistant heat-conducting silicon mud composition and preparation method thereof

A heat-conducting silicon and composition technology, applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems of temperature resistance, low cross-linking degree, etc., and achieve high thermal conductivity, flame retardancy, and low volatility , to protect the effect of stable operation

Active Publication Date: 2020-04-10
CHENGDU GUIBAO SCI & TECH
View PDF11 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent ZL00125756.0 "Single-component organic heat-conducting cement" belongs to the epoxy resin system and is mainly used in heat tracing systems of transportation pipelines; patent CN106085252A "A heat-conducting cement and its preparation method and application" discloses a heat-conducting cement And the preparation method, the base material contains high-temperature-resistant inorganic glue, which belongs to the non-additive silicone system, the heat-conducting glue provided by the invention has high strength and high temperature resistance, and is used for heat tracing pipes and equipment, and does not involve heat dissipation for electronic products; Patent CN107043541A "Thermal Conductive Silicone Gel Composition and Its Preparation Method" discloses a thermally conductive silicone gel composition and its preparation scheme, which involves the selection of basic polymers, the modification of thermally conductive materials, and the gel with low crosslinking degree, which is used in electronic appliances The heat dissipation filling, without mentioning its temperature resistance performance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Single-component temperature-resistant heat-conducting silicon mud composition and preparation method thereof
  • Single-component temperature-resistant heat-conducting silicon mud composition and preparation method thereof
  • Single-component temperature-resistant heat-conducting silicon mud composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] Dry 800 parts by mass of alumina with an average particle size of 10 μm, 80 parts by mass of zinc oxide with an average particle size of 0.2 μm, 40 parts by mass of boron nitride with an average particle size of 25 μm, and 60 parts by mass of aluminum hydroxide at a high temperature of 110 ° C. After 1 hour, transfer to a high-speed mixer for mixing, and then use 5 parts by mass of dodecyltrimethoxysilane to spray in for modification treatment for 1 hour to obtain a mixed powder.

[0069] 50 parts by mass of vinyl-terminated polydimethylsiloxane with a viscosity of 100 mPa·s, 50 parts by mass of vinyl-terminated polymethylphenylsiloxane with a viscosity of 500 mPa·s, mixed powder and kneaded for high temperature dehydration at 115°C Treated for 1h to obtain the base material.

[0070] Add 3 parts by mass of No. 1 temperature resistance additive in Table 2, 2.5 parts by mass of crosslinking agent No. 1 in Table 1, 0.2 parts by mass of tetramethyltetravinylcyclotetrasilox...

Embodiment 2

[0072] 750 parts by mass of alumina with an average particle size of 8 μm, 50 parts by mass of zinc oxide with an average particle size of 0.2 μm, 50 parts by mass of aluminum nitride with an average particle size of 15 μm, and 20 parts by mass of a modified nitrogen-phosphorus flame retardant at high temperature Dry at 110° C. for 1.5 h, transfer to a high-speed mixer for mixing, and then use 6 parts by mass of the compounded silane coupling agent to spray in for modification treatment for 1 h to obtain a mixed powder.

[0073] 50 parts by mass of vinyl-terminated polymethylphenylsiloxane with a viscosity of 100mPa·s, 50 parts by mass of vinyl-terminated polymethylphenylsiloxane with a viscosity of 500mPa·s, and kneading the mixed powder at a high temperature of 115°C After dehydration treatment for 1 h, the base material was obtained.

[0074] Add 4 parts by mass of No. 2 temperature resistance additive in Table 2, 3 parts by mass of crosslinking agent No. 2 in Table 1, 0.15...

Embodiment 3

[0076] Dry 1000 parts by mass of alumina with an average particle size of 6.5 μm, 50 parts by mass of zinc oxide with an average particle size of 0.2 μm, and 30 parts by mass of a modified nitrogen-phosphorus flame retardant at a high temperature of 110 °C for 1 hour, transfer to a high-speed mixer for mixing, Then, 6 parts by mass of the compounded silane coupling agent was sprayed in for modification treatment for 1.5 hours to obtain a mixed powder.

[0077] 70 parts by mass of vinyl-terminated polydimethylsiloxane with a viscosity of 100 mPa·s, 30 parts by mass of vinyl-terminated polydimethylsiloxane with a viscosity of 500 mPa·s, mixed powder and kneaded for high temperature dehydration at 115°C 1h, the base material was obtained.

[0078] Add 6 parts by mass of No. 3 temperature resistance additive in Table 2, 4 parts by mass of crosslinking agent No. 3 in Table 1, 0.3 parts by mass of tetramethyltetravinylcyclotetrasiloxane inhibitor and The concentration is 1500ppm te...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Consistencyaaaaaaaaaa
Login to View More

Abstract

The invention discloses a single-component temperature-resistant heat-conducting silicon mud composition and a preparation method thereof. The single-component temperature-resistant heat-conducting silicon mud composition is prepared from the following raw materials in parts by weight: 100 parts of vinyl polysiloxane, 0.5-6 parts of a cross-linking agent, 100-1300 parts of a heat-conducting filler, 5-100 parts of a flame retardant material, 0.1-8 parts of a silane coupling agent, 1-12 parts of a temperature-resistant auxiliary agent, 0.01-0.5 parts of an inhibitor, and 0.1-0.9 parts of a platinum catalyst. The single-component temperature-resistant heat-conducting silicon mud composition is addition-type heat-conducting cement gum with low cross-linking degree, has low volatility and long-term resistance to the temperature of 230 DEG C without drying compared with general heat-conducting silicone grease and heat-conducting gel, and can be used for heat management of ultra-high-temperature electronic devices. The composition has high thermal conductivity and flame retardancy, and can be used for heat dissipation of high-power devices to protect the stable operation of the devices.

Description

technical field [0001] The invention belongs to the field of organosilicon materials, and in particular relates to a single-component temperature-resistant and heat-conducting silicon mud composition and a preparation method of the temperature-resistant and heat-conducting silicon mud composition. Background technique [0002] In recent years, with the rapid growth of the electronic information industry, electronic products are rapidly becoming lightweight, miniaturized, and high-performance. It requires high-density installation of circuit boards and electronic components, among which high-power modules have higher heat generation. Therefore, high thermal conductivity interface materials are required to assist in heat dissipation. Thermally conductive interface materials currently used in electronic products include thermally conductive silicone grease, thermally conductive silicone sheets, double-sided tapes, thermally conductive adhesives, thermally conductive gels, etc.,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L83/07C08L83/05C08L83/08C08K13/06C08K9/06C08K3/22C08K3/38C09K5/14
CPCC08L83/04C09K5/14C08L2201/02C08L2201/08C08L2205/025C08L2205/03C08K2003/2227C08K2003/2296C08K2003/385C08K2003/282C08L83/08C08K13/06C08K9/06C08K3/22C08K3/38C08K3/28
Inventor 王有治雷震涂程沈义聪王天强黄强
Owner CHENGDU GUIBAO SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com