The invention discloses a high and low temperature resistant
organosilicon gel and a preparation method thereof, the
organosilicon gel comprises a component A and a component B, the component A is prepared by mixing 100 parts of vinyl-terminated
silicone oil and 0.05-0.2 part of a
platinum catalyst, and the component B is prepared by mixing 50-70 parts of vinyl-terminated
silicone oil, 20-40 parts of a chain
extender, 5-15 parts of a cross-linking agent, 0.05-0.2 part of an inhibitor and 0.05-0.3 part of a heat-resistant additive. The organic
silicon gel disclosed by the invention is low in
viscosity, good in fluidity, colorless and transparent, good in flexibility and
low stress after being cured, good in adhesion effect on various base materials, excellent in electric insulativity and high and low
temperature resistance, capable of tolerating a high temperature of 240 DEG C for a long time, and free of
chain segment crystallization behavior at a low temperature of-77 DEG C. The organic
silicon gel is used for packaging protection of various different substrates and electronic components, the reliability and the service life of the components, high-power
semiconductor modules and the like at high temperature can be remarkably improved, and the reliability of
electronic equipment is guaranteed.