Halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive and preparation method thereof

A technology of silicone and potting glue

Active Publication Date: 2010-06-16
SOUTH CHINA UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, although there are some domestic research reports on halogen-free flame-retardant and heat-conducting potting compounds, most of them focus on a single heat-conducting or flame-retardant
For example, Chinese patent application CN 101054057A discloses a high thermal conductivity silicone potting compound, and CN 101407635A discloses an addition-type thermal conductive silicone rubber with excellent fluidity and high thermal conductivity, but neither of these two patents mentions silicon

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Weigh 200 parts by weight of aluminum oxide and add it into a high-speed kneader, and slowly add 1 part by weight of isopropyl distearoyloxyaluminate completely dissolved in white oil in advance under the condition of high-speed stirring. Then heat up to 120°C and continue to stir at high speed for 2 hours, discharge the material, put the obtained filler in a vacuum drying oven to remove the residual white oil, and sieve to obtain isopropyl distearoyl aluminum with an average particle size of 5 μm Ester surface treated aluminum oxide.

[0031] Weigh 200 parts by weight of aluminum hydroxide and add it into a high-speed kneader, slowly add 1 part by weight of γ-methacryloxypropyl trimethoxysilane diluted with ethanol alcohol solution of water in advance under the condition of high-speed stirring, drop After the addition, raise the temperature to 120°C and continue stirring at high speed for 2 hours, discharge the material, put the obtained filler in a vacuum drying oven ...

Embodiment 2

[0036] The preparation method and conditions of the halogen-free flame-retardant heat-conducting silicone electronic potting compound of the present invention are as in Example 1, and the heat-conducting filler is changed to the average The average particle diameter of 105 parts by weight of aluminum oxide with a particle diameter of 5 μm and the surface treatment of the coupling agent isopropyl distearoyloxyaluminate (using the same surface treatment method as in Example 1) is 19 μm Using 35 parts by weight of Al2O3, a halogen-free flame-retardant and heat-conducting silicone electronic potting compound was prepared, and the performance test results are shown in Table 1. It can be seen that compared with Example 1, its thermal conductivity increased from 0.65W / m K to 0.75W / m K, while other properties did not change much. It can be seen that the compounding of fillers with different particle sizes is beneficial to improve Thermal conductivity of potting compound.

Embodiment 3

[0038]The preparation method and conditions of the halogen-free flame-retardant heat-conducting silicone electronic potting compound of the present invention are as in Example 1, and the vinyl polydimethylsiloxane is changed to a polydimethylsiloxane with a viscosity of 300mPa·s and a vinyl content of 0.72wt%. Straight-chain vinyl polydimethylsiloxane, correspondingly increase the hydrogen-containing silicone oil crosslinking agent with a hydrogen content of 0.5% to 5.6 parts by weight to prepare a halogen-free flame-retardant and heat-conducting silicone electronic potting compound, performance test The results are shown in Table 1. It can be seen that compared with Examples 1 and 2, although the thermal conductivity of the encapsulant is reduced, its fluidity is significantly improved, and its viscosity is only 2600 mPa·s.

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Abstract

The invention discloses a halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive and a preparation method thereof. The preparation method comprises: adding vinyl dimethicone, a reinforcing material, a heat-conducting filling material and a halogen-free flame retardant in a vacuum kneader, dehydrating and blending for 30-120 minutes at 100-150 DEG C and vacuum degree of 0.06-0.1MPa to obtain a base material, adding a cross-linking agent containing hydrogen silicone oil and a cross-linking inhibitor to the base material at the normal temperature, adequately agitating for 10-30 minutes to prepare a component A; adding a platinum catalyst to the base material, adequately agitating for 10-30 minutes to prepare a component B; taking the component A and the component B of the same parts by weight, blending uniformly, and deaerating for 5-10 minutes at the vacuum degree of 0.06-0.1MPa to obtain the halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive. The potting adhesive has good flow properties and convenient use and can be cured at the normal temperature or a high temperature, condensate has excellent flame retardant property and heat-conducting property, and the potting adhesive can be widely applied to the fields of electronic electric appliance, chip encapsulation and LED encapsulation, and the like.

Description

technical field [0001] The invention relates to the technical field of electronic potting materials, in particular to a halogen-free flame-retardant heat-conducting silicone electronic potting compound and its preparation technology. Background technique [0002] With the further realization of high performance, high reliability and miniaturization in electronic components, power circuit modules, large integrated circuit boards, LED and other high-tech fields, and the harsher working environment, it is required that the potting parts must be between low temperature and high temperature, Operating under conditions such as high-speed rotation requires potting materials not only to have excellent high and low temperature resistance, mechanical properties, electrical insulation properties, etc., but also to have good thermal conductivity and flame retardancy. [0003] At present, the most widely used potting materials are various synthetic polymers, among which epoxy resin, poly...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K9/04C08K3/22C08K3/38C09K3/10
Inventor 曾幸荣陈精华胡新嵩林晓丹李国一李豫黄德裕
Owner SOUTH CHINA UNIV OF TECH
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