Photo-curing and thermal curing heat-resistant conductive adhesive material and preparation method thereof

A heat-curing, conductive adhesive technology, used in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of limitation, UV light cannot penetrate, and conductive adhesive materials are not fully cured, so as to reduce the preparation cost, The effect of excellent thermal stability and excellent electrical properties

Inactive Publication Date: 2016-08-31
JIN BAOLI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although photocuring technology has many advantages, the photocuring technology applied to conductive adhesives must take into account the opacity of the conductive filler, which is the main component of the conductive adhesive. During use, UV light cannot penetrate the conductive adhesive material, causing the conductive adhesive material to cure. Incomplete, making light curing technology subject to certain restrictions in the field of conductive adhesives

Method used

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  • Photo-curing and thermal curing heat-resistant conductive adhesive material and preparation method thereof

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Embodiment 1

[0024] Embodiment 1: A light-cured and heat-cured heat-resistant conductive adhesive material, including the following raw materials in parts by weight: 20 parts of base adhesive, 70 parts of conductive filler, 6 parts of active monomer auxiliary agent, and 4 parts of thermosetting agent , 1 part of thermal initiator, 1.5 parts of photoinitiator, 5 parts of reactive diluent crosslinking agent, 12 parts of plasticizing modifier, 5 parts of inorganic filler;

[0025] The basic adhesive is difunctional aliphatic polyurethane acrylic resin, polyether acrylic resin and alicyclic epoxy resin, and its mass ratio is 8:3:6; the conductive filler is silver-plated glass microspheres and nano oxide Zinc, its mass ratio is 3:1, and the Ag content of described silver-plated glass microsphere is 12%, and average particle diameter is 20 μ m; Described active monomer auxiliary agent is hexafluorobutyl acrylate and methacrylamide Composite; Described thermal curing agent is triethanolamine; Des...

Embodiment 2

[0030] Embodiment 2: A light-cured and heat-cured heat-resistant conductive adhesive material, including the following raw materials in parts by weight: 10 parts of base adhesive, 50 parts of conductive filler, 3 parts of active monomer auxiliary agent, and 2 parts of thermosetting agent , 0.5 parts of thermal initiator, 1 part of photoinitiator, 3 parts of reactive diluent crosslinking agent, 8 parts of plasticizing modifier, 3 parts of inorganic filler;

[0031] The basic adhesive is difunctional aliphatic polyurethane acrylic resin, polyether acrylic resin and alicyclic epoxy resin, and its mass ratio is 3:1:2; the conductive filler is silver-plated glass microspheres and nano oxide Zinc, its mass ratio is 2:1, and the Ag content of described silver-plated glass microsphere is 12%, and average particle diameter is 20 μ m; Described active monomer auxiliary agent is dipentaerythritol pentaacrylate; Described thermosetting The agent is triethanolamine; the thermal initiator i...

Embodiment 3

[0034] Embodiment 3: A light-curing and heat-curing heat-resistant conductive adhesive material, including the following raw materials in parts by weight: 30 parts of base adhesive, 90 parts of conductive filler, 10 parts of active monomer auxiliary agent, and 6 parts of thermosetting agent , 1.5 parts of thermal initiator, 2 parts of photoinitiator, 8 parts of reactive diluent crosslinking agent, 15 parts of plasticizing modifier, 6 parts of inorganic filler;

[0035]The basic adhesive is difunctional aliphatic polyurethane acrylic resin, polyether acrylic resin and alicyclic epoxy resin, and its mass ratio is 5:2:4; the conductive filler is silver-plated glass microspheres and nano oxide Zinc, its mass ratio is 4:1, and the Ag content of described silver-plated glass microsphere is 12%, and average particle diameter is 20 μ m; Described active monomer assistant is hexafluorobutyl acrylate, methacrylamide and The compound of dipentaerythritol pentaacrylate; The thermal curing...

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Abstract

The invention discloses a photo-curing and thermal curing heat-resistant conductive adhesive material, which is prepared from the following raw materials in parts by weight: 10 to 30 parts of basic adhesive materials, 50 to 90 parts of conductive fillers, 3 to 10 parts of active monomer additives, 2 to 6 parts of thermal initiators, 0.5 to 1.5 parts of thermal initiators, 1 to 2 parts of photoinitiators, 3 to 8 parts of active diluting crosslinking agents, 8 to 15 parts of plasticizing modifiers and 3 to 6 parts of inorganic fillers. The invention also discloses a preparation process of the photo-curing and thermal curing heat-resistant conductive adhesive material. The conductive material provided by the invention has excellent electric performance; the thermal curing and the curing are combined; the simultaneous effect taking is achieved; the fast curing of the conductive glue is realized. The conductive adhesive simultaneously has excellent thermal stability; when the environment temperature rises to 220 DEG C, the conductive adhesive can still have good conduction reliability.

Description

technical field [0001] The invention relates to the field of conductive adhesive and its preparation, in particular to a light-cured and heat-cured high-temperature-resistant conductive adhesive material and a preparation process thereof. Background technique [0002] Pb / Sn metal alloy solder used in large quantities has high strength, low melting point, good processing plasticity and low cost, and is widely used in automobiles, digital products, home appliances and other fields. However, the use of Pb / Sn metal alloy solder has potential heavy metal pollution problems. With the improvement of people's awareness of environmental protection and the restriction of environmental protection laws, green, environmentally friendly and lead-free conductive adhesive materials are gradually recognized by people. Conductive adhesive is an adhesive with certain conductivity after curing or drying. With the miniaturization and miniaturization of electronic components and the rapid develo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J171/00C09J163/00C09J11/04C09J11/06C09J9/02
CPCC09J175/14C08K2201/001C08K2201/011C08L2201/08C08L2205/03C09J9/02C09J11/04C09J11/06
Inventor 李明华
Owner JIN BAOLI TECH SUZHOU
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