381results about How to "Improve electrical reliability" patented technology

A method and apparatus of fabricating a semiconductor device are disclosed. The semiconductor device may include a buffer chip package having a buffer chip mounted on a buffer chip substrate and at least one memory package mounted on the buffer chip substrate, wherein the at least one memory package may include a plurality of memory chips. Further, the buffer chip package may have a plurality of external connection terminals.

To provide a low cost mounting structure of an electronic component and to increase the reliability of the conductive connection between a bump electrode and a terminal formed on a substrate, in the mounting structure of the electronic component, the bump electrode includes a core composed of an inner resin and a conductive film covering the surface of the core. The bump electrode is brought into conductive contact with the terminal directly and is elastically deformed to make contact with the face of the substrate in a planar manner. A sealing resin is filled in around the conductive contact portion between the bump electrode and the terminal to hold the bump electrode and the terminal.

An electric drive comprising a stator with at least two ring-shaped windings and controllers, and a magnetized rotor with an axis of rotation. Each of said windings comprises at least one coil layer with circumferentially arrayed coils located around said axis, and a layer of electro-insulating material, and each winding is electrically connected to a power source through an individual controller. At least two said windings are electrically connected by their controllers in parallel, with the possibility to function jointly and/or independently. At least two nearest windings are located in such a way that two said coil layers belonging to the different windings are separated by an additional layer of electro-insulating material. The coils of said nearest coil layers of different windings are made the same in transparent view, so that the distances between corresponding parts of said coils of said nearest windings are equal to the thickness of said additional layer of an electro-insulating material. At least two said nearest windings are made as parts of a common multi-layer printed circuit board.

A microphone package includes a housing having a cavity and a sound hole allowing the cavity to communicate with the exterior. A microphone chip is mounted on the mounting surface inside of the cavity. The sound hole is opened on the interior surface of the housing positioned opposite to the mounting surface. A resin sealing portion is formed to seal the surrounding area of the microphone chip and the mounting surface. Alternatively, a semiconductor sensor chip and a control circuit chip are mounted on the mounting surface inside of the cavity of the housing and are electrically connected together via bonding wires. Herein, the resin sealing portion entirely seals the control circuit chip and the first joining portions joining the first ends of the bonding wires, while a resin potting portion seals the second joining portions between the electrode pads and the second ends of the bonding wires.

A thin-film transistor includes a semiconductor pattern, a first gate electrode, a source electrode, a drain electrode and a second gate electrode. The semiconductor pattern is formed on a substrate. A first conductive layer has a pattern that includes the first gate electrode which is electrically insulated from the semiconductor pattern. A second conductive layer has a pattern that includes a source electrode electrically connected to the semiconductor pattern, a drain electrode spaced apart from the source electrode, and a second gate electrode electrically connected to the first gate electrode. The second gate electrode is electrically insulated from the semiconductor pattern, the source electrode and the drain electrode.

An electronic component mounting structure includes: an electronic component including a plurality of bump electrodes that includes a base resin provided on an active face of the electronic component and a plurality of conductive films that cover a part of a surface of the base resin, expose an area excluding the part of the surface, and are electrically coupled to a plurality of electrode terminals provided on the active face; and a substrate including a plurality of terminals. In the structure, the electronic component is mounted on the substrate, and the base resin includes: a first opening surrounding the plurality of the electrode terminals; a connection portion in which a part of one ends of the plurality of the conductive films that are drawn out on the surface of the base resin is disposed, the other ends of the conductive films being coupled to the electrode terminals; and a bonding portion that is bonded to the substrate, and is formed in an area excluding the first opening and the connection portion, and an elastic deformation of the base resin at the connection portion allows the bonding portion to bond the substrate so as to maintain the conductive films and the plurality of the terminals on the substrate in a bonded state.

A cooling system has a configuration in which a cooling system for an inverter device and a motor generator also serves as a cooling system for a battery. In this configuration, a control device performs temperature-raising control of the battery when a battery temperature is below a prescribed temperature lower limit value. The control device controls an operation of a switching valve such that cooling water from a cooling medium path is outputted to a bypass path. Further, if a cooling water temperature is lower than a prescribed temperature, the control device controls the inverter device such that a power loss during a switching operation in a switching element included in the inverter device becomes larger than a power loss during normal control. As a result, the cooling system having a small-sized, low-cost configuration rapidly recovers capacity decline of the battery, which occurs at low temperatures.

A brushless electric motor system comprises a rotor and a stator comprising poles. Electrical phase windings have coils (U1-6, V1-6, W1-6) wound around the poles. Power switches (T1-24) controlled by a control device supply electric current the windings from positive and negative rails connected to power supply. For each phase at least one group of four power switches arranged in a H-bridge configuration is provided. The coils of each phase winding are preferably divided into winding group (U1-3, Ua-6, V1-3, V4-6, W1-3, W4-6) and the electric conductor of each winding group is then electrically conductor of the other winding groups. Then four power switches arranged in an H-configuration is provided for each winding group. The use of power switches in H-bridge configurations allows the faulty windings or winding groups to be disabled and that the rest of the windings or coils can be used for driving the rotor, this giving the motor system a high reliability. The current supplied to other windings or winding groups can then be increased to compensate for the faulty group. The coil groups can be separated from other coil groups by unwound stator poles. Current sensors (303) can sense the current in each winding group and be used to detect whether the currents are too high. The sensed currents can be used to identify fault conditions in the system so that then suitable switches can be disabled, disconnecting a faulty winding group.

A manufacturing method of an interposed substrate is provided. A photoresist layer is formed on a metal carrier. The photoresist layer has plural of openings exposing a portion of the metal carrier. Plural of metal passivation pads and plural of conductive pillars are formed in the openings. The metal passivation pads cover a portion of the metal carrier exposed by openings. The conductive pillars are respectively stacked on the metal passivation pads. The photoresist layer is removed to expose another portion of the metal carrier. An insulating material layer is formed on the metal carrier. The insulating material layer covers the another portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads. An upper surface of the insulating material layer and a top surface of each conductive pillar are coplanar. The metal carrier is removed to expose a lower surface of the insulating material layer.

A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 .mu.m. The copper-tin alloy layer has a thickness of 0.1-1.0 .mu.m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 .mu.m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 .mu.m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

The present invention provides a liquid crystal display device that achieves increase in operating speed of a drive circuit, reduction in load of signal source, low power consumption, and improvement in reliability of electric conduction between a liquid crystal display section and a liquid crystal driver. The liquid crystal display device includes a liquid crystal display section 44, a source driver 30 having an input latch circuit 48 and circuits 33 to 37, and 39 each of which samples gradation displaying data signal R,G, or B outputted from a control circuit 45 and holds the signal in output terminals thereof for a predetermined period. The circuits 33 to 37, and 39 are each formed of a p-Si thin film on a glass substrate 43 on which the liquid crystal display section 44 is provided. Moreover, the input latch circuit 48 is formed inside a logic circuit 41 formed on a monocrystal silicon substrate.

A gate driver-on-array structure integrated into a display includes a substrate and a gate driver structure formed thereon. The gate driver structure is disposed in a peripheral region of the substrate. The gate driver structure includes a first layer metal pattern, a second layer metal pattern, and an insulating layer disposed therebetween. The first layer metal pattern includes connection nodes. The insulating layer has through holes exposing the connection nodes. The second layer metal pattern fills into the through holes and in contact with the connection nodes of the first layer metal pattern so as to implement necessary electrical connection of the gate driver structure.

The embodiment of the invention provides a three-phase motor stator and an electric vehicle drive motor, belonging to the field of new energy vehicle motors. The three-phase motor stator comprise a stator iron core, A plurality of stator slots are formed in the stator core, wherein the stator windings are arranged in the plurality of stator slots in six layers, the number of slots per pole per phase is 3, and each phase stator coil in the three-phase stator coil is divided into three groups, and each group of stator coils occupies two adjacent stator slots side by side, wherein one stator slotis displaced between two adjacent groups of stator coils. As a result, the harmonics of the motor are effectively reduced, the AC copper consumption caused by skin effect and proximity effect is reduced, the voltage and current of the high-voltage system are matched, and the purposes of high torque, low torque ripple, low vibration noise, good heat dissipation performance and high electrical reliability are achieved.

A nanoparticle for conductive ink including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core. The ferromagnetic core is 5 to 40 parts by weight, per 100 parts by weight of the nanoparticles. The conductive ink provides electrical reliability by allowing a uniform distribution of nanoparticles in ejected ink and prevents the coffee stain phenomenon and migration.

A vertical memory device includes a substrate, a plurality of channels on the substrate and extending in a first direction that vertical to a top surface of the substrate, a plurality of gate lines and a conductive line on the substrate. The gate lines are stacked on top of each other. The gate lines surround the channels. The gate lines are spaced apart from each other along the first direction. The conductive line cuts the gate lines along the first direction. A width of the conductive line is periodically and repeatedly changed.

A waterproof connector for a flat cable 10 includes a connecting housing 13 into which the terminal portions of two FFCs 11 can be guided through a guide hole 24 formed in the base end portion thereof and also which can store therein two or more terminals 12 connected to the terminal portions of the FFCs 11, a seal member 14 interposed between the FFCs 11 and the peripheral wall of the connector housing 13 for defining the guide hole 24, a rear cover 15 not only including two insertion holes 27 into which the FFCs 11 extended from the guide hole 24 of the connector housing 13 can be inserted but also mountable onto the base end portion of the connector housing 13 while inserting the FFCs 11 into the insertion holes 27, and a fixing plate 16 to be mounted onto the rear cover 15 in such a manner that the FFCs 11 inserted into the insertion holes of the rear cover 15 are held by and between the rear cover 15 and the fixing plate 16.

The objective of the present invention is to provide a resin black matrix substrate wherein a resin black matrix that has a low reflectance, while having a sufficient optical density is formed. The present invention is a black matrix substrate which sequentially comprises a transparent substrate, a light blocking layer (A) and a light blocking layer (B), and wherein the optical density per thickness of the light blocking layer (A) is lower than the optical density per thickness of the light blocking layer (B), and the light blocking layer (A) contains a light blocking material and fine particles having a refractive index of 1.4-1.8. Due to the characteristics thereof, the black matrix substrate of the present invention is useful for color filters and liquid crystal display devices.

A lamp socket includes a socket body, a power supplying member and a socket cover. The socket body has a connecting hole formed in the socket body. The connecting hole is opened. The power supplying member is disposed in the connecting hole and an electrode supporting terminal having a supporting groove, so that supports an electrode portion of a lamp disposed in the power supplying member. The socket cover is partially and separably insertable in the connecting hole, to fix the electrode portion of the lamp. A backlight assembly includes a receiving container, a plurality of lamps and lamp sockets.

A semiconductor structure includes a substrate, a dielectric layer and a fluoride metal layer. The dielectric layer is located on the substrate. The fluoride metal layer is located on the dielectric layer. Furthermore, the present invention also provides a semiconductor process to form said semiconductor structure.