Low-oil-permeability super-soft thermally-conductive silica gel composition and thermally-conductive silica gel gasket and preparation method thereof

Abstract

The present invention relates to a low-oil-permeability super-soft thermally-conductive silica gel composition and a thermally-conductive silica gel gasket, the low-oil-permeability super-soft thermally-conductive silica gel composition comprising a first liquid silica gel, a second liquid silica gel and a thermally-conductive filler, the thermally-conductive silica gel gasket is prepared from the low-oil-permeability super-soft thermally-conductive silica gel composition, the low-oil-permeability super-soft thermally-conductive silica gel composition is prepared from the following components by mass: 7 to 11.9% of a first liquid silica gel and second liquid silica gel mixed liquid, 88 to 92.9% of the thermally-conductive filler, 0.05 to 0.5% of a catalyst and 0.05 to 0.5% of an inhibitor by the preparation method comprising stirring, rolling, vulcanizing and cutting; the low-oil-permeability super-soft thermally-conductive silica gel composition is prepared by mixing the first liquid silica gel, the second liquid silica gel and the thermally-conductive filler, vinyl silicone oil and a platinum catalyst in the first liquid silica gel and vinyl silicone oil and hydrogen-containing silicone oil in the second liquid silica gel can make the prepared plastic material characterized by being low in oil permeability and low in hardness, and the like, the viscosity of the first liquid silica gel and the second liquid silica gel are 3000mPa. s-10000mPa.s, uniform mixing of the material and the thermally-conductive filler during stirring can be guaranteed, and an appropriate crosslinking degree can be achieved during the vulcanizing.

Description

technical field [0001] The invention relates to the field of heat-conducting silica gel, in particular to a low-oil-permeable supersoft heat-conducting silica gel composition, a heat-conducting silica gel gasket and a preparation method thereof. Background technique [0002] In electronic products, electronic components such as the computer central processing unit (CPU), transistors, and light-emitting diodes (LEDs) will generate a lot of heat during work. If the heat dissipation measures are not appropriate, the temperature of the components will be too high, resulting in a decrease in their working performance or even damage. Therefore, it is necessary to install a cooling device on the heating element, such as a cooling fan or a copper block, etc., and a plastic heat conductor, such as a silicone gasket, is usually filled between the cooling device and the heating element to facilitate the cooling between the heating element and the cooling device. Generally, in order to ...

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a low oil-permeable supersoft thermally conductive silica gel composition, a thermally conductive silica gel gasket and a preparation method thereof, so as to solve the problem of silicone oil leakage in existing silica gel composition gaskets