A silicone thermally conductive potting silicone with excellent performance

A technology of heat conduction potting and silicone, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of high product viscosity, poor oil leakage performance, difficult adhesion, etc.

Active Publication Date: 2021-12-07
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The higher the thermal conductivity of low-cost thermal silica gel, the higher the filler ratio, which leads to the high viscosity of the product. In order to achieve low viscosity, a large amount of diluent silicone oil is added, which makes the oil leakage performance of the product very poor; The adhesiveness of the circuit board is also required to be higher and higher. Due to the presence of a lot of flux on the circuit board, it further leads to difficult adhesion.

Method used

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  • A silicone thermally conductive potting silicone with excellent performance
  • A silicone thermally conductive potting silicone with excellent performance
  • A silicone thermally conductive potting silicone with excellent performance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] A component: successively weigh 7.0 g of methyl vinyl polysiloxane-1 (wherein m=48, vinyl content is 1.0 wt%) with a viscosity of 100 mPa.s such as structural formula (1); the viscosity is 50 mPa.s 8.5g of methyl vinyl polysiloxane-2 (where n=45, vinyl content is 0.80wt%) such as structural formula (2); 85g of thermal conductive powder; 1.5g of adhesive such as structural formula (4) (wherein K 1 =7,K 2 =4); Color paste 0.35g; Catalyst 0.04g of 5000ppm; Join in double planetary mixing tank, mix under vacuum state, promptly obtain A component;

[0050] Component B: Weigh 38g of methylvinyl polysiloxane-1 (wherein m=48, vinyl content is 1.0wt%) with a viscosity of 100mPa.s such as structural formula (1); the viscosity is 50mPa.s such as 3.0g of methyl vinyl polysiloxane-2 (wherein n=45, vinyl content is 0.80wt%) of structural formula (2); 84g of heat conducting powder; viscosity is 45mPa.s as the crosslinking agent of structural formula (3) (where a=12, b=14, hydrogen ...

Embodiment 2

[0052] Component A: Weigh 6.5g of methylvinyl polysiloxane-1 (wherein m=48, vinyl content is 1.0wt%) with a viscosity of 100mPa.s such as structural formula (1); the viscosity is 50mPa.s Such as structural formula (2) methyl vinyl polysiloxane-2 (wherein n=45, vinyl content is 0.80wt%) 9g; Thermal conductive powder 84g; Such as structural formula (4) adhesive 1.0g (wherein K 1 = 6,K 2 =5); Color paste 0.30g; Catalyst 0.05g of 5000ppm; Join in double planetary mixing kettle, mix under vacuum state, promptly obtain A component;

[0053] B component: successively weigh 36g of methylvinyl polysiloxane-1 (wherein m=48, vinyl content is 1.0wt%) whose viscosity is 100mPa.s such as structural formula (1); viscosity is 50mPa.s such as 3.5g of methyl vinyl polysiloxane-2 (wherein n=45, vinyl content is 0.80wt%) of structural formula (2); 85g of heat conducting powder; viscosity is 45mPa.s as the crosslinking agent of structural formula (3) (where a=12, b=14, hydrogen content is 0.35wt...

Embodiment 3

[0055]A component: successively weigh 7.5g of methylvinyl polysiloxane-1 (wherein m=45, vinyl content is 1.05wt%) with a viscosity of 95mPa.s such as structural formula (1); the viscosity is 55mPa.s Such as structural formula (2) methyl vinyl polysiloxane-2 (wherein n=50, vinyl content is 0.70wt%) 8g; Heat conduction powder 86g; Such as structural formula (4) adhesive 2.0g (wherein K 1 =8,K 2 =3); Color paste 0.0.4g; Catalyst 0.03g of 5000ppm; Join in double planetary mixing kettle, mix under vacuum state, promptly obtain A component;

[0056] Component B: Weigh 40 g of methylvinylpolysiloxane-1 (wherein m=50, vinyl content is 0.95wt%) whose viscosity is 105mPa.s such as structural formula (1); viscosity is 45mPa.s such as 3.0g of methyl vinyl polysiloxane-2 (wherein n=40, vinyl content is 0.85wt%) of structural formula (2); 83g of heat conducting powder; viscosity is 45mPa.s as the crosslinking agent of structural formula (3) (where a=10, b=16, hydrogen content is 0.40wt%) ...

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Abstract

The invention relates to an organosilicon heat-conducting potting silica gel with excellent performance. The components A and B include, in parts by mass: component A: methyl vinyl polysiloxane-16.5-7.5 parts, methyl vinyl polysiloxane Oxane-28-9 parts, thermal conductive powder 84-86 parts, adhesive 1-2 parts, color paste 0.3-0.4 parts, catalyst 0.03-0.05 parts; B component: methyl vinyl polysiloxane-136 ~40 parts, methyl vinyl polysiloxane-22.5-3.5 parts, thermal conductive powder 83-85 parts, crosslinking agent 2.7-3.0 parts, inhibitor 0.008-0.012 parts. The thermally conductive potting silica gel prepared by the invention has high thermal conductivity, low viscosity, low oil permeability, excellent anti-settling property and good adhesion to PCB circuit boards.

Description

technical field [0001] The present invention relates to a silicone high thermal conductivity silica gel with excellent performance, in particular to a silicone thermal conductivity potting with high proportion of thermal conductivity filler, low viscosity, low oil leakage, excellent anti-settling property and good adhesion to PCB circuit boards The adhesive belongs to the field of potting adhesives. [0002] technical background [0003] At present, the application trend of solvent-free thermal silica gel products in the market is getting better and better, and the annual usage of the products has been greatly increased. The competition in domestic and foreign markets is very fierce, and the cost pressure is very huge. The higher the thermal conductivity of low-cost thermal silica gel, the higher the filler ratio, which leads to the high viscosity of the product. In order to achieve low viscosity, a large amount of diluent silicone oil is added, which makes the oil leakage pe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J11/04
CPCC08K2201/003C08L2201/08C08L2203/206C08L2205/025C08L2205/035C09J11/04C09J183/04C08L83/04C08K9/06C08K7/18
Inventor 孙刚王建斌陈田安
Owner YANTAI DARBOND TECH
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