Silicon rubber with high refractive index and high transparency for optical encapsulation and preparation method thereof

A technology of high refractive index and silicone rubber, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as unusable, no silicone rubber for packaging, no adhesiveness of LED packaging materials, storage stability, etc.

Active Publication Date: 2013-05-29
ZHUZHOU TIMES NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are many studies on it at home and abroad, and certain results have been obtained. There are already some suitable products on the market, and some related patents can also be found, but most of them are about the preparation of raw materials. For example, the patent publication number CN101891893A The patent document discloses "Preparation of phenylhydrogen-based silicone resin for LED packaging", but only involves the synthesis and preparation of phenylhydrogen-based silicone resin, and does not involve the silicone rubber for packaging and the preparation method, and the use of phenylhydrogen-based silicone resin The encapsulant prepared as a raw material has poor toughness, and the use of linear phenyl hydrogen-contai

Method used

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  • Silicon rubber with high refractive index and high transparency for optical encapsulation and preparation method thereof
  • Silicon rubber with high refractive index and high transparency for optical encapsulation and preparation method thereof
  • Silicon rubber with high refractive index and high transparency for optical encapsulation and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] (1) Preparation of component A phenyl vinyl silicone resin (PhSiO 3 / 2 ) 0.55 (Ph 2 SiO 2 / 2 ) 0.02 (Me 3 SiO 1 / 2 ) 0.22 (ViMe 2 SiO 1 / 2 ) 0.21 , its vinyl content is 5wt%, and the refractive index is 1.518, and method is as follows: Accurately weigh hexamethyldisiloxane 81.8, diphenyldiethoxysilane 25g, phenyltriethoxysilane 606g, toluene 500g Add the mixture of trifluoromethanesulfonic acid and 0.6g into a 2L flask, stir at 25°C, slowly add distilled water dropwise, the amount of water added dropwise is 45.5g, after the dropwise addition, slowly raise the temperature to 50°C, and continue the reaction for 3 Hour. Then, 89.7 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane was added. The temperature was raised to 60° C. for 3 hours. Then the heterogeneous system obtained by the reaction is layered with a separatory funnel, the solvent and the resin part are taken, and anhydrous calcium chloride is added. The reaction was continued at 100°C for 2 hours. After ...

Embodiment 2

[0054] (1) Preparation of component A phenyl vinyl silicone resin (PhSiO 3 / 2 ) 0.55 (Ph 2 SiO 2 / 2 ) 0.02 (Me 3 SiO 1 / 2 ) 0.33 (ViMe 2 SiO 1 / 2 ) 0.1 , its vinyl content is 2.5wt%, and its refractive index is 1.512. The method is as follows: accurately weigh hexamethyldisiloxane 122.7, diphenyldiethoxysilane 25g, phenyltriethoxysilane 606g, toluene Add the mixture of 500g and 0.6g of trifluoromethanesulfonic acid into a 2L flask, stir at 25°C, slowly add distilled water dropwise, the amount of water added is 45.5g, after the dropwise addition, slowly raise the temperature to 50°C, and continue the reaction 3 hours. Then, 42.7 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane was added. The temperature was raised to 60° C. for 3 hours. Then the heterogeneous system obtained by the reaction is layered with a separatory funnel, the solvent and the resin part are taken, and anhydrous calcium chloride is added. The reaction was continued at 100°C for 2 hours. After the rea...

Embodiment 3

[0058] Get A component (PhSiO2) gained in embodiment 1 3 / 2 ) 0.55 (Ph 2 SiO 2 / 2 ) 0.02 (Me 3 SiO 1 / 2 ) 0.22 (ViMe 2 SiO 1 / 2 ) 0.21 14.16g, gained A component (PhSiO 3 / 2 ) 0.55 (Ph 2 SiO 2 / 2 ) 0.02 (Me 3 SiO 1 / 2 ) 0.33 (ViMe 2 SiO 1 / 2 ) 0.1 9.44g, gained B component Vi(Me) in embodiment 2 2 SiO(Ph 2 SiO 2 / 2 ) 38 (Me 2 SiO 2 / 2 ) 84 Si(Me) 2 Vi 9.44g, D component platinum complex catalyst 0.03g, blend to get the first part; Get A group (PhSiO 3 / 2 ) 0.55 (Ph 2 SiO 2 / 2 ) 0.02 (Me 3 SiO 1 / 2 ) 0.22 (ViMe 2 SiO 1 / 2 ) 0.21 6.84g, gained A component (PhSiO 3 / 2 ) 0.55 (Ph 2 SiO 2 / 2 ) 0.02 (Me 3 SiO 1 / 2 ) 0.33 (ViMe 2 SiO 1 / 2 ) 0.1 4.56g, gained B component Vi(Me) in embodiment 2 2 SiO(Ph 2 SiO 2 / 2 ) 38 (Me 2 SiO 2 / 2 ) 84 Si(Me) 2 Vi 4.56g, gained C component H(Me) in embodiment 1 2 SiO(Ph 2 SiO 2 / 2 ) 11 (Me 2 SiO 2 / 2 ) 22 (MeHSiO 2 / 2 ) 21 Si(Me) 2 H 16.1g, E component 1-acetylene-1-cyclohexanol 0.02g, F component epox...

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Abstract

The invention relates to silicon rubber with high refractive index and high transparency for optical encapsulation and a preparation method thereof. The silicon rubber is prepared from a phenyl vinyl polysiloxane component A, a silicon resin component B containing phenyl vinyl, a phenyl component C containing hydrogen polyoxyalkylene, a platinum catalyst component D, a catalytic inhibitor component E, a modified polysiloxane component F, and a water remover component G in a mixing manner. The silicon rubber not only has over 1.50 of refractive index, but also is good in transparency, excellent in adhesion, and stable in performance, can resist heat and ultraviolet radiation for a long period of time, can meet various requirements of LED (light-emitting diode) encapsulation, and is an ideal encapsulation material of the LED. The silicon rubber can be packaged into a bi-component product; the product has good storage stability; and high transparency is still kept after the product is stored for over 6 months.

Description

technical field [0001] The invention relates to the fields of electronic packaging and polymer synthesis, in particular to a high-refractive-index high-transparency silicone rubber for optical packaging and a preparation method thereof. technical background [0002] LED light-emitting diode, also known as light-emitting diode (Light Emitting Diode, abbreviated as LED) is a semiconductor light-emitting device that can convert electrical energy into light energy. Compared with traditional vacuum incandescent bulbs, semiconductor LED light sources have incomparable advantages. The working life of semiconductor LED is extremely long, which is more than 10 times that of traditional lighting appliances, which effectively reduces the cost; it has low power consumption, high luminous efficiency, and energy saving, and is a suitable candidate for future energy strategies. [0003] In the process of manufacturing LED devices, in addition to chip manufacturing technology, phosphor man...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08L83/06C08G77/20C08G77/12C08J3/24H01L33/56
Inventor 毕俊曾智赵慧宇宋志成高健宋星光
Owner ZHUZHOU TIMES NEW MATERIALS TECH
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