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Vulcanization-proof LED (light-emitting diode) packaging silica gel

A technology of LED packaging and vulcanization resistance, which is applied in the direction of adhesives, adhesive additives, electrical components, etc., can solve the problems of low crosslinking density, increased light decay, and good air permeability of the adhesive layer, so as to improve the vulcanization resistance and adhesion Excellent effect of increasing crosslink density

Inactive Publication Date: 2013-03-13
YANTAI DEBANG ADVANCED SILICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The packaging materials currently used in LEDs include epoxy resin, polymethyl methacrylate, glass, silicone and other highly transparent materials, among which epoxy resin and silicone materials are used as the main packaging materials, and the internal stress of epoxy resin is too large and yellowing , poor high and low temperature resistance, poor aging resistance, and the current silicone material has small internal stress, good high and low temperature resistance, no yellowing, and higher light transmittance than epoxy resin, so it quickly replaces epoxy resin. It is widely used in the field of LED packaging, but silicone materials, especially low-refractive-index silicone materials, because of the use of long-chain vinyl-terminated polydimethylsiloxane, long molecular chains, and low vinyl content, resulting in cross-linking density Low, resulting in good air permeability of the adhesive layer. Under the action of sulfur-containing gas, it will partially penetrate the silicone packaging material, react with the silver layer at the silicone interface, and generate silver sulfide, resulting in blackening of the silver layer and rapid increase in light decay.

Method used

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  • Vulcanization-proof LED (light-emitting diode) packaging silica gel
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  • Vulcanization-proof LED (light-emitting diode) packaging silica gel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Preparation of component A: Weigh 50g of methylphenylvinyl silicone oil, 44.9g of methylvinyl MQ resin, 5g of adhesive (that is, the above structural formula 1), 0.1g of catalyst platinum-vinylsiloxane complex, Wherein the mass content of platinum is 7000ppm, which is sequentially added into the mixer, mixed and stirred evenly, and the A component is obtained;

[0033] Preparation of component B: Weigh 50g of methylphenylvinyl silicone oil, 34.8g of methylvinyl MQ resin, 15g of crosslinking agent polymethylhydrogensiloxane, and 0.2g of inhibitor ethynyl cyclohexanol, and add them to the mixer in sequence Inside, mix and stir evenly to obtain the B component;

[0034] When in use, mix the components A and B evenly in a weight ratio of 1:1, vacuum defoam for 20 minutes, dispense or pour glue on the parts to be packaged, and heat at 90°C for 1 hour , and then heated at 150°C for 3 hours.

Embodiment 2

[0036] Preparation of component A: Weigh 60g of methylphenylvinyl silicone oil, 36.7g of methylvinyl MQ resin, 3g of adhesive (that is, the above structural formula 2), 0.3g of catalyst platinum-vinylsiloxane complex, Wherein the mass content of platinum is 7000ppm, which is sequentially added into the mixer, mixed and stirred evenly, and the A component is obtained;

[0037] Preparation of component B: Weigh 40g of methylphenylvinyl silicone oil, 50g of methylvinyl MQ resin, 9.8g of crosslinking agent polymethylhydrogensiloxane, and 0.2g of inhibitor ethynylcyclohexanol, and add in sequence In the mixer, mix and stir evenly to obtain the B component;

[0038] When in use, mix the components A and B evenly in a weight ratio of 1:1, vacuum defoam for 20 minutes, dispense or pour glue on the parts to be packaged, and heat at 90°C for 1 hour , and then heated at 150°C for 3 hours.

Embodiment 3

[0040] Preparation of component A: Weigh 53.9g of methyl phenyl vinyl silicone oil, 42 g of methyl vinyl MQ resin, 4 g of adhesive (structural formula 1), 0.1 g of catalyst platinum-vinyl siloxane complex, of which platinum The mass content of 5000ppm is added into the mixer in turn, mixed and stirred evenly, and the A component is obtained;

[0041] Preparation of component B: Weigh 45g of methylphenylvinyl silicone oil, 41g of methylvinyl MQ resin, 13.8g of crosslinking agent polymethylhydrogensiloxane, and 0.2g of inhibitor ethynyl cyclohexanol, and add in sequence In the mixer, mix and stir evenly to obtain the B component;

[0042] When in use, mix the components A and B evenly in a weight ratio of 1:1, vacuum defoam for 20 minutes, dispense or pour glue on the parts to be packaged, and heat at 90°C for 1 hour , and then heated at 150°C for 3 hours.

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Abstract

The invention relates to an LED (light-emitting diode) packaging silica gel, and in particular relates to a vulcanization-proof LED packaging silica gel, belonging to the technical field of adhesives. The vulcanization-proof LED packaging silica gel comprises a component A and a component B, wherein the weight ratio of the component A to the component B is 1: 1; the component A comprises raw materials based on parts by weight: 50-60 parts of methyl phenyl vinyl silicone oil, 30-60 parts of methyl vinyl MQ resin, 0.1-0.3 part of platinum catalyst and 3-5 parts of bonding agent; and the component B comprises raw materials based on parts by weight: 40-50 parts of methyl phenyl vinyl silicone oil, 30-50 parts of methyl vinyl MQ resin, 5-15 parts of cross-linking agent and 0.1-0.3 part of inhibitor. The vulcanization-proof LED packaging silica gel has excellent adhesive force for silver, phenyl-propanolamine (PPA), glass and the like, and has the light transmittance of more than 98%; and phenyl-containing functional groups and branched chain type vinyl are introduced into the LED packaging silica gel, and the dosage of the vinyl MQ resin is increased, so that the crosslinking density and the curing handness are improved, and therefore, the vulcanization resistance of a packaging adhesive layer can be improved.

Description

technical field [0001] The invention relates to an LED packaging silica gel, in particular to a vulcanization-resistant LED packaging silica gel, and belongs to the technical field of adhesives. Background technique [0002] The packaging materials currently used in LEDs include epoxy resin, polymethyl methacrylate, glass, silicone and other highly transparent materials, among which epoxy resin and silicone materials are used as the main packaging materials, and the internal stress of epoxy resin is too large and yellowing , poor high and low temperature resistance, and poor aging resistance, while the current silicone material has small internal stress, good high and low temperature resistance, no yellowing, and higher light transmittance than epoxy resin, so it quickly replaces epoxy resin. It is widely used in the field of LED packaging, but silicone materials, especially low-refractive-index silicone materials, because of the use of long-chain vinyl-terminated polydimeth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J11/06C09J11/08H01L33/56
Inventor 陈维庄恒冬王建斌陈田安
Owner YANTAI DEBANG ADVANCED SILICON MATERIALS
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