Thermal-spalling acrylic ester pressure-sensitive adhesive, adhesive tape and preparation method thereof

A technology of pressure-sensitive adhesive tapes and pressure-sensitive adhesives, applied in the field of pressure-sensitive adhesives, can solve the problems of low foaming temperature, high price and cost, difficulty in meeting low-temperature viscosity requirements, etc., and achieve good application prospects and good adhesion and thermal peelability, good temperature resistance and peelability

Inactive Publication Date: 2012-07-11
新丰杰力电工材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in addition to its expensive price, it is inevitable to develop domestic heat-peelable pressure-sensitive adhesive tapes.
Patent CN101522846A is to coat a layer of intermediate layer containing heat-expandable microspheres on the substrate, and then coat a layer of pressure-sensitive adhesive layer; patent JP-A-2002-003800 describes heat-p

Method used

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  • Thermal-spalling acrylic ester pressure-sensitive adhesive, adhesive tape and preparation method thereof
  • Thermal-spalling acrylic ester pressure-sensitive adhesive, adhesive tape and preparation method thereof
  • Thermal-spalling acrylic ester pressure-sensitive adhesive, adhesive tape and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A heat-peelable acrylate pressure-sensitive adhesive, which is polymerized from the following components by weight:

[0025]

[0026] First, dissolve N-methylolacrylamide in acrylic acid, stir well to make it dissolve evenly, and dissolve 0.18 parts of azobisisobutyronitrile in 95 parts of ethyl acetate, and mix the two solutions after the dissolution is complete. mix. Then add the above-mentioned isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate and methyl methacrylate and mix well.

[0027] Add 40 parts of ethyl acetate into the reactor and raise the temperature to 75°C. After the reflux is stable, start to slowly add 1 / 2 of the above-mentioned monomer mixture solution dropwise, and finish adding dropwise in 1 hour, and control the reaction temperature at 78-80°C ; Add 20 parts of ethyl acetate with 0.045 parts of azobisisobutyronitrile dropwise, drop it within 10 minutes, and keep it warm for 1 hour; For 2.5 hours, the reaction temperature was controlled ...

Embodiment 2

[0036] A heat-peelable acrylate pressure-sensitive adhesive, which is polymerized from the following components by weight:

[0037]

[0038] First, dissolve N-methylolacrylamide in acrylic acid, stir well to make it dissolve evenly, and dissolve 0.18 parts of azobisisobutyronitrile in 95 parts of ethyl acetate, and mix the two solutions after the dissolution is complete. mix. Then add the above-mentioned isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate and methyl methacrylate and mix well.

[0039] Add 40 parts of ethyl acetate into the reactor and raise the temperature to 75°C. After the reflux is stable, start to slowly add 1 / 2 of the above-mentioned monomer mixture solution dropwise, and finish adding dropwise in 1 hour, and control the reaction temperature at 78-80°C ; Add 20 parts of ethyl acetate with 0.045 parts of azobisisobutyronitrile dropwise, drop it within 10 minutes, and keep it warm for 1 hour; For 2.5 hours, the reaction temperature was controlled ...

Embodiment 3

[0044] A heat-peelable acrylate pressure-sensitive adhesive, which is polymerized from the following components by weight:

[0045]

[0046]

[0047] First, dissolve N-methylolacrylamide in acrylic acid, stir well to make it dissolve evenly, and dissolve 0.18 parts of azobisisobutyronitrile in 95 parts of ethyl acetate, and mix the two after the dissolution is complete. liquid mix. Then add the above-mentioned isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate and methyl methacrylate and mix well.

[0048] Add 40 parts of ethyl acetate into the reactor and raise the temperature to 75°C. After the reflux is stable, start to add 1 / 2 of the above monomer mixture dropwise at a constant speed, and finish adding dropwise in 1 hour, and control the reaction temperature at 78-80°C ; Add 20 parts of ethyl acetate with 0.045 parts of azobisisobutyronitrile dropwise, drop it within 10 minutes, and keep it warm for 1 hour; For 2.5 hours, the reaction temperature was controll...

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Abstract

The invention relates to a thermal-spalling acrylic ester pressure-sensitive adhesive, an adhesive tape and a preparation method of the adhesive. The thermal-spalling acrylic ester pressure-sensitive adhesive provided by the invention prepared by the following components by weight via radical polymerization: 60-140 parts of iso-octyl acrylate, 60-140 parts of butyl acrylate, 5-10 parts of acrylic acid, 5-10 parts of hydroxyethyl acrylate, 5-10 parts of methyl methacrylate, 0.1-2 parts of N-hydroxymethyl acrylamide, 0.02-1 part of azodiisobutyronitrile, and 140-250 parts of ethyl acetate. The pressure-sensitive adhesive prepared by the invention has good viscosity at low temperatures and does not have viscosity at high temperatures. Expansible microspheres and a cross-linking agent are added into the pressure-sensitive adhesive and then solidification is carried out to obtain the pressure-sensitive adhesive tape; when the temperature is below 60 DEG C, the pressure-sensitive adhesive tape has good viscosity; and when the temperature is above 120 DEG C and baking is carried out for 5min, the pressure-sensitive adhesive tape loses the viscosity. The viscosity variation of the pressure-sensitive adhesive tape is varied through temperature variation intervals by the pressure-sensitive adhesive, so that terrific adhesiveness and thermal-spalling property are provided.

Description

technical field [0001] The invention belongs to the field of pressure-sensitive adhesives, in particular to a heat-peeling acrylate pressure-sensitive adhesive, an adhesive tape and a preparation method thereof. Background technique [0002] In recent years, with the miniaturization of electronic components, there have been major problems in their production process and improvement of production efficiency, especially the method of efficiently and non-destructively stripping and recycling small electronic components is a big problem. Therefore, if such components are processed within a certain temperature range, the change in the viscosity of the adhesive tape can be changed through the temperature range, which can effectively recycle small electronic components. [0003] At present, heat-peelable pressure-sensitive adhesive tapes are mainly developed by companies such as Japan and South Korea. Therefore, in addition to its high price and cost, it is inevitable to develop d...

Claims

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Application Information

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IPC IPC(8): C09J133/08C09J7/02C09J11/06
Inventor 何俊张惠萍金大奉
Owner 新丰杰力电工材料有限公司
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