Superfine high-temperature electronic wire double-core extrusion process and die thereof

Abstract

The invention discloses a superfine high-temperature electronic wire double-core extrusion process and a die thereof. The die comprises an inner die and an outer die which are matched with each other, wherein two core wires are released respectively from two wire-releasing frames at the same time and pass through two core wire holes of the inner die respectively; two glue outlet channels are formed between the inner die and the outer die and are communicated with the peripheries of the two core wires respectively; melt glue stock enters from the glue outlet channels; when the core wires pass through the outer die, the glue stock is wrapped on the surfaces of the core wires to form insulation layers; and cables wrapped by the insulation layers come out of the outer die, are cooled by a water groove and enter wire storage frames to be reeled respectively. The die is redeveloped and is provided with two core wire extruding channels, two wire-releasing frames matched with the two core wire extruding channels and three wire-reeling shafts; and two electronic wires can be produced at one time through one production line, so that the two cores can be extruded at the same time, the production efficiency is increased manyfold and is improved greatly, requirements are met, energy is saved, and production cost is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of cable manufacturing technology and molds thereof, in particular to an extrusion process of ultra-thin high-temperature electronic wires and a mold used therefor. Background technique [0002] Ultra-thin high-temperature electronic wires are used in many fields and equipment, and their market and demand are quite large. However, the extrusion equipment of ultra-fine high-temperature electronic wire is expensive, but the gauge of ultra-fine electronic wire is small, the conductor is thin, and the extrusion speed is slow. During normal production, the extrusion speed of products with a wire gauge below 36AWG is generally 80M / MIN. The ratio of the actual glue output to the maximum glue output of the extruder is generally 20%, the production efficiency is low, and the production cost is high. At present, the process of producing high-temperature electronic wires is to firstly release the wires from a pay-off ...

AI Technical Summary

Problems solved by technology

The extrusion die used has only one core wire hole, and each production line can only extrude one electronic wire a

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