Method for preparing high conductive, high temperature electronic frame material

A frame material, special-shaped technology, applied in other manufacturing equipment/tools, furnace types, manufacturing tools, etc., can solve the problems of low product performance, low yield, complex process flow, etc., to achieve the effect of improving performance

Inactive Publication Date: 2006-12-06
宁波海王机电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, the processing of special-shaped strips by the above methods has common defects: 1. The blanks used are flat strips with high precision, and the tolerance requirements are extremely strict, as shown in Table 1; 2. The blanks used are hot-rolled and cold-rolled 3. The microstructure is a dendrite structure, and its product performance is low, as shown in Table 2; 4. The process flow is complicated, and the billet is hot-rolled or cold-rolled multiple times Manufacturing and other processes, high investment cost and low yield

Method used

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  • Method for preparing high conductive, high temperature electronic frame material
  • Method for preparing high conductive, high temperature electronic frame material
  • Method for preparing high conductive, high temperature electronic frame material

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Embodiment Construction

[0023] The present invention will be described in further detail below in conjunction with the embodiments of the drawings.

[0024] A method for preparing a high-conductivity, high-strength special-shaped electronic frame material, which is characterized in that it includes the following process steps: ① After melting the metal copper, the special-shaped crystallizer is used to directionally recrystallize through the directional solidification technology to produce unidirectional fiber crystal structure metal The material is used to prepare the billet, and the oxygen content is controlled during the smelting process. The mass percentage relative to the total metal material is ≤0.0005%. The billet is a small as-cast billet whose cross-sectional shape is basically similar to the product shape. The width dimension difference is ±10 %, the thickness difference is not more than 10 times the thickness of the cross-section of the finished product. The structure of the special-shaped cry...

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Abstract

A shaped electronic frame material with high electric conductivity and strength is made up of the metal material which is prepared by directional coagulation technique and has unidirectional fiber crystal structure and the shape similar to that of product, cold rolling by serially arranged at least 3 rolling mills, and in-line annealing before the last rolling mill.

Description

Technical field [0001] The invention relates to a special-shaped electronic frame material, in particular to a method for preparing a high-conductivity, high-strength special-shaped electronic frame material. Background technique [0002] Today, the electronics industry has become one of the leading industries in developed countries in the world. Integrated circuits and electronic separation devices are the core of modern electronics industry technology and the foundation for the development of the electronics industry. The high-precision shaped tape is the basic material for separating devices and integrated circuit packaging. With the development of IC to high density, miniaturization, high power and low cost, the copper alloy of the lead frame is developing towards the requirements of thinner size, higher electrical and thermal conductivity, and higher strength. Existing electronic frame materials composed of copper alloy strips require that the cross-cut surface shape is not ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P23/04B22D11/16B22D11/04B21B1/08B21B37/48B21B37/46C21D9/00
Inventor 李广张永峰
Owner 宁波海王机电科技有限公司
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