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Composite nano silver paste and rapid sintering packaging method

A technology of rapid sintering and encapsulation method, applied in the direction of nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., can solve the problems of shortened device life, volume shrinkage, high cost, short heating time and reduced volume Shrinkage and the effect of little thermal influence

Inactive Publication Date: 2018-03-23
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a composite nano-silver paste and a rapid sintering packaging method, which aims to solve the problems of high cost of the existing nano-silver paste and shortened device life due to volume shrinkage under service conditions

Method used

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  • Composite nano silver paste and rapid sintering packaging method

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Comparison scheme
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Embodiment 1

[0028] Embodiment 1 A kind of composite nano-silver paste and rapid sintering packaging method, comprising:

[0029] (1) Mixing nano-silver particles with an average particle diameter of 50 nm and surface-coated polyvinylpyrrolidone into ethylene glycol to obtain a nano-silver paste.

[0030] (2) Glutaric acid and terpineol are dissolved in ethylene glycol, and mixed with nano-silver slurry, fully mechanically stirred and ultrasonically dispersed to obtain a composite nano-silver paste, wherein the total mass percentage of nano-silver particles is 74.7% , the mass percentage of glutaric acid is 0.3%, and the mass percentage of terpineol is 5%.

[0031] (3) Apply the obtained nano-silver paste on the surface of the copper substrate by dispensing, and align and stack to form a packaging structure.

[0032] (4) Use pulse thermocompression welding to heat and apply pressure to the area that needs to be interconnected. The heating temperature is 300°C, the heating time is 40s, and...

Embodiment 2

[0034] Embodiment 2 A composite nano-silver paste and a rapid sintering packaging method, comprising:

[0035] (1) Use 2.5% formic acid to clean micron silver flakes with an average of 2-5 μm, and use ethanol solution to wash and centrifuge several times to obtain clean micron silver flakes;

[0036] (2) Mix the nano-silver particles with an average of 50nm and a sodium citrate coating layer on the surface with the micro-silver flakes, and add a mixed solution of ethanol and ethylene glycol with a mass ratio of 1:4 to obtain a nano-silver paste , wherein the solid content of micron silver flakes is 20%.

[0037] (3) Dissolve abietic acid and polyvinyl alcohol into a mixed solution of ethanol and ethylene glycol with a mass ratio of 1:4, and mix them with nano-silver paste. After fully ultrasonically dispersed, use a planetary gravity stirrer to stir to obtain a composite Nano silver paste, wherein the total mass percentage of micron silver flakes and nano silver particles is ...

Embodiment 3

[0041] Embodiment 3 A kind of composite nano-silver paste and fast sintering packaging method, comprising:

[0042] (1) use the formic acid alcohol solution that is 2% by mass percent to clean the micron silver flakes with an average of 500nm, and use ethanol solution to wash and centrifuge several times to obtain clean micron silver flakes;

[0043] (2) Mix the nano-silver particles with an average of 13nm and a sodium citrate coating on the surface with the micro-silver flakes, and mix into a mixed solution of ethanol and propylene glycol with a mass ratio of 1:4 to obtain a nano-silver paste, wherein the micro-silver The solids content of the tablet was 10%.

[0044] (3) Dissolve abietic acid and ethyl cellulose into a mixed solution of ethanol and propylene glycol with a mass ratio of 1:4, mix with nano-silver paste, ultrasonically disperse and stir with a planetary gravity stirrer to obtain a composite nano-silver In the silver paste, the total mass percentage of micron ...

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Abstract

The invention provides a composite nano silver paste preparation method and a rapid sintering packaging method. The preparation method comprises steps that S1, cleaning treatment and centrifugation ofmicron silver sheets are carried out; S2, nano silver particles and an organic solvent are mixed into the micron silver sheets acquired in S1, and the ultrasonic process and stirring are carried out;and S3, an organic carrier and the surfactant are added to the mixed solution acquired in S2, and the ultrasonic process and stirring are carried out to acquire the composite nano silver paste. The packaging method comprises steps that S1, the silver paste is coated through dispensing or screen printing; S2, a chip coated with the composite nano silver paste and a substrate are aligned and stacked; and S3, hot press welding or ultrasonic hot press welding is utilized for sintering to complete interconnection. The method is advantaged in that rapid sintering and packaging of the composite nanosilver paste are realized, material cost is reduced, the preparation process is environmental friendly, the packaging process and the equipment are simplified, production efficiency is improved, energy saving and emission reduction are facilitated, volume contraction caused by continuous sintering in the service process of a nano silver paste sintering body can be reduced, service life and reliability of a packaging device are improved, and the method is suitable for high reliability low temperature packaging interconnection of high temperature electronic devices in the electronic packaging field.

Description

technical field [0001] The invention relates to the field of electronic packaging, more specifically, to a composite nano-silver paste and a rapid sintering packaging method. Background technique [0002] Due to the high surface energy and low melting point of nano-metal particles, in recent years, it has been proposed to use nano-metal sintering to package electronic chips at home and abroad. Among them, nano-silver paste with good electrical conductivity, thermal conductivity, ductility and high temperature resistance is widely used to complete high-temperature electronics. Low-temperature and low-pressure sintering packaging of devices plays an extremely important role in the field of microelectronics. [0003] However, the price of nano-silver is expensive, the sintering time is long and the porosity of the obtained sintered body is high. At the same time, the sintered body of nano-silver paste will continue to sinter due to the high temperature of the environment or the...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01L23/532B82Y30/00B22F1/00
CPCH01L23/53204H01L23/53242H01B1/22B82Y30/00B22F1/102B22F1/107
Inventor 杨帆祝温泊胡博曾令玥李明雨杨世华
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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