561results about How to "Simple packaging process" patented technology

A packaging structure of a semiconductor capacitive fingerprint sensor comprises a semiconductor sensor tube core, a groove type substrate made of insulation materials, a connecting wire, a connector assembly and an injection package structure. The sensor tube core is supported by and fixed at the bottom of a substrate groove through binding agents, the front face or the back face or the side face of the substrate groove is provided with a plurality of multilevel interconnection leads and contact through holes electrically connected between the multilevel interconnection leads, and a connecting welding disc formed by one or more conducting metal edge bars is printed on the grooved face of the substrate. The connecting wire is used for connecting pins of the sensor tube core and the connecting welding disc of the substrate, and the connector assembly is used for enabling the groove type substrate and a printed circuit board to be electrically connected. The connecting welding disc is connected with one or more grounding pins of the connection assembly through the interconnection leads arranged on the front face or the back face of the substrate and located between levels. One or more grounding pins of the connection assembly are electrically connected with the ground plane of the printed circuit board, and the tube core pins, the substrate conducting metal edge bars and the connection wire are packaged through the injection package structure.

The invention relates to a single component organic silicon packaging glue cured by ultraviolet for high-power LED and a preparation method thereof. The packaging glue is prepared by mixing a prepolymer component A containing acrylate polysiloxanes, a monomer component B containing acrylate polysiloxanes, a photosensitizer component C and a tackifier component D. The packaging glues obtained with different refractive indexes such as level 1.4, level 1.5 and the like are used for packaging multiple types of high-power LEDs or encapsulation of other optical purposes. By adopting ultraviolet curing, the invention enhances the packaging efficiency of the high-power LED product to a great extend without influencing the temperature tolerance, the discoloration and the light transmittance of the product.

The invention discloses a multichannel silicon substrate wavelength division multiplexing high-speed optical transmitting-receiving integral device which comprises a transmitting unit and a receiving unit, wherein the transmitting unit and the receiving unit are coupled with a planar optical waveguide chip; a wave division unit and a wave combining unit are arranged on the planar optical waveguide chip; the input end and the output end of the planar optical waveguide chip are respectively coupled with an input optical fiber and an output optical fiber correspondingly. On the basis of a silicon photon technique, a multichannel high-speed transmitting unit and a multichannel high-speed receiving unit are integrated, multiple transmission velocities can be compatible, the integration degree is increased, the sealing process is simplified, the cost is effectively lowered, and very high practical values are made.

The invention relates to a low-pressure injection molding encapsulation method of a polymer battery and a low-pressure injection molding polymer battery. The battery of the invention comprises a battery protecting board, a battery cell and an adhesive wherein the battery protecting board is welded with the positive pole and the negative pole of the battery cell; the adhesive frame is composed of a front side, a back side, a left side and a right side; the height of the adhesive frame is equivalent to the thickness of the battery cell; the battery protecting board is clamped on one side, which is provided with an electrode hole, of the adhesive frame; a plurality of convex ribs are arranged on the inner sides of the other three sides of the adhesive frame; the convex ribs abut against the corresponding side of the battery cell, so a gap is formed between the battery cell and the adhesive frame; and hot melt adhesive molded by low-pressure injection molding is filled in the residual space in the adhesive frame. The invention has the advantages of simple structure, low manufacturing cost, good mechanical property, low height of the battery, precise dimension and high realizability.

The invention relates to a novel solar cell packaging adhesive film. The adhesive film is prepared by the following steps of: adding various functional aids into a matrix material of poly(ethylene-co-methacrylic acid)ionomer, premixing, and casting. The adhesive film comprises the following components: 100 parts of poly(ethylene-co-methacrylic acid)ionomer, 0.1 to 1 part of hindered phenol antioxidant, 0.05 to 0.2 part of subphosphate complemental antioxidant, 0.2 to 1.0 part of ultraviolet absorber, 0.05 to 0.2 part of light stabilizer and 0.5 to 1.5 parts of tackifier. Compared with the traditional solar cell packaging material of ethylene vinyl acetate (EVA), the adhesive film is a thermoplastic material, and simple in packaging process, and facilitates repairing defected solar modules in the packaging process or in the using process to improve the utilization rate of precious cells; moreover, the adhesive film also has the characteristics of high transmittance and excellent yellowing resistance, and can make the service life of the solar modules longer.

The invention discloses an image sensor module and a forming method of the module. The image sensor module comprises a PCB substrate, a metal layer, an image sensing chip, welding protrusions and a signal processing chip. The PCB substrate is provided with a front face and a back face opposite to the front face, a hole penetrating through the PCB substrate is formed in the PCB substrate, circuit distribution is arranged in the PCB substrate, the metal layer is arranged on the front face of the PCB substrate, the metal layer is electrically connected with the circuit distribution, the image sensing chip is inversely arranged above the front face of the PCB substrate, the image sensing chip is provided with an image induction area and a bonding pad surrounding the image induction area which is arranged above the hole, the bonding pad is electrically connected with the metal layer, the welding protrusions are arranged on the surface of the metal layer, the signal processing chip is arranged on the back face of the PCB substrate, and the signal processing chip is electrically connected with the circuit distribution. The image sensing chip and the signal processing chip are separately arranged, the packaging process difficulty and the packaging cost are reduced, and the packaging performance of the image sensor module is improved.

The invention discloses Ce: YAG microcrystalline glass and application thereof in a white-light LED. The microcrystalline glass is prepared from the following raw materials in mole percentage: 19-24% of Y2O3, 33-39% of Al2O3, 28-40% of SiO2, 4-5% of ZrO2 and 3-5% of a fluoride nucleation agent; the preparation method of the microcrystalline glass comprises the following steps: (1) mixing glass materials; (2) melting glass materials, namely heating the glass materials in a crucible by virtue of a high-temperature resistant furnace, melting at a temperature is 1600-1700 DEG C, preserving heat for 2-5hr, pouring a glass melt on a cast iron mould, then annealing the glass melt in a high-temperature furnace, preserving heat at glass transition temperature Tg for 2-5hr and cooling with the furnace to 50 DEG C; turning off the power supply of the high-temperature furnace, automatically cooling to room temperature and taking out glass; and (3) carrying out insulation treatment, namely carrying out heat treatment on the glass in a precision annealing furnace at 1200-1400 DEG C for 1-10hr, cooling with the furnace to 50 DEG C, turning off the power supply of the precision annealing furnace, and automatically cooling to room temperature so as to obtain the semitransparent Ce: YAG microcrystalline glass.

The invention relates to a process for encapsulating a square flat outer-pin-free encapsulating structure. The encapsulating structure comprises a chip, a metal structure, a metal wire and a plastic encapsulating material; the encapsulating process comprises the following steps: manufacturing grooves with preset depth between adjacent inner pins and in connecting parts between the inner pins and other parts of the metal structure; adhering the chip to a preset position of the upper surface of the metal structure; connecting an input/output port of the chip with the inner pin which is positioned on the metal structure and corresponds to the input/output port through the metal wire; performing plastic encapsulation on the upper surface of the metal structure by the plastic packaging material so as to protect the chip, the metal wire and the upper surface of the metal structure; and thinning the metal structure upwards from the bottom plane of an encapsulating body with exposed metal after the plastic encapsulation so as to separate the adjacent inner pins and separate the inner pins from the other parts of the metal structure.

The invention relates to an LED (Light-emitting Diode) package unit, package methods thereof, and an array area light source. The LED package unit comprises an LED chip, a base plate for installing the LED chip, an optical thin film covering on the LED chip and a reflective layer, and a scattering component for uniformly scattering light emitted by the LED chip, wherein the base plate is covered with the reflective layer on an end face for installing the LED chip; a reflective piece is arranged at a position of the optical thin film along a vertical upper surface, corresponding to the LED chip; compared with an edge LED light guiding module, components such as a light guiding plate and a diffusion plate are omitted, so that the cost for manufacturing an area light source by utilizing the LED chip is effectively reduced. The invention also provides the array area light source, batch production is convenient, and the cost is reduced. The invention also provides two LED package methods, and through utilization of the LED package unit manufactured by the two methods, the cost for manufacturing the area light source by utilizing the LED light source can be effectively reduced.

The invention relates to a damping package material of epoxy resin group, which consists of component A and component B, wherein the component A is composed of 0-90 parts of bisphenol A epoxy resin, 0-60 parts of polyurethane epoxy resin, 20-90 parts of flexible epoxy resin according to part by weight, the component B is composed of 25-55 parts of aliphatic amine, 10-45 parts of aliphatic cyclic amine, 0-80 parts of versamid and 0-8 parts of silane coupling agent according to part by weight, the parts are mixed uniformly according to part by weight of A:B=100:15-100. The invention has the advantages that the mixture has good mobility, the solidification reaction is mild, the condensate has good mechanical property and good tensile shear strength with metals, the invention can resist high and low temperature impact, thermal aging and humidity heat aging, the condensate does not erode rigid aluminium alloy, steel, aldary and PVC plastics in sealed humidity heat condition, the solidification shrinkage ratio is low, with the damping coefficient (tan delta max>=0.5). Particularly, the invention has instantaneous high impact property and the operational temperature is from -54 DEG C to 70 DEG C.

The invention discloses a power type white LED based on a fluorescence lens, comprising an LED chip packaged by flip-chip bonding, an electrode, a reflective cup and a heat sink, wherein the fluorescence lens doped with light-emitting ions serves as a functional device with three functions of fluorescence conversion, optical light distribution and package protection. The invention has the technical effects that a glass-based fluorescence lens with high heat stability is adopted to realize more superior overall heat stability of the power type white LED; the heat dissipation efficiency and the light emitting efficiency of the LED chip are improved, thereby improving the overall light-emitting efficiency and the thermal stability of the power type white LED and overcoming the defect of coordinate drifting of illuminant colors brought by the fact that optical epoxy resin is easy to age and turn to yellow; and the package process has clear steps and is simple, therefore the overall package process of the power type white LED is simple and is easy to operate and realize.

The invention discloses a fused quartz micro-hemispheric resonance gyroscope packaged based on an SOI and a processing method of the fused quartz micro-hemispheric resonance gyroscope. The fused quartz micro-hemispheric resonance gyroscope packaged based on the SOI comprises a glass substrate, an SOI sealing shell, a fused quartz micro-hemispheric shell resonator, a micro-hemispheric shell support post, a reference electrode, 8 sensitive electrodes, 16 exciting electrodes, a round metal bonding pad and a cylindrical electrode through hole. The electrodes are located below a spherical shell lip, so that an eccentric error caused by a problem of bonding alignment accuracy when the micro-hemispheric shell resonator and the electrode are assembled can be avoided; and an outer lip edge is added to the spherical shell lip, so that the opposite area of the electrode and the spherical shell lip is increased and the detection accuracy can be improved. The advantages of an SOI wafer are fully utilized and the micro-hemispheric resonance gyroscope is packaged, so that the packaging technology of the whole gyroscope is greatly simplified; and the micro-hemispheric resonance gyroscope is provided with 8 sensitive electrodes and 16 exciting electrodes, so that an all-angle working mode can be adopted and the dynamic property of the micro-hemispheric resonance gyroscope is strengthened.

A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.

An apparatus for transporting a plurality of containers through a plurality of work stations including at least two conveyor assemblies, each conveyor assembly being adapted to sequentially convey at least one group of containers therealong in a row from one work station to another. The apparatus further includes a plurality of holder assemblies for holding the containers, some of the holder assemblies being associated with one of the conveyor assemblies and some of the holder assemblies being associated with the other conveyor assembly. The holder assemblies are located on the respective conveyor assemblies such that the plurality of containers are positioned adjacent to each other as they move through the plurality of work stations. A computer control system is programmable to control the coordinated operation of the conveyor assemblies so as to move such conveyor assemblies at different cycles of movement as the containers move through the work stations.

The present invention provides a functional solar cell module backboard which includes a backboard functional layer. The inner side of the backboard functional layer is provided with a packaging functional layer. The backboard functional layer comprises a base film layer whose one side is connected with the packaging functional layer, an adhesive layer on the other side of the base film layer, and a third layer at the outboard of the adhesive layer. The functional backboard has a packaging function, and packaging process and flow of solar cell are simplified. The invention also provides a manufacturing method of the backboard, melt extrusion process can be used, the backboard functional layer and packaging layer are directly combined, and production cost is reduced.

The invention discloses an image sensor module and a forming method of the image sensor module. The image sensor module comprises a PCB substrate, a metal layer, an image sensing chip, a signal processing chip and welding protrusions. The PCB substrate is provided with a hole penetrating through the PCB substrate, the metal layer is arranged on the surface of the PCB substrate, the image sensing chip is inversely arranged above the PCB substrate, the image sensing chip is provided with an image induction area and a bonding pad surrounding the image induction area which is arranged above the hole, the bonding pad is electrically connected with the metal layer, the signal processing chip is inversely arranged above the PCB substrate, the signal processing chip is electrically connected with the metal layer, and the welding protrusions are arranged on the surface of the metal layer. The packaging performance of the image sensor module is improved, and the production cost of the image sensor module is reduced.

The present invention relates to a micro-machining gas sensor and preparation method thereof, which includes tube base, substrates parts and connected parts to connect the tube base and substrates parts. Wherein, the substrates parts comprises of substrates, microelectrode on the substrates, low resistant gas-sensing material layer coated on substrates and microelectrode from bottom to top. Interval microelectrode bar is made on substrates by micro-machining technics, and low resistant gas-sensing material layer is coated on the substrates and microelectrode to form substrates parts which is electrified to work in heat insulation state. Required working temperature obtained by joule heat produced by resistance in series and electrified microelectrode of gas sensor of present invention without adding heating electrode or heating device, the encapsulation techics of device and complexity of subsequent conditioning circuit are predigested, preparation cost is reduced and produce efficient is improved. The present invention is suit for batch produce, and shortened elements area of the present invention realizes gas sensor miniaturization and element power consumption reduced.

The invention discloses an encapsulation structure of a silicon crystal microphone, which comprises a substrate, an electronic component set, a cover body, an insulated filling body and a conducting layer. The substrate has an upper surface and a lower surface. The electronic component set comprises a silicon crystal microphone arranged on the upper surface of the substrate. The cover is arranged on the upper surface of the substrate and covers the silicon crystal microphone. The insulated filling body is combined on the upper surface of the substrate and the circumference side of the cover body, and provided with a hole communicating with the upper surface of the substrate. In addition, the conducting layer is formed out of the insulated filling body, and the hole of the insulated filling body is provided with a conducting part so as to electrically connect with the substrate.