46results about How to "Simple packaging process" patented technology

The invention discloses a packaging assembly, a packaging method and a packaging device, and relates to the technical field of packaging. The packaging assembly comprises two first packaging pieces and two second packaging pieces. The first covering part and the second covering part are arranged in parallel in a spaced mode and oppositely arranged outside the two faces of the rectangular body, an inserting tongue is arranged at the end of the connecting part in a protruding mode, and the inserting tongue extends into the second packaging piece and is attached to the second side wall; the first shielding part and the second shielding part are arranged in parallel in a spaced mode and oppositely arranged outside the two faces of the rectangular body, a pressing tongue is arranged at the end of the first shielding part in a protruding mode and comprises a first pressing section and a second pressing section which are connected with each other, the first pressing section is arranged outside the connecting part in an attached mode, and the second pressing section is clamped between the inserting tongue and the connecting part. According to the packaging assembly, the packaging cost can be reduced under the condition that the packaging effect is guaranteed, economic benefits are improved, the situation that the edges of the rectangular body are damaged can be avoided, and the protection effect is good.

The invention discloses a manufacturing method of color electronic paper, the color electronic paper and a color display device. The manufacturing method of the color electronic paper comprises the following steps: manufacturing a driving layer, wherein the driving layer comprises a plurality of driving pixel units; manufacturing a capsule filter layer on the surface of the driving layer; the capsule light filtering layer comprises a plurality of capsule light filtering units; the capsule filtering units are in one-to-one correspondence with the pixel electrodes; each capsule light filtering unit comprises a color photoresist and a plurality of black and white electronic ink capsules filled in the color photoresist, and the plurality of capsule light filtering units form an R-color pattern, a G-color pattern and a B-color pattern; manufacturing a transparent electrode layer on the surface of the capsule filter layer; and manufacturing a transparent substrate or a waterproof layer on the surface of the transparent electrode layer. The color filter layer and the electronic ink capsule layer are combined into a whole, the total thickness of the color filter layer and the electronic ink capsule layer is reduced, the color cast phenomenon is avoided, and the display device has the advantages of being small in light resistance and high in segregation degree.

The invention relates to a hollow-core optical fiber connection method based on 3D printing, and the method comprises the steps: enabling a hollow-core optical fiber and a solid-core optical fiber to be inserted into a capillary glass tube which is dripped with photoresist in advance, carrying out the device processing and optical fiber fixation through the dripped photoresist, and achieving the effect of simplifying the packaging process flow. The air gap in the capillary glass tube can be automatically filled with the dropped photoresist, and air in the tube is extruded out of the tube, so that full-closed treatment of the connector is realized, and the situation that water vapor in the environment enters the tube to pollute the connector is avoided. The hollow-core optical fiber does not need to be heated or ground for sealing, and the condition that the air hole in the hollow-core optical fiber collapses can be avoided; the mode field converter between the hollow-core optical fiber and the solid-core optical fiber is processed by using the femtosecond direct-writing laser processing technology, so that the interconnection requirements between the hollow-core optical fibers and the solid-core optical fibers with various different mode field sizes can be met.

The invention discloses an optical coupling packaging device, and belongs to the technical field of optoelectronic integration. The optical coupling packaging device comprises an interposer which comprises an optical device, a cavity, a first alignment structure and a first coupling structure, the first alignment structure and the first coupling structure are located in the cavity, and the first coupling structure is connected with the optical device; and the first optical chip is at least partially located in the cavity, the first optical chip comprises a second alignment structure and a second coupling structure, the second alignment structure and the first alignment structure are mutually embedded, and the second coupling structure and the first coupling structure are in coupling connection. According to the invention, high-precision alignment can be realized, the alignment error is reduced, the process complexity is reduced, the cost is reduced, the stability of optical signal transmission is improved, and the optical signal transmission loss is reduced.

The present invention relates to the field of electronic packaging, and proposes a packaging method and system for realizing memory chips, the method comprising: first obtaining a chip to be packaged, performing an appearance inspection to select a chip with qualified appearance, then conducting an electrical performance test on the chip, classifying the chips according to the storage type to obtain a classified chip group, querying the packaging material, using a substrate to build a packaging infrastructure, installing the chip, bonding and fixing it, and sealing it to obtain a preliminary package, monitoring the packaging state after drying it, detecting potential defects and marking it to obtain a marked package, detecting performance indicators after repair, grading it to obtain a graded package, querying the grading process and generating a packaging report for the chip to be packaged, and realizing a complete process from chip detection to packaging, repair and report generation. The present invention can improve the packaging level of memory chip packaging.

The utility model relates to the technical field of battery packaging, in particular to a battery and electronic equipment.The battery comprises a shell assembly and a battery module, the shell assembly comprises a shell body and a limiting part, the shell body is provided with a containing space capable of containing the battery module, and the limiting part is arranged in the containing space and fixedly connected with the shell body; the first side wall of the shell body in the first direction and the limiting part are arranged at an interval in the first direction. When the battery module is located in the accommodating space, the two ends of the battery module in the first direction are limited by the first side wall and the limiting part respectively, so that the first battery protection plate can apply pressure pointing to the battery cell body to the top sealing edge. According to the battery and the electronic equipment provided by the invention, a process of fixing the top sealing edge and the battery protection plate through a bonding substance is replaced, multiple dispensing / rubberizing procedures in the battery packaging process are saved, the packaging process is simplified, the material consumption is reduced, and the stability of the battery packaging structure is improved.

The utility model discloses a kind of metal intelligent chip card packaging structures, including card base and chip module connected on card base, the card base at least includes upper structural layer, antenna layer and lower structural layer which are thin sheet and are sequentially laminated, the antenna layer is equipped with radio frequency antenna, the radio frequency antenna has at least two conductive contact parts, the card base is equipped with the mounting groove for accommodating chip module in the upper of conductive contact part, the mounting groove groove bottom is equipped with the conductive connection groove extending to conductive contact part downwards, the chip module bottom has the chip contact exposed after packaging, the conductive connection groove is equipped with the conductive material column in the lower part and conductive contact part conductive connection, upper part protrudes upwards and is connected with chip contact conductive connection, the utility model aims at overcoming the deficiency of prior art, provide a kind of metal intelligent chip card packaging structure with compact structure, strong stability.

The application discloses a packaging material, which comprises a weather-resistant layer, a supporting layer, a conductive layer and a buffer layer. The supporting layer is connected to one side of the weather-resistant layer, and the conductive layer is connected to the side of the supporting layer away from the weather-resistant layer. The conductive layer is a patterned layer, and the conductive layer comprises a hollow part. The projection of the hollow part on the supporting layer is defined as a hollow projection. The buffer layer is a patterned layer, and the buffer layer is configured to be at least partially inlaid in the hollow part of the conductive layer. The buffer layer is configured to be at least partially protruded from the conductive layer. The projection of the buffer layer on the supporting layer is defined as a buffer projection. The hollow projection and the buffer projection substantially coincide. By using the packaging material to package a photovoltaic module, the structure of the photovoltaic module and the process complexity during packaging can be simplified.

The invention discloses a universal structure for realizing 360-degree space light emitting of a white-light monochromatic light LED, and relates to the technical field of LED packaging, the universal structure for realizing 360-degree space light emitting of the white-light monochromatic light LED comprises an LED direct insertion support, an LED chip, a wire, a chip bonding material, an LED packaging colloid, a chip forming colloid and an auxiliary material, the chip bonding material is arranged on a solid crystal position of the LED direct-insertion support, the LED chip is fixedly connected with the LED direct-insertion support through the chip bonding material, the LED chip and the LED direct-insertion support form circuit connection through a wire, chip forming colloid is formed on the solid crystal position of the LED direct-insertion support in a dispensing mode, and the interior of the LED direct-insertion support is of an LED reflection cup or flat cup structure. And the chip forming colloid completely covers the LED chip and has a spherical crown-like shape, a hemisphere-like shape or an ellipse-like shape of a highlight center with a certain height, and the scheme solves the problems that an existing LED packaging structure does not have universality, the packaging process is complex, and the light quality level is low.

The invention relates to a low-voltage low-capacitance bidirectional transient suppression diode, and belongs to the field of diode design. A chip bonding area is arranged on the upper surface of the bottom of the inner cavity of the ceramic tube shell; bottom electrodes of the N + NP + N + structure transient suppression diode core and the P + PN + P + structure transient suppression diode core are welded on the chip bonding area in an eutectic mode. The pressure point is arranged on the upper surface of the inner cavity bottom of the ceramic tube shell; the top of the N + NP + N + structure transient voltage suppressor tube core and the top of the P + PN + P + structure transient voltage suppressor tube core are respectively bonded with the top of the pressure point through leads; the first tube shell pin is connected with the pressing point and then extends out of the lower surface of the ceramic tube shell; the second tube shell pin extends out of the lower surface of the ceramic tube shell after being connected with the chip bonding area; the invention adopts a simple NPN bipolar process and a PNP bipolar process to respectively realize integrated manufacturing of two paths of voltage stabilizing diodes and a common diode, and provides a low-voltage low-capacitance bidirectional transient suppression diode through a conventional dual-chip ceramic packaging process.

The invention discloses a method for preparing a graphene composite porous silicon-copper alloy negative electrode material by taking waste lithium battery negative electrode powder as a raw material, and relates to a method for high-valued utilization of a waste lithium ion battery graphite negative electrode. The invention aims to solve the technical problems that at present, waste lithium battery negative electrode graphite is treated as solid waste, and the volume of an existing silicon-based negative electrode is expanded. The waste lithium ion battery graphite negative electrode is prepared into the graphene composite porous silicon-copper alloy negative electrode material, resource recycling of the waste lithium ion battery graphite negative electrode is achieved, the production cost of the silicon-based negative electrode material is reduced, and the method has great significance in environmental protection and promotion of updating and iteration of the lithium ion battery negative electrode material. According to the method, the graphite negative electrode of the waste lithium ion battery can be utilized in a high-valued manner, and the method is of great significance for protecting the environment and saving resources; the electrostatic adsorption packaging process adopted by the invention is simple and can be applied to the industry on a large scale. The invention provides a new thought and solution for solving the problem of volume expansion of the silicon substrate.

A ceramic substrate power device package comprises a power transistor wafer, a drain electrode bonding pad is arranged on the bottom surface of the power transistor wafer, and a source electrode bonding pad and a switch control electrode bonding pad are arranged on the top surface of the power transistor wafer; the circuit board further comprises a ceramic substrate for bearing a wafer, the ceramic substrate comprises a top circuit layer and a ceramic substrate layer, the top circuit layer of the ceramic substrate forms an L-shaped top circuit layer through an etching process, and the thickness of one side, processed through the etching process, of the top circuit layer is small; the power transistor wafer is welded on the top surface of one side with smaller thickness of the L-shaped top circuit layer of the ceramic substrate through the drain electrode bonding pad; the insulating rubber material is filled around the power transistor wafer horizontally. The ceramic substrate is used as a drain electrode conductive pole piece of the power transistor wafer, a packaged drain electrode bonding pad, a cooling fin and a substrate at the same time; through the insulation performance and the high thermal conductivity of the ceramic substrate layer, a cooling fin can be directly arranged on the bottom circuit layer of the ceramic substrate, and the heat dissipation performance of the power device is improved.

The utility model belongs to the technical field of semiconductor devices, and discloses a discrete device packaging structure which comprises a heat dissipation support made of a conductive material, a chip and a plastic package body. The bottom of the chip is provided with a bottom electrode, and the top is provided with a top electrode; the heat dissipation support is provided with a first pin, the bottom of the chip is attached to the top of the heat dissipation support, and the bottom electrode is attached to the top of the heat dissipation support. The discrete device packaging structure further comprises metal connecting pieces, the bottoms of the metal connecting pieces and the tops of the top electrodes are attached and connected in a one-to-one correspondence mode, one end of each metal connecting piece extends out of the heat dissipation support to form a second pin, and the top face of the heat dissipation support, the chip and the portions, located on the heat dissipation support, of the metal connecting pieces are subjected to plastic packaging through the plastic packaging body. Therefore, heat dissipation efficiency can be improved, electrical connection reliability can be enhanced, parasitic inductance and capacitance can be reduced, signal transmission rate can be improved, and packaging height can be reduced.

The utility model discloses a chip packaging structure of a composite through hole adapter plate, and belongs to the technical field of semiconductor packaging. The metal rewiring layer III (430) comprises a silicon through hole pinboard monomer (10) and a low-density plastic package through hole (310) which form a composite through hole pinboard, and the metal rewiring layer II (420) is in telecommunication connection with the metal rewiring layer III (430) through a high-density silicon through hole (110) and the low-density plastic package through hole (310) respectively; the high-density pin chip (61) is packaged above the high-density silicon through hole (110), and the low-density pin chip I (63) and / or the low-density pin chip II (65) are / is packaged above the low-density plastic package through hole (310) and are / is fixedly connected with the metal rewiring layer III (430) in a telecommunication mode. The structure integrates the low-density pin chip and the high-density pin chip at the same time, and has good compatibility.

The invention provides a wafer-level large chip packaging method and packaging structure, and relates to the technical field of semiconductors, and the method comprises the steps: obtaining a wafer-level large chip; the wafer-level large chip is a chip structure formed by combining a plurality of different types of core particles or a plurality of single type of core particles; preparing a plurality of metal columns on the first surface of the wafer-level large chip according to the bonding point positions of the wafer-level large chip and the substrate; a glass adapter plate is prepared, the glass adapter plate comprises a plurality of glass through holes, and the positions of the glass through holes are in one-to-one correspondence with the positions of the metal columns; the metal columns on the first surface of the wafer-level large chip are inserted into the glass through holes of the glass adapter plate, so that the first surface of the wafer-level large chip is bonded with the first surface of the glass adapter plate; and bonding the second surface of the glass adapter plate with the substrate to obtain the packaging structure of the wafer-level large chip.

This invention belongs to the field of sandpaper production technology, specifically relating to a lamination and packaging system and method for dust-free ceramic dry sandpaper. The invention features a pre-assembly mechanism, a sandpaper feeding mechanism, a release liner feeding mechanism, and a lamination and packaging mechanism working collaboratively. The sandpaper and release liner feeding mechanisms respectively achieve precise, non-adhesive, and quantitative material delivery in a single layer, with precise material alignment achieved through a positioning structure. The pre-assembly mechanism utilizes vacuum adsorption and mechanical pressure to pre-assemble the double-layer sandpaper with the release liner, avoiding direct friction damage to the abrasive layers. The lamination and packaging mechanism employs a circumferential ring-shaped film formed by adhesive coating and curing. This invention effectively solves the problems of sandpaper shedding, scratches, and dust accumulation during the packaging process of high-hardness ceramic abrasive sandpaper, ensuring the performance of dust-free sandpaper, significantly reducing the cost of lamination and packaging consumables, and offering high efficiency and excellent alignment accuracy in automated assembly and lamination operations. It is suitable for the standardized mass production of high-precision dust-free ceramic dry sandpaper.

The optical module provided by the invention comprises a circuit board; the light receiving component is arranged on the circuit board and is used for receiving a receiving light signal comprising a plurality of wavelengths; wherein the light receiving part comprises a lens assembly, the lens assembly comprises a lens body, the lens body is provided with a containing groove, the bottom of the lens body is connected with the circuit board, and the containing groove and the circuit board form a containing cavity; one end of the lens body inputs and receives an optical signal, and a reflecting surface is arranged on the side wall of the accommodating groove and is used for reflecting the optical signal; the wave separator is arranged in the accommodating groove, and the wave separator receives the received optical signal and transmits the optical signal subjected to wave separation to the reflecting surface; and the light receiving chip is mounted on the circuit board and located in the accommodating cavity, and the light receiving chip receives the light signal reflected by the reflecting surface. According to the optical module provided by the invention, the packaging process of the optical receiving part is simple, so that the packaging of the optical receiving part is facilitated.

The utility model belongs to the technical field of LEDs, and discloses a novel quantum dot LED light source and an LED display screen, the novel quantum dot LED light source comprises a support, a blue light chip and a pouring layer, an installation space for accommodating the blue light chip is arranged in the support, the pouring layer is filled in the installation space and wraps the blue light chip, and the blue light chip is arranged in the installation space. The pouring layer comprises red light quantum dots, green light quantum dots and a copolymer, the copolymer wraps the red light quantum dots and the green light quantum dots, and according to the technical scheme, the packaging technology of the LED light source can be simplified, and the production efficiency and the light energy utilization rate can be improved.

The present application provides a multi-axis magnetic field sensor, which includes: a first magnetic conductor in a first direction, a second magnetic conductor located in the same plane as the first magnetic conductor, a first magnetic induction unit whose projection on the plane is located in the first air gap area, and a second magnetic induction unit whose projection on the plane is located in the second air gap area. The second magnetic conductor includes: a magnetic field input area in the second direction located at both ends of the second magnetic conductor and a magnetic field conversion area located between the two ends of the second magnetic conductor, and the magnetic field conversion area includes a conversion magnetic circuit in the first direction. The multi-axis magnetic field sensor can measure the magnetic induction intensity in the first direction and the second direction by using the first magnetic induction unit and the second magnetic induction unit with the same magnetic induction sensitivity direction, without rotating the magnetic induction unit, so that the packaging process is simpler.

The utility model relates to the technical field of optical modules, in particular to an optical transmitter. Comprising a transmitting module, an optical path adjusting module, a total reflection coupling module and an optical fiber module, the optical fiber module comprises an optical fiber and an insertion core assembly, and the optical fiber is connected to the insertion core assembly; the transmitting module comprises a plurality of transmitting assemblies and is used for transmitting multiple paths of light beams with different wavelengths; the multiple paths of light beams enter the total reflection coupling module after being subjected to light path adjustment by the light path adjustment module, and are coupled to an optical fiber after being converged by the total reflection coupling module so as to perform optical signal transmission; the wavelength division multiplexing device is formed through the optical path adjusting module and the total reflection coupling module, so that wave combination / wavelength division multiplexing is carried out on multiple paths of optical signals transmitted by the multiple transmitting assemblies, the multiple paths of optical signals are input into the same optical fiber to carry out signal transmission, the whole device is simple in structure and packaging technology, and the optical transmission efficiency is improved. In the communication link, only one optical fiber is needed to meet the signal transmission requirement, so that the production cost is effectively reduced.

The invention discloses a wafer-level Micro LED (Light Emitting Diode) chip packaging structure and a packaging method thereof. The wafer-level Micro LED chip packaging structure comprises a bearing substrate, a wafer-level Micro LED chip, a wafer-level Micro LED chip and a packaging substrate, the at least one LED chip and the at least one first electrode disc are arranged on the bearing substrate, each LED chip comprises a first chip electrode and a second chip electrode which are located on the two sides of the LED chip, the first chip electrode is adjacent to the bearing substrate and electrically connected with the first electrode disc, the second chip electrode deviates from the bearing substrate, and a second electrode disc is arranged on the second chip electrode; the second electrode disc is electrically connected with the second chip electrode; and the bonding pad surfaces of the first electrode plate and the second electrode plate, which deviate from the bearing substrate, are approximately positioned on the same horizontal plane relative to the bearing substrate. By the adoption of the packaging structure and the packaging method, the packaging process is simple, reliability is high, wafer-level efficient packaging and system integration of the Micro LED chip can be conveniently achieved, the packaged Micro LED chip integrated device is easily connected with an application substrate in an overall surface-mounting mode, and therefore production efficiency is greatly improved.

The utility model discloses a kind of multi-wavelength integrated PON ONU emission TO-CAN and multimode ONU BOSA, integrated emission TO-CAN includes a multi-wavelength integrated integrated laser chip, and multi-wavelength integrated integrated laser chip can output multiple emission wavelengths on the same coupling light path.The utility model further discloses a kind of single light path receiving scheme applied to PON ONU, cooperate integrated integrated emission TO-CAN, form a kind of new PON ONU BOSA.By using multi-wavelength laser chip and TO packaging technology, and single light path receiving scheme, reduce the cost of Combo ONU, further promote Combo ONU widely used in client, simplify the BOSA packaging process of Combo ONU, reduce the components required for multiple light source independent packaging.

The invention discloses a trademark paper with inner frame paper attributes for forming a hard cigarette box, and a packaging system and method. The trademark paper comprises a cover sheet tongue, a cover sheet front wall, a cover sheet top wall, a box body rear wall, a box body bottom wall and an inner frame paper front wall. The left end of the cover sheet front wall is connected to the cover sheet left wall, and the right end is connected to the cover sheet right wall. The upper left end of the box body rear wall is connected to the cover sheet left side wing, and the upper right end is connected to the cover sheet right side wing. The upper part of the left inner wing of the cover sheet is located on the left side of the cover sheet top wall, and the upper part of the right inner wing of the cover sheet is located on the right side of the cover sheet top wall. The middle and lower left end of the box body rear wall is connected to the box body left wall, and the middle and lower right end is connected to the box body right wall. The left end of the box body left wall is connected to the box body front wall. The left end of the inner frame paper front wall is connected to the inner frame paper left wall, and the right end is connected to the inner frame paper right wall. The present invention can save the inner frame paper cutting and conveying mechanism and the inner frame paper folding and positioning mechanism, the inner frame paper front wall, the inner frame paper left wall and the inner frame paper right wall are positioned more accurately, and the formed hard cigarette box is more solid.

This invention provides an all-solid-state ionized pressure sensor based on a gradient micro-pyramid array and a modulus-matched cross-linking interface, along with its fabrication method and applications, belonging to the field of sensor technology. The all-solid-state ionized pressure sensor of this invention includes a lower encapsulation layer, a lower electrode layer, a gradient micro-pyramid array dielectric layer, an upper electrode layer, and an upper encapsulation layer stacked sequentially. By constructing a modulus-matched cross-linking interface between the dielectric layer and the electrode layer, this invention effectively enhances the interfacial bonding strength between the multilayer structures, suppresses signal drift caused by interfacial slippage and delamination under cyclic loading and complex deformation conditions, and improves the signal stability and repeatability of the sensor during long-term operation and dynamic loading. Combined with a highly gradient-distributed micro-pyramid array structure synergistically constructed from fumed silica and an organic electrolyte, the dielectric layer achieves stepwise response and controllable deformation over a wide pressure range, broadening the linear response range of the ionized sensor.

The present invention relates to the field of packaging technology, and specifically to a packaging process for commemorative coins, which comprises the following steps: step 1, punching a receiving hole, using a mold to punch out a receiving hole for receiving commemorative coins on a carrier plate; step 2, printing, printing an anti-counterfeiting layer at the printing position of a transparent plastic film according to typesetting requirements, and leaving a blank position for displaying commemorative coins; step 3, cutting the transparent plastic film, cutting the transparent plastic film printed in step 2 into membranes of corresponding specifications according to the size of the carrier plate; step 4, installing the commemorative coins, loading the commemorative coins into the receiving hole of the carrier plate according to typesetting requirements, and then compounding the membranes cut in step 3 on both sides of the carrier plate, so that the blank positions of the membranes are aligned with the commemorative coins; step 5, punching out excess waste edges, and punching out finished product specifications. The present invention has simple process steps, high packaging efficiency, low cost, and good anti-counterfeiting effect.

The invention relates to a packaging body of a semiconductor tube core and a manufacturing method of the packaging body of the semiconductor tube core, and in the manufacturing method of the packaging body of the semiconductor tube core, in the process of preparing an initial packaging substrate, a second insulating layer and a second metal layer are respectively arranged on two first conductive circuit layers in a stacked manner; the second metal layer on the lower layer is patterned to form a first shielding layer, the first shielding layer is located below the conductive bonding pad, and then a second shielding layer is formed at the bottom of the second groove, so that the second shielding layer, the first conductive block and the first shielding layer are electrically connected, and the second conductive block and the first shielding layer are electrically connected. The first shielding layer and the second shielding layer effectively surround the first semiconductor tube core, so that the first semiconductor tube core can be effectively prevented from being interfered by electromagnetic interference.

This article provides a support ring and a catalyst. The support ring includes an annular support ring body, a thrust portion and an abutment portion. The support ring body is telescopically deformable in the axial direction. The thrust portion is provided at the first end of the support ring body in the axial direction. The abutment portion is provided at the second end of the support ring body in the axial direction. The abutment portion includes an abutment surface extending in the circumferential direction, and the abutment surface faces the side away from the support ring body. By providing a support ring structure that is telescopically deformable in the axial direction, the movement of the installed object in the axial direction can be limited, the assembly process requirements can be simplified, and the assembly efficiency can be improved. Applying the support ring to catalyst products can greatly simplify the packaging process of the catalyst and reduce the packaging cost of the catalyst.

The invention discloses a packaging structure and method capable of effectively reducing the fragility of a cutting channel in a glass core structure. According to the packaging structure and the packaging method, the problem of fragile cutting channels in the packaging process of the glass core structure can be effectively reduced, the packaging process of the whole glass core structure can be simplified while the smooth completion of the glass core packaging process is ensured, and the production cost is reduced.

The application provides a collimating device and a preparation method. The collimating device comprises a first substrate, a second substrate and a sealing material. The first substrate has a first sealing surface. The second substrate has a second sealing surface. The sealing material is arranged on the first sealing surface and / or the second sealing surface. The sealing material is solidified to form a borate glass sealing layer so that the first sealing surface and the second sealing surface are sealed by the sealing material. The sealing material comprises silica, alkali metal oxide, alkaline earth metal oxide, carbonate and water. The sealing material is in a fluid state before solidification.

The embodiment of the utility model discloses a light receiving and transmitting integrated single-tube packaging device. The light receiving and transmitting integrated single-tube packaging device comprises a base, a light-emitting chip, a power detector and a prism, wherein the light-emitting chip, the power detector and the prism are arranged on the base; the light-emitting chip and the power detector are located on the same plane; the prism is located above the light-emitting chip, the prism is of a parallelogram structure, and part of light emitted by the light-emitting chip is reflected to the power detector through the prism.