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16results about How to "Light attenuation is small" patented technology

Gyrator and method for plant microgravity effect simulation

PendingCN119262350Aprevent fallingavoid damage
The invention relates to a gyrator and method for plant microgravity effect simulation, the gyrator comprises a main body box and a movable light source, the main body box comprises a plurality of modules spliced in series, the modules are provided with a plurality of clamps, and the clamps are used for placing plant culture containers and driving the plant culture containers to rotate; the movable light source is arranged on the front side of the main body box, the distance between the movable light source and the main body box is adjustable, and the movable light source is used for providing illumination for the plant sample. The device has the beneficial effects that the technical problem that the existing domestic microgravity simulation device cannot perform large-scale measurement and development condition tracking on mature plants is solved, and the experimental materials for the existing simulator are animal cells, plant seedlings, single plant adult seedlings and the like; and large-scale microgravity simulation of the overground part of the mature plant in a unified environment cannot be met. By means of the gyrator, the growth and development reactions of the overground parts of various plants under microgravity can be tested in batches.
Owner:CHINA AGRI UNIV

Light-emitting lamp box with multi-aluminum-profile combined structure

The light-emitting lamp box of the multi-aluminum-profile combined structure comprises an outer frame, a support is fixed to the back of the outer frame, the bottom of the support is connected with a base, and a detachable picture box body is arranged in the outer frame; the picture box body comprises a box door and a box body shell, the box door comprises a box cover door and a canvas door, one side of the box cover door is rotationally connected with one side of the box body shell through a stainless steel row chain, and one side of the canvas door is rotationally connected with one side of the box cover door through another stainless steel row chain; the rotating directions of the box cover door and the canvas door are opposite; the box body shell comprises a plurality of LED lamps irradiating forwards, a cam lock is arranged on the other side of the box body shell, a lock catch groove matched with the cam lock is arranged on the other side of the box cover door, and opening and closing of the box cover door are achieved by rotating the cam lock. A replaceable picture is arranged in the canvas door, and the middle position of the box cover door is of a transparent structure through which the replaceable picture can be seen. According to the invention, the convenience of picture replacement, the high efficiency of repair and maintenance and the flexibility of assembly type production are integrated.
Owner:SHANGHAI KONGBO IND

Light injection and series welding integrated equipment

ActiveCN222509898Ureduce storage timeLight attenuation is smallFinal product manufactureMetal working apparatusContinuous lightElectrical battery
The utility model relates to light injection and series welding integrated equipment. The light injection and series welding integrated equipment comprises a first material moving device, a material storing device, a light injection device, a second material moving device and a series welding device. The material storage device is used for storing battery pieces to be subjected to light injection, the first material moving device is used for transferring the battery pieces in the material storage device to the light injection device, the light injection device is used for carrying out light injection on the battery pieces, the second material moving device is used for transferring the battery pieces subjected to light injection to the series welding device, and the series welding device is used for carrying out series welding on the battery pieces. According to the light injection and series welding integrated equipment, continuous light injection and series welding treatment can be integrally carried out on the battery piece, the storage time of the battery piece after light injection can be shortened, and the light attenuation of the battery piece after light injection is reduced.
Owner:TONGWEI SOLAR (HEFEI) CO LTD

Lamp heat dissipation structure

The utility model discloses a heat dissipation structure of a lamp, which comprises a shell and a heat dissipation sheet arranged on the back of the shell, and is characterized in that the heat dissipation sheet is provided with a plurality of upward wave-shaped raised lines, and a first air channel is formed between every two adjacent wave-shaped raised lines. Due to the arrangement of the wave-shaped protruding strips in the lamp heat dissipation structure, the contact area between the lamp heat dissipation structure and air and air flow is greatly increased, heat generated by a light source is rapidly dissipated out through the heat dissipation structure, the light source is rapidly cooled, the heat dissipation effect is better, meanwhile, light attenuation is reduced, and the service life of the lamp is prolonged.
Owner:萤尔光电有限公司

UV lamp bead structure with fluorescent agent component detection and white light supplement functions

The utility model discloses a UV lamp bead structure with fluorescent agent component detection and white light supplement functions, which comprises a light distribution and color modulation assembly, an LED packaging support and a chip assembly, the light distribution and color modulation assembly is mounted at the upper end of the LED packaging support, the chip assembly is mounted inside the LED packaging support, the LED packaging support comprises a support shell, a deep cup opening and a bonding pad support, and the bonding pad support is mounted on the support shell. The deep cup opening is formed in the middle of the support shell, the bonding pad support is arranged in the support shell in an injection molding mode and comprises an anode bonding pad and a cathode bonding pad, the cathode bonding pad is installed at the lower end of the UV chip, and the upper end of the anode bonding pad is connected with the rear end of the gold wire. According to the utility model, by adopting the UV chip packaging structure, the light loss is effectively reduced, and the light attenuation is reduced; by dispensing the high-density fluorescent glue on the surface of the UV chip, yellowing of the lens and the glue after a long time is avoided; the deep cup opening in the LED packaging support is used for gathering light and increasing light intensity, and then the lens is used for gathering light, so that emitted light is more concentrated.
Owner:SHENZHEN HONGYU TECHNOLOGY CO LTD

A core-shell quantum dot for inhibiting Auger recombination and its preparation

PendingCN122080931ASuppression of Auger recombination effectImprove luminous efficiencyMaterial nanotechnologyNanoopticsQuantum dotNanocrystal
This invention proposes a simple and easy-to-operate method for preparing core-shell quantum dots that suppress Auger recombination, and develops Mn-doped CsPbCl3@Cs4PbCl6 core-shell nanocrystals. The Auger suppression performance was studied using wavefunction engineering. The method includes the following steps: ① Synthesizing CsPbCl3 nanocrystals via thermal injection. ② Forming a Cs4PbCl6 shell nanocrystal on the CsPbCl3 nanocrystals. An oleic acid solution containing Cs is added to the CsPbCl3 nanocrystals; Cs ions tend to react with free Pb ions, and the Cs4PbCl6 shell nanocrystals grow epitaxially on the surface of the CsPbCl3 core nanocrystals. ③ Injecting a MnCl2 precursor into the pre-synthesized core-shell nanostructure at room temperature yields highly efficient Mn-emitting nanocrystals with promising applications in optoelectronics, generating significant social and economic benefits.
Owner:DALIAN INSTITUTE OF CHEMICAL PHYSICS CHINESE ACADEMY OF SCIENCES

LED lamp with radiator

The utility model relates to the technical field of LED lamps, and discloses an LED lamp with a radiator, which comprises a bottom plate, four corners inside the bottom plate are respectively provided with two first springs, the upper ends of the two first springs are respectively and fixedly connected with a connecting block, the end face of one side of each connecting block is fixedly connected with a limiting frame, and the limiting frames are fixedly connected with the radiator. The upper ends of the interiors of the two limiting frames are fixedly connected with limiting blocks correspondingly, and the two sides of the lower ends of the two limiting frames are rotationally connected with fixing blocks correspondingly. When the LED lamp panel fixing device is used, the limiting blocks at the lower end of the limiting frame are matched with the limiting grooves in the upper end of the LED lamp panel, and the clamping blocks enter the clamping grooves through rotation of the fixing blocks, so that the LED lamp panel is stably fixed to the upper end of the bottom plate, the stability of the LED lamp panel is enhanced, and the fault risk caused by vibration or looseness is reduced; and when the LED lamp panel is damaged, the lamp panel can be quickly pulled out for replacement only by rotating the fixing block, so that the maintenance time is greatly shortened, and the maintenance efficiency is improved.
Owner:GUANGDONG CHANGYAO OPTOELECTRONICS TECH CO LTD

A surface-mount high-power RGB LED chip

This utility model discloses a surface-mount high-power RGB LED chip, relating to the field of lighting technology. It includes: a bracket on which multiple LED chips are connected via wire bonding; and an IC control chip, where the multiple LED chips are connected in series to the electrodes of the IC control chip. The IC control chip outputs signals to control the color switching and gradation of all LED chips, making each LED chip an independent pixel. The multiple LED chips employ a 3-pin or 6-pin series structure, reducing current by increasing voltage to decrease heat and increase power. This surface-mount high-power RGB LED chip, through flexible series connection of LED chips and a highly efficient heat dissipation thermoelectric separation structure, significantly improves the power and brightness of the LED chip, meeting the needs of automotive lights, stage lights, and special lighting products for high-brightness illumination and rich lighting effects.
Owner:深圳腾杰光电科技有限公司

Film coating method of silicate fluorescent powder

The invention belongs to the technical field of fluorescent powder, and particularly relates to a coating method of silicate fluorescent powder. Comprising the following steps: (1) stirring and mixing silicate fluorescent powder, methyl silicone oil and a diol solvent I in proportion, pouring out supernatant after the mixture is settled, drying and sieving to obtain first powder; (2) adding the first powder into a diol solvent II, dropwise adding one or more of octyltrimethoxysilane, dodecyltrimethoxysilane, hexadecyltrimethoxysilane and 3-epoxypropyltrimethoxysilane for several times under a stirring condition, continuously stirring for 1-3 hours after dropwise adding is finished, and pouring away supernatant liquid after sedimentation, so as to obtain first powder; and drying and sieving. According to the coating method, a layer of transparent hydrophobic oil film can be formed on the surface of the fluorescent powder, so that the luminous decay of the fluorescent powder is reduced under the condition that the luminous efficiency of the silicate fluorescent powder is maintained.
Owner:YANTAI HILD MATERIAL TECH CO LTD

LED lamp bead

ActiveCN224192365Ulower working temperatureLight attenuation is smallThermodynamicsLED lamp
The utility model relates to the technical field of LED lighting, in particular to an LED lamp bead which comprises a substrate, the substrate is of a multi-layer composite structure, the substrate is sequentially provided with a heat conduction layer, an insulation layer and a heat dissipation layer from top to bottom, an LED chip is arranged on the upper surface of the heat conduction layer, a transparent packaging layer covers the LED chip and the heat conduction layer, a plurality of heat dissipation protruding points are arranged on the outer surface of the packaging layer, and the heat dissipation protruding points are arranged on the outer surface of the packaging layer. The heat dissipation protruding points are distributed in an array mode and used for increasing the surface area of the packaging layer and promoting heat to be dissipated to the surrounding environment, heat dissipation fins are attached to the surface of the heat dissipation layer, a plurality of micro grooves are formed in the surfaces of the heat dissipation fins and evenly distributed in the length direction of the heat dissipation fins, and a plurality of heat dissipation channels are further formed in the heat dissipation layer. And the plurality of heat dissipation channels are connected with the heat dissipation fins.
Owner:JIANGSU XINGUANGLIAN TECHNOLOGY CO LTD

A full spectrum LED lamp bead

ActiveCN110880494BRich in spectral componentsReduce the phenomenon of luminous rate dropSolid-state devicesSemiconductor devicesEpoxyGreen yellow
The present invention discloses a full-spectrum LED lamp bead, including a light-emitting chip, a bracket for placing the light-emitting chip, and a fluorescent glue for encapsulating the light-emitting chip and allowing the light emitted by the light-emitting chip to pass through and emit; the light-emitting chip includes a blue light chip and a purple light chip, the wavelength of the blue light chip is 440nm-470nm, and the wavelength of the purple light chip is 400nm-420nm; the fluorescent glue is composed of silica gel or epoxy resin glue mixed with fluorescent powder, and the fluorescent powder includes red fluorescent powder, yellow-green fluorescent powder and blue fluorescent powder, the excitation wavelength of the red fluorescent powder is 615nm-660nm, the excitation wavelength of the yellow-green fluorescent powder is 520nm-540nm, and the excitation wavelength of the blue fluorescent powder is 445nm-455nm. The present invention has the advantages of low energy consumption, high color rendering index, high brightness, more beneficial to human health and environment, and closer to sunlight.
Owner:GUANGDONG TIANJI OPTOELECTRONICS CO LTD

A PIS screen control unit and a PIS screen control system

ActiveCN224720584Ufast scanningwith no flicker
The utility model discloses a PIS screen control unit and PIS screen control system belong to PIS screen technical field, include: microprocessor, ethernet communication module, ethernet communication unit configuration is microprocessor passes through ethernet communication unit and receives display data and uploads operation state, font library module, font library unit configuration is for microprocessor provides the dot matrix information of chinese character, clock module is connected with microprocessor, clock unit configuration is provide time information, simulation debugging interface module is connected with microprocessor, simulation debugging interface module configuration is simulation debugging and on -line programming, data interaction module, this PIS screen control unit and PIS screen control system are used for driving LED dot matrix's scanning speed is fast enough, does not exist tailing, flicker, scanning speed is not enough fast etc.
Owner:NANJING XINCHENG MODERN TRAM CO LTD

Fluorescent epoxy adhesive film for epoxy CSP (Chip Scale Package) lamp bead as well as preparation method and application of fluorescent epoxy adhesive film

The invention relates to the technical field of CSP (Chip Scale Package), in particular to a fluorescent epoxy adhesive film for an epoxy CSP lamp bead as well as a preparation method and application of the fluorescent epoxy adhesive film. The transparent liquid epoxy glue at least comprises the following preparation raw materials: an epoxy resin solution, a curing agent, a defoaming agent, an antioxidant, an anti-precipitating agent and a catalyst, the epoxy resin solution at least comprises organic silicon modified epoxy resin, a trifunctional epoxy compound and epoxy resin containing an alicyclic structure; the melt viscosity of the epoxy resin solution at 150 DEG C is 400-1000 Pa.s, the problems that existing organic silica gel water is low in hardness during actual packaging and low in bonding force with subsequent epoxy resin are solved, the product yield of subsequently prepared CSP lamp beads is increased, and meanwhile the aging resistance of the CSP lamp beads is guaranteed.
Owner:TECORE SYNCHEM