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541results about How to "Light attenuation is small" patented technology
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LED (Light Emitting Diode) lamp filament and manufacturing method thereof
ActiveCN104600174AImprove thermal reliabilityMaximum Thermal ReliabilitySemiconductor devicesFluorescenceConductive coating
The invention provides an LED (Light Emitting Diode) lamp filament and a manufacturing method thereof. An LED chip is encapsulated on the edge top surface of a thin and long sheet metal support of the LED filament innovatively, meanwhile the sheet metal is inserted into a preformed transparent plastic model frame to produce a light source, and accordingly the automated continuous production of the LED lamp filament is implemented and the problem of the facing direction strength caused by the too thin and too long metal support is solved due to the transparent plastic model frame; meanwhile the lateral direction strength of the metal support is effectively utilized and accordingly the integral mechanical strength of the LED lamp filament is ensured; the heat dissipation characteristics of the metal is directly utilized, meanwhile the heat dissipation efficiency of the LED chip is maximized through the innovative encapsulation of thermal conductive coatings, and accordingly the problem of a heat dissipation bottleneck of the LED lamp filament is effectively solved, the LED lamp filament can work at the rated power for a long time, and the cost is reduced; the LED light extraction efficiency is improved, the light attenuation is reduced, the high lighting effect and ambient light of lamp filament light emission is implemented, and the market vacancy of the existing LED lamp filament is filled through innovative fluorescence encapsulation materials.
Owner:DONGGUAN RIWEI ELECTRONICS
Light emitting diode bulb with central axis bidirectional convection heat dissipation structure
InactiveCN104728631AReduce the temperatureLight attenuation is smallPoint-like light sourceElectric circuit arrangementsCouplingConvection heat
An LED bulb includes a lower cover having ventilation holes formed at outer periphery thereof, and a first coupling opening formed at top side thereof; a separating unit provided within the lower cover at a position between lower edges of the ventilation holes and bottom side of the lower cover, and having a convection pathway formed at top side thereof; a heat sink having bottom end positioned on top side of the separating unit; and an upper cover having top side formed with convection hole corresponding to top end of the heat sink, and a second coupling opening formed at bottom side thereof. When the second and first coupling openings are coupled with each other, the upper and lower covers are assembled together to form a central axis bidirectional convection heat dissipation pathway sequentially through the ventilation hole, the convection pathway, the heat sink and the ventilation hole accordingly.
Owner:SKYNET ELECTRONICS
Single component organic silicon packaging glue cured by ultraviolet for high-power LED
InactiveCN101747860ALight attenuation is smallHigh light transmittanceOther chemical processesAdhesivesUV curingPhotosensitizer
The invention relates to a single component organic silicon packaging glue cured by ultraviolet for high-power LED and a preparation method thereof. The packaging glue is prepared by mixing a prepolymer component A containing acrylate polysiloxanes, a monomer component B containing acrylate polysiloxanes, a photosensitizer component C and a tackifier component D. The packaging glues obtained with different refractive indexes such as level 1.4, level 1.5 and the like are used for packaging multiple types of high-power LEDs or encapsulation of other optical purposes. By adopting ultraviolet curing, the invention enhances the packaging efficiency of the high-power LED product to a great extend without influencing the temperature tolerance, the discoloration and the light transmittance of the product.
Owner:陈俊光
White Semiconductor Light Emitting Device and Method for Manufacturing the Same
InactiveUS20090236622A1Light attenuation is smallImprove external quantum efficiencySolid-state devicesSemiconductor/solid-state device manufacturingQuantum efficiencyEngineering
An LED chip (2) emitting blue light is mounted on an insulating substrate (1) at both ends of which electrode films (11, 12) are formed, and a pair of electrodes of the LED chip (2) is electrically connected to the pair of electrode films (11, 12) respectively by connection means (3). On the LED chip (2), there are provided a first resin layer (4) made of resin containing a red color conversion member (4a) for converting blue light into red light and provided so as to coat substantially half of the LED chip (2) and to be in close contact with the LED chip (2), and a second resin layer (5) made of resin containing a green color conversion member (5a) for converting blue light into green light and provided so as to coat similarly the other substantially half of the LED chip (2). As a result, it is possible to attach the resin containing light color conversion members directly to the LED chip in such manner that the red and green light color conversion members are not mixed with each other and obtain a white semiconductor light emitting device having high external quantum efficiency.
Owner:ROHM CO LTD
Automatic control method for tunnel LED lighting based on intelligent expert illuminance curve
InactiveCN101938878AOptimize safe and energy-saving operationExtended service lifeElectric light circuit arrangementAutomatic controlLight equipment
The invention belongs to the technical field of lighting equipment in a tunnel, and relates to an automatic control method for tunnel LED lighting based on an intelligent expert illuminance curve. The method comprises the following steps: 1) detecting brightness outside the tunnel to obtain a brightness value outside the tunnel, and compensating the brightness value to obtain the brightness at an inlet section; 2) dividing transition sections, and setting an initial brightness reference value of each section based on the brightness at the inlet section; 3) establishing an expert database, reasoning input information such as tunnel length, tunnel height, the brightness outside the tunnel, running speed, traffic flow and traffic modes, and adjusting the corresponding brightness reference value of each section; 4) carrying out smooth processing on brightness distribution of the transition sections; 5) generating a complete dynamic brightness demand curve; and 6) realizing brightness feedback adjustment on the overall LED tunnel lamps according to the brightness demand curve and part of brightness detection values in the tunnel. The automatic control method of the invention can prolong service life of the lamps in the tunnel, reduce maintenance cost and save energy consumption.
Owner:TIANJIN UNIV
Gallium and indium doped single crystal silicon material for solar battery and preparation method thereof
ActiveCN101805925AReduce precipitationReduce crystal defectsPolycrystalline material growthBy pulling from meltIndiumHearth
The invention discloses a gallium and indium doped single crystal silicon material for a solar battery, which consists of the following components according to atom number per cubic centimeter of the single crystal silicon material: 1.0X10<14> to 1.0X10<18> gallium, 5.0X10<12> to 5.0x10<16> indium and the balance of single crystal silicon. The invention also discloses a method for preparing the gallium and indium doped single crystal silicon material for the solar battery, which is implemented by the following steps of: dismantling a furnace by using a regular method, cleaning a hearth and assembling the furnace; vacuumizing the inside of a single crystal furnace and detecting the leakage of the single crystal furnace by using a regular method; pressuring materials and smelting the materials; stabilizing the melt; seeding crystals; performing shouldering; performing shoulder rotation; performing isodiametric growth; performing ending and cooling the obtained product; and stopping the furnace. The gallium and indium doped single crystal silicon material for the solar battery has the advantages of high conversion efficiency, low light attenuation, low oxide content in the single crystal silicon and uniform radial distribution in a single crystal silicon rod; and the preparation method of the invention effectively controls the thermal conversion of silicon melt and grows the high-quality gallium and indium doped single crystal silicon material for the solar battery.
Owner:LONGI GREEN ENERGY TECH CO LTD
Germanium-doped directionally solidified casting monocrystalline silicon and preparation method thereof
InactiveCN101591808AHigh mechanical strengthReduce dislocation densityPolycrystalline material growthFrom frozen solutionsSolar cellDislocation free
The invention discloses germanium-doped directionally solidified casting monocrystalline silicon, which contains boron, gallium or phosphorus with the concentration of between 1*10 and 1*10 / cm and germanium with the concentration of between 1*10 and 5*10 / cm. The invention also discloses a preparation method for the germanium-doped directionally solidified casting monocrystalline silicon, which comprises the following steps: placing polycrystalline silicon, the germanium and an electroactive doping agent on a dislocation-free monocrystalline silicon block paved on the bottom of a crucible; completely melting the polycrystalline silicon, the germanium and the doping agent and partially melting the dislocation-free monocrystalline silicon block by thermal field regulation; and performing directional solidification by heat exchange, and using a part of unmelted dislocation-free momocrystalline silicon block as a seed crystal to induce to grow the germanium-doped casting monocrystalline silicon from bottom to top. The product has strong mechanical strength and long minority carrier lifetime, can be used for preparing a high efficiency wafer solar cell, and greatly reduces the production cost.
Owner:ZHEJIANG UNIV
Solar yard lamp device being convenient for cleaning solar panels and easy to adjusting lamp direction
ActiveCN106090807AAvoid scratchesAvoid damagePhotovoltaic supportsSolar heating energyEffect lightEngineering
The invention relates to a solar yard lamp device being convenient for cleaning solar panels and easy to adjusting lamp direction. The solar yard lamp device comprises a column arranged in the vertical direction, wherein the left side of the top of the column is provided with a box body through a rotary hinge structure and an automatic retractable adjusting mechanism; the top of the box body is provided with a heat insulation plate; solar panels are spread on the heat insulation plate; a storage battery, a voltage stabilizer, a remote signal receiver and an intelligent controller are arranged in the box body; the lower surface of a mounting plate is provided with a fixed block; a ball is rotatablely arranged in the fixed block; the bottom of the ball is connected with an LED (light-emitting diode) illuminating lamp through a connecting rod; an electric push rod is arranged between the mounting plate and the LED illuminating lamp; and the box body is provided with an automatic reciprocating wiping unit for wiping the solar panels. The solar yard lamp device can make automatic adjustment on the irradiation direction of the LED illuminating lamp according to the inclination angle of the solar panels so as to adapt to the lighting demands of the yard, and can automatically clean the solar panels; and the solar panels are integrally installed on the storage battery, thereby avoiding the exposure of the circuit, and prolonging the service life of the components.
Owner:西藏世峰高科能源技术有限公司
White light LED and packaging method thereof
InactiveCN1838440AImprove stabilityHigh color rendering indexSolid-state devicesSemiconductor devicesFluorescenceSilica gel
This invention relates to LED field, which discloses a white light LED and its packaging method. The white light LED includes chip, frame, silicon glue, fluorescence power film and periphery parts (such as lens). Difference between the packaging structures is that the space between the fluorescence power and chip is isolated by some materials such as silicon glue, which makes the heat of the fluorescence power and chip isolate; and the fluorescence power film brim contacts with the substrate, which makes the fluorescence power's heat conduct to the exterior to avoid the gather of fluorescence power heat. The chip is fixed on the frame, the silicon glue covers on the chip directly, the designed and prepared fluorescence power film cover on the silicon glue, and the fluorescence power film contact with the cup bowl. This method improves the light producing efficiency, and improves the stability of the light color greatly, and lowers the light decline. And the packaging method is simple, which is fit for industrial production in large scale.
Owner:SUN YAT SEN UNIV
Multi-light source LED road lamp
InactiveCN101329022AExtend your lifeLight attenuation is smallPoint-like light sourceElectric circuit arrangementsSource transformationLuminous intensity
The invention provides a high-power LED street light which can be simultaneously provided with one or two LED light source modules, being composed of a heat transfer and dissipation system, a luminescence and light distribution system, a power source transformation system and a lamp shell, wherein, the heat transfer and dissipation system consists of a heat conducting substrate of the LED light source module, a heat conducting adhesive and a radiator integrated with an upper shell; the luminescence and light distribution system consists of the luminous surface of the LED light source module, a sealing ring, a reflecting shade, a light distribution lens and a transparent lampshade; the power source transformation system consists of a power source incoming line, a rectification drive controller, a power source outgoing line as well as the positive and negative terminals of the LED light source module. The structure of the invention can effectively enhance the luminous intensity of a single lamp, simultaneously, the radiating structure of the lamp is more beneficial to heat dissipation, which causes an LED chip to work under the appropriate temperature environment, thus achieving the aims of prolonging the service life of the lamp and reducing the photodegradation of the lamp.
Owner:KUSN TAIDELONG MACHINERY
Ceramic package light-emitting diode an dits package method
InactiveCN1588652AIncrease brightnessStrong resistance to high and low temperature impactSemiconductor devicesEngineeringLight-emitting diode
The light-emitting diode consists of a base board, at least a LED chip and packaged element packaged on the chip. The base board is made of ceramics, there is a hollow package cavity that inside wall is chambered surface tilting outward to form a reflecting circle no the LED chip, LED chip is fit on the package cavity, in the package cavity on the base board, there is at least a first electrode and a second electrode, they are extended separately to bottom of ceramics base boards. The invention is also provides a method for packaging LED by ceramics.
Owner:SHENZHEN REFOND OPTOELECTRONICS
Lamp light source assembly and illuminating assembly for road lamp illumination and lamp for illumination
ActiveCN106939988AAvoid disadvantagesSmall installation volumeMechanical apparatusElectric circuit arrangementsRubber ringSodium-vapor lamp
Owner:HUZHOU MINGSHUO OPTOELECTRONICS TECH CO LTD
White light emitting diode and white light emitting diode lamp
InactiveCN101881381AGood colorImprove efficiencyPoint-like light sourceElectric circuit arrangementsElectricityHeat conducting
The invention discloses a white light emitting diode with high color rendering property and a white light emitting diode lamp. The white light emitting diode comprises a heat conducting substrate, a light reflecting cup, a light emitting diode chip and a lead wire frame, wherein the light reflecting cup plays a light mixing role, and small protrusions are arranged on the inner wall surface of the light reflecting cup; the light emitting diode chip outputs at least six lights in different colors and is arranged on the heat conducting substrate to carry out electric combination; the lead wire frame is matched with the bottom of a light emitting cup in shape and size, arranged outside the light reflecting cup, and fixed on the upper surface of a base; an electrode of the chip is electrically connected with a lead wire on the lead wire frame, and a transparent optical material is covered on the chip; and polychromatic lights are evenly mixed through the diffuse reflection of a reflecting wall of the light reflecting cup to produce the white light emitting diode with high color rendering property and high efficiency. By applying the white light emitting diode lamp made of the white light emitting diode and a flat light source, the white light emitting diode lamp eliminates the light energy loss of fluorescent powder in the photochromic conversion process, thereby having high electro-optical conversion efficiency, long service life and convenient batched production.
Owner:宁波晶科光电有限公司
Semi-transparent ceramic arc tube and its producing method
InactiveCN101005003AHigh dimensional accuracySimple processVessels or leading-in conductors manufactureGas discharge lamp detailsMetalLight effects
The ceramics arc tube includes columniform main body, and ball ends at two ends of the main body. Central tip at the ball end is extended outward to form capillary, which is a hollow tube passing through the ball end. The method includes steps: adding 0.005-0.5% magnesia to superfine alumina powder in high purity, and mixing it to organic binder, carrying out granulating procedure; using the mixture to prepare main body, and ball ends by injection molding; assembling the main body, and two ball ends, and after degreasing it at low temperature and pre-sintering procedure, connecting the three parts to form an integral arc tube; under 1750 - 1850 deg.C, putting the pre-sintered arc tube to hydrogen sintering furnace for heat preservation for 2-6 hour so as to obtain semitransparent ceramics arc tube of alumina. Features are: assembling injection molded main body, and ball ends directly in order to suit scale production, long service life, high light effect and color rendering etc.
Owner:SHENZHEN UPCERA CO LTD
Aluminum substrate used for packaging LED (Light Emitting Diode)
InactiveCN102779922AHigh temperature resistantImprove adhesionSemiconductor devicesEpoxyAluminum substrate
The invention relates to an aluminum substrate used for packaging an LED (Light Emitting Diode). The aluminum substrate comprises a common aluminium plate and a mirror plane plate which are laminated under high temperature. Through holes used for mounting LEDs are evenly arranged on the common aluminium plate which comprises, from top to bottom, a line layer, an insulated layer and a substrate. The insulated layer is made of epoxy resin, and alumina, carborundum, silicon dioxide and aluminum nitride which are nanoscale additives; the average particle size of the nanoscale additives is 40nm; and the purity of the nanoscale additives is above 99%. By adopting the aluminum substrate, a single chip or a plurality of chips can be packaged without being notched or polished and the substrate can be in any shape. The aluminum substrate has a flexible structure in application, is simple and practical, good in heat dissipation, simplified in process and high in light emitting efficiency.
Owner:HANGZHOU DIANZI UNIV
Upright post type LED heat radiator
ActiveCN101408298AReduce temperature differenceReduce the temperaturePoint-like light sourceSemiconductor/solid-state device detailsHeat transmissionEngineering
The invention discloses a vertical column shaped LED radiator, comprising a vertical column shaped heat-conductor, a heat transmission sheet, a heat dissipation shell and a large power LED; the vertical column shaped heat-conductor is internally provided with a vertical column shaped hole; a heat conductor is plugged in one side of the vertical column shaped hole; and furthermore, the large power LED is fixed on the end surface of the vertical column shaped heat conductor and the heat conductor. The external circumference of the vertical column shaped heat conductor is longitudinally provided with more than one heat transmission sheet and ribs; two sides of the heat transmission sheet are respectively provided with a wing; the end section of the heat transmission sheet is connected with the heat dissipation shell which is provided with a connection hole and a fin; and the ribs and the wings between two heat transmission sheets are longitudinally arranged in parallel. The vertical column shaped LED radiator adopts aluminium materials with good heat conduction performance, is integrated into a whole by extrusion process, can be used by cutting, has compact structure, reduces the cost, and can comply with various high-power or other typed semiconductor illumination lamps such as development streamer lamps, lamps embedded in ceilings, suspension lamps, automobile headlamps, street lamps and the like.
Owner:BEIJING TIMES HAODING TECH
LED lamp with lens injected with fluorescent glue and packaging method thereof
ActiveCN101826590AUniform coatingUniform colorPoint-like light sourceSolid-state devicesLight spotFluorescence
The invention discloses an LED lamp with a lens injected with fluorescent glue and a packaging method thereof. The LED lamp consists of an LED chip, a base, packaging glue, the fluorescent glue and the lens, wherein the LED chip is fixed on the base, the lens covers the LED chip, a cavity for containing the packaging glue is formed between the lens and the base, the interior of the lens is provided with a cavity layer in which the fluorescent glue can be filled, and the lens is also provided with a glue-injecting hole; the LED chip is covered by the solidified packaging glue which is injected into the cavity via the glue-injecting hole, and the solidified fluorescent glue is injected into the cavity layer via the glue-injecting hole. The unique method for processing the fluorescent glue can ensure that the fluorescent glue can be uniformly coated, consequently, the light spot of the LED is uniform, and the consistency of color is good. Meanwhile, since the packaging glue partitions the fluorescent glue from the chip, when the chip gets hot, heat cannot attenuate the performance of fluorescent powder, and the service life of the LED can be prolonged.
Owner:朗明智诚科技股份有限公司
Non-reflection high light extracting rate unit WLED power expanding type high power WLED light source
InactiveCN101173758AIncreased beam angleLight interference is smallElectrical apparatusPoint-like light sourceEffect lightSilica gel
The invention relates to a no-reflection high-efficient-luminescence unitary-WLED power-capacity-expansion high-power light source. A plurality of blue-light BLED chips are welded on a radiating base plate. The surfaces of the BLED chips are coated with silica gel phosphor powder, which forms white-light WLED illuminants. The high-light-transmittance and high-intensity industrial plastic PC is made into a thin isopachous hemisphere-shaped casing. The PC casing is filled with high-transparency silicon gel which has the same light transmittance as the PC, which forms a silica gel hemispherical lens. The silica gel lens is packaged above the phosphor powder along the centre to form the no-reflection and high-efficient-luminescence unitary WLED light source. A plurality of unitary WLED light sources are assembled to a high-power WLED light source by capacity expansion. The light source can be make into a street lamp, an emergency lighting lamp, a safety lighting lamp for mine roadway, a mine cap lamp, a safety lighting lamp for subway and airport, an indoor lighting lamp and other WLED lighting lamps. The invention has the advantages of scientifically reasonable structure, low production cost, good radiating property, low power consumption, high efficient luminescence, long service life and other advantages.
Owner:西安锐泽克斯光电科技有限公司
Full-color emission glass phosphor and preparation method thereof
InactiveCN102674693AFluorescence enhancementAchieve full color emissionFluorescenceLight-emitting diode
The invention discloses a full-color emission glass phosphor for near ultraviolet or blue light stimulating white light LEDs (Light Emitting Diodes) and a preparation method thereof. The glass phosphor is a rare earth ion doped glass phosphor containing silver ion polymers. The preparation method comprises the following steps of: by using a glass system as a substrate and AgNO3 as a raw material, introducing silver ion polymers into the glass material; and by using rare earth ions such as Eu3+, Sm3+, Pr3+, Tb3+, Dy3+, Er3+ or Ho3+ as a luminescence center, singly or jointly doping the rear earth ions in the glass substrate to be matched with the silver ion polymers for giving out white lights. The single glass phosphor is used for replacing fluorescent powder for the traditional white light LED and encapsulating materials, thereby simplifying the packaging technology; and the full-color emission glass phosphor has the advantages of being capable of solving the aging problem of the while light LED devices, increasing the stability of the devices, increasing the stimulation efficiency on the rare earth ions and realizing the high brightness fluorescence-emission.
Owner:DALIAN MARITIME UNIVERSITY
High-power integrated LED (light-emitting diode) lamp body structure with micro lens array
InactiveCN102330906ARealize the spot effectSave spacePoint-like light sourceElectric lightingPhosphorEffect light
The invention discloses a high-power integrated LED (light-emitting diode) lamp body structure with a micro lens array. The lamp body structure provided by the invention comprises a high-power integrated LED light source, wherein at least two or more than two GaN (gallium nitride)-based blue light chips are arranged in the light source in accordance with the configuration manner of the array; the upper parts of the chips are coated with YAG (yttrium aluminum garnet) yellow phosphor powders, and encapsulated by a silica gel; and the micro lens array formed by the plural micro lenses of which the number is equal to that of the blue light chips is arranged above the high-power integrated LED light source, and each micro lens in the micro lens array corresponds to each blue light chip in the LED light source one to one. The lamp body structure provided by the invention has the advantages of overcoming the defects of the prior art and solving the problem that the yellow circles at edges of the LED lighting is hard to overcome under the condition of large lenses.
Owner:WUXI HUAZHAOHONG OPTOELECTRONICS TECH
Solar street lamp apparatus having solar cell panel capable of self-cleaning and easily-adjustable inclination angles
ActiveCN106100564AAvoid scratchesAvoid wastingPhotovoltaic supportsPhotovoltaic energy generationThermal insulationSolar street light
The invention discloses a solar street lamp apparatus having a solar cell panel capable of self-cleaning and easily-adjustable inclination angles. The apparatus includes an electric pole which is arranged in a vertical direction. The left side of a top part of the electric pole is provided with a box body through a rotary hinging structure and an automatic telescopic adjusting mechanism. The rotary structure is arranged above the automatic telescopic adjusting mechanism. The top part of the box body is provided with a thermal insulation board which is provided with a solar cell panel thereon. The box body is provided with a storage battery pack, a LED lamp module, a voltage-stablizer, a remote signal receiver and an intelligent controller having the timing keeping and time setting functions therein. The side part of the box body is provided with a radiating hole. The radiating hole is provided with a water-resisting and ventilated membrane therein. The box body is provided with an automatic reciprocating wiping apparatus which is intended for wiping the upper surface of the solar cell panel. According to the invention, the apparatus can automatically adjust the inclination angles of the solar cell panel based on the radiation angles of the sun, fully increases photovoltaic conversion rate, can automatically clean the solar cell panel, and since the solar cell pane and the storage battery are integratedly mounted, the apparatus has strong reliability, has time keeping and time setting functions, and avoids waste of electricity.
Owner:西藏世峰高科能源技术有限公司
LED ceramic baseplate and preparation method thereof
The invention provides an LED ceramic baseplate and a preparation method thereof. The baseplate comprises the following components by weight percent: 60-70 percent of aluminium oxide, 0.2-0.5 percent of rare earth oxide, 10-30 percent of organic solvent, 0.2-1.2 percent of surface-active agent, 3.5-5.5 percent of adhesive, 2.5-7.2 percent of fluidizer and 2-5 percent of oxide additive. The preparation method comprises the following steps of: first, respectively and accurately weighing the components at respective weight percent, uniformly mixing and ball milling; next, performing vacuum defoamation and agitating; then, sequentially performing coating forming, hot-air drying, punching processing, vacuum encapsulation, pressing and cooling; finally, performing aging, low-temperature burnout, sintering and cooling. Due to the adoption of the method, the prepared ceramic baseplate is high in heat dissipation performance and surface finish, low in roughness, enhances light reflectivity, improves lighting effect, reduces light decay, and prolongs service life of an LED lamp.
Owner:SINOCERAM TECH (ZHENGZHOU) CO LTD
LED light-emitting component
ActiveCN101082405AImprove stabilityImprove distributionPoint-like light sourceGlobesEngineeringHigh heat
This invention discloses a sort of LED flaring element which adopt the complex flaring technique of fluorescent powder, it makes the LED flaring wafer of metal base plate embark locate in a transparent cover, the transparent cover is full of liquid in order that the liquid can submerge the whole surface of LED flaring wafer and it accession fluorescent powder in the liquid, so the fluorescent powder equably disperse in the liquid of the surface of LED flaring wafer. This invention ameliorates the method of the distribution of the external fluorescent powder, it effectively avoids the phenomenon that the fluorescent powder in the surface of LED flaring wafer heat up in the high temperature and reduces the aging of the fluorescent powder and reduce the light attenuation greatly.
Owner:DAJIN ORIENT LIGHTING SHENZHEN
U-shaped light-emitting diode (LED) energy-saving lamp
InactiveCN102506317ALight evenlySolve the glare problemPoint-like light sourceElongate light sourcesElectricityHeat conducting
The invention discloses a U-shaped light-emitting diode (LED) energy-saving lamp, which comprises a lamp holder. A driver shell is arranged on the lamp holder. A driver is arranged in the driver shell. The driver shell is made of heat conducting plastics in which metal is embedded or pure heat conducting plastics. The driver shell is connected with a U-shaped lampshade. A substrate which is electrically connected with the driver is arranged in the U-shaped lampshade. An LED module is installed on the substrate. The U-shaped LED energy-saving lamp not only effectively realizes light emission with an LED lamp light illumination angle being larger than 330 degrees, but also can evenly emit light, solves the problem of glaring and has excellent radiating performance.
Owner:NINGBO BAISHI ELECTRIC
Packaging structure and method of high-power LED
InactiveCN101982892AUniform thicknessAchieve color temperature uniformitySemiconductor devicesAdhesiveEngineering
The embodiment of the invention relates to a packaging structure of high-power LED, comprising a substrate, an LED chip fixed at one side of the substrate, a first transparent adhesive layer formed by pressure injection with the LED chip as the center, a fluorescent adhesive layer formed by pressure injection outside the first transparent adhesive layer and a second transparent adhesive layer formed by pressure injection outside the fluorescent adhesive layer. The embodiment of the invention also provides a packaging method of the high-power LED. The invention has the following beneficial effects: in the method, the fluorescent adhesive layer is formed by a specific die through pressure injection and has uniform thickness; the uniformity and consistency of the color temperature of the light space can be well realized by controlling the shape and thickness of the fluorescent adhesive layer and the fluorescent powder inside the fluorescent adhesive layer to be uniformly distributed; and the first transparent adhesive layer is arranged between the fluorescent adhesive layer and the LED chip and the substrate through pressure injection, thus overcoming the defects of low product reliability and greater light attenuation caused by direct contact between the fluorescent powder and the LED chip with high heat productivity and the substrate.
Owner:UNILUMIN GRP
Fence type LED lighting device
InactiveCN101430081AAdjustable light angleGuarantee unimpededPoint-like light sourceSemiconductor/solid-state device detailsLight irradiationEffect light
Owner:BEIJING HENGRUI TIAN QI TECH CO LTD
Flexible LED (light emitting diode) paster strip light
ActiveCN102095118BOvercome the shortcomings of not being able to withstand large currentsReduce manufacturing costPoint-like light sourceElectric circuit arrangementsElectricityLow voltage
Owner:ZHONGSHAN MLIGHT PHOTOELECTRIC
LED lamp strip
InactiveCN101469814ASafety and environmental protectionUniform light distributionPoint-like light sourceElongate light sourcesHeat conductingEngineering
The invention discloses a LED light bar which is composed of a LED single lamp, a circuit board, an aluminium groove, a protective glue, a heat-conducting medium, a side plug, a connector and a driving power supply, wherein the cross section of the aluminium groove is in a shape like the Chinese character 'ao', the inner side of the aluminium groove is provided with two steps with two boss parts arranged thereon, the circuit board is arranged on the steps and below the boss parts of the aluminium groove, the heat-conducting medium is arranged in the aluminium groove, a tubular LED light bar is formed between the circuit board and the aluminium groove, two ends of the LED light bar is plugged by the side plug, in which a connecting wire is packed in the center of the side plug when injection molding on one end of the LED light bar, the tail end of the connecting wire is a waterproof connector which is used for connecting between the LED light bars. The LED light bar of the invention has the advantage of long service life, energy saving, uniform light distribution and easy installation.
Owner:GUANGZHOU JINFENG DESIGN ENG
LED light source module with highlight power density
InactiveCN104534421AImprove reliabilityEfficient sheddingPlanar light sourcesPoint-like light sourceFluorescenceLight spot
The invention provides an LED light source module with the highlight power density. The LED light source module comprises a substrate, a plurality of LED light-emitting chips, a remote fluorescent powder layer and a heat sink. The middle of the substrate is provided with a groove. The LED light-emitting chips are arranged in the groove in the substrate to form an LED light-emitting chip array, the remote fluorescent powder layer is arranged above the groove in the substrate, the heat sink is a groove body and fixed to the position below the substrate, a sealed cavity is formed between the heat sink and the substrate, and the cavity is filled with phase change heat dissipation liquid used for dissipating the heat of the LED light-emitting chips. The LED light source module is high in output light power, small in light spot area, even in light spot brightness and long in service life.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
Metal baseplate provided with LED and manufacturing method thereof
InactiveCN101887942AImprove insulation performanceImprove thermal conductivitySemiconductor devicesCarbon filmDiamond-like carbon
The invention relates to a metal baseplate provided with an LED and a manufacturing method thereof, relating to the technical field of circuit board base materials, and in particular being applied to the technical field of production of a large-power LED metal baseplate. The manufacturing method comprises the following steps: successively plating a diamond-like carbon (DLC) coating on a metal plate; sputtering a metal layer capable of being carbonized on the outer surface of the diamond-like carbon coating; sputtering a thin copper layer outside the metal layer capable of being carbonized; and electroplating a thickened copper layer outside the thin copper layer and then carrying out circuit carving outside the thickened copper layer. The formed aluminium baseplate has excellent insulativity, and the adhesive strength of the diamond-like carbon coating and the baseplate is up to 20kg / cm<2>. The aluminum baseplate has the heat conductivity larger than 10W / mk which is more than twice of that of the traditional insulating layer containing glue, is particularly suitable for the application of the large power LED and can effectively reduce the optical attenuation speed.
Owner:江苏鑫钻新材料科技有限公司
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