Ceramic package light-emitting diode an dits package method

A light-emitting diode and ceramic packaging technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor heat dissipation, temperature shock resistance, and poor reliability of SMD LEDs, and achieve strong resistance to high and low temperature shocks , high reliability and high yield

Inactive Publication Date: 2005-03-02
SHENZHEN REFOND OPTOELECTRONICS
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Problems solved by technology

[0007] In order to overcome the shortcomings of the existing SMD LEDs, such as poor heat dissipation performance, low brightness, or poor reliability of temperature shock resistance, a high brightness, good heat dissipation performance, and resistance to soldering temperature is provided that combines the advantages of the above-mentioned LEDs. High Ceramic Encapsulated Light Emitting Diodes

Method used

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  • Ceramic package light-emitting diode an dits package method
  • Ceramic package light-emitting diode an dits package method
  • Ceramic package light-emitting diode an dits package method

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Embodiment Construction

[0022] Such as figure 1 Shown is a perspective view of the present invention. and combine figure 2 shown. The SMD LED of the present invention mainly includes a ceramic substrate 1, an LED chip 2 and a packaging body 5 containing the LED chip. The ceramic substrate 1 has a roughly square structure, and a recessed encapsulation cavity 3 is provided on its upper part. The inner wall of the encapsulation cavity 3 is an outwardly inclined arc surface, forming a reflective circle. The LED chip is installed in the package cavity 3, and two electrodes, ie, the first electrode 60 and the second electrode 61, are arranged in the package cavity of the substrate, and the two electrodes respectively extend to the bottom of the ceramic substrate.

[0023] The LED chip 2 includes an LED chip main body 21 , a lower electrode 22 arranged under the LED chip main body 21 , and an upper electrode 23 arranged on the upper surface of the LED chip main body 21 . The lower electrode 22 is forme...

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Abstract

The light-emitting diode consists of a base board, at least a LED chip and packaged element packaged on the chip. The base board is made of ceramics, there is a hollow package cavity that inside wall is chambered surface tilting outward to form a reflecting circle no the LED chip, LED chip is fit on the package cavity, in the package cavity on the base board, there is at least a first electrode and a second electrode, they are extended separately to bottom of ceramics base boards. The invention is also provides a method for packaging LED by ceramics.

Description

technical field [0001] The invention relates to a chip LED and a packaging method thereof, in particular to a chip LED packaged in ceramics and a packaging method thereof. Background technique [0002] Light-emitting diodes (light-emitting diodes, LEDs) are used more and more widely. At present, the LEDs on the market mainly include the following categories: in-line LEDs (DIP LEDs), chip-mounted LEDs (SMD LEDs), and glue-filled patches. Type LED (TOP LED) and high power type LED (POWER LED). Among them, the in-line LED has the advantages of high brightness, small light attenuation, ideal heat dissipation, and high resistance to soldering temperature, but its disadvantages are large volume and small light angle, which are not suitable for automated operations and are only suitable for large-scale use; The advantages of SMD LED are small size and large luminous angle. The disadvantages are low brightness, poor heat dissipation, large light attenuation, and low soldering tempe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
Inventor 龚伟斌周春生胡建华
Owner SHENZHEN REFOND OPTOELECTRONICS
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