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Metal baseplate provided with LED and manufacturing method thereof

A technology of metal substrates and manufacturing methods, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as difficult current transmission, achieve the effects of reducing light attenuation, good stability, and reducing light attenuation speed

Inactive Publication Date: 2010-11-17
江苏鑫钻新材料科技有限公司
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

These non-carbon atoms reduce carbon's graphitic bonds first, making it difficult for current to pass

Method used

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  • Metal baseplate provided with LED and manufacturing method thereof
  • Metal baseplate provided with LED and manufacturing method thereof

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Embodiment Construction

[0029] Take the production of aluminum substrates installed with LEDs as an example:

[0030] 1. Cut the 1050, 5052 or 6061 aluminum plate into a size of 550×700×T2.0 (0.385m2).

[0031] 2. Oxidize the surface of the aluminum plate into alumina with a thickness of 20-30 μm in the electrolyte with an oxygen electrode, and then seal the micro-holes left in the alumina with water vapor. Or use high molecular polymers, such as PET, to fill the pores of the aluminum oxide layer. The thickness of the polymer is about 100 nanometers.

[0032] 3. Under vacuum conditions, the aluminum substrate is treated in diamond-like carbon containing 1 / 4-1 / 2 atomic ratio of H, N, O, F or Si for 10 minutes, and the thickness of the formed diamond-like carbon film is 1 μm.

[0033] 4. Sputter carbonizable metals, such as magnesium, silicon, chromium, vanadium or titanium, on the diamond-like carbon film, with a thickness of 200nm-1000nm.

[0034] 5. A layer of copper is sputtered outside the carb...

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Abstract

The invention relates to a metal baseplate provided with an LED and a manufacturing method thereof, relating to the technical field of circuit board base materials, and in particular being applied to the technical field of production of a large-power LED metal baseplate. The manufacturing method comprises the following steps: successively plating a diamond-like carbon (DLC) coating on a metal plate; sputtering a metal layer capable of being carbonized on the outer surface of the diamond-like carbon coating; sputtering a thin copper layer outside the metal layer capable of being carbonized; and electroplating a thickened copper layer outside the thin copper layer and then carrying out circuit carving outside the thickened copper layer. The formed aluminium baseplate has excellent insulativity, and the adhesive strength of the diamond-like carbon coating and the baseplate is up to 20kg / cm<2>. The aluminum baseplate has the heat conductivity larger than 10W / mk which is more than twice of that of the traditional insulating layer containing glue, is particularly suitable for the application of the large power LED and can effectively reduce the optical attenuation speed.

Description

technical field [0001] The invention relates to the technical field of circuit board substrates, in particular to the technical field of production of metal substrates for high-power LEDs. Background technique [0002] Generally, heat-conducting materials conduct electricity, and metals conduct heat by the movement of electrons, so metals with lower resistance (such as silver, copper, aluminum) have higher thermal conductivity (such as silver is about 415W / mk, copper is about 395W / mk , aluminum about 275W / mk). Conversely, insulating materials such as glass or wood also have low thermal conductivity. [0003] Many industrial products, especially electronic products (such as LEDs) need to be driven by circuits. Most of these circuits are copper wires. In order to replicate circuits in large quantities, printed circuit boards (PCBs) are often made by exposure and etching. Usually, the printed circuit board uses glass fiber reinforced composite material (FRC) as the insulati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/64
Inventor 宋健民
Owner 江苏鑫钻新材料科技有限公司
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