200 results about "Lead Metal" patented technology

A clip is used to clamp a LED in place in a LED module. The clip has pliable conducting cover and can be latched to the upper lead metal of the LED module. The clip can be lifted for replacing a defective or color LED. A plurality of replaceable LEDs can be mounted a common metal substrate to form a display panel, and each LED can be clamped in position with clips straddling between parallel upper lead metal for electrical coupling to the top electrodes of the LED.

The invention discloses a method for circularly producing lead acid batteries, aiming at thoroughly eliminating possible hazard of the lead acid battery on environment and leading the lead acid battery to be continuously useful in social life without causing negative effect. The method includes: the positive and negative plates of old and useless batteries are separated by a mechanical method, and then the positive and negative plates are subjected to electrochemical treatment, thus obtaining raw material for producing new lead acid battery and achieving the circular production of the lead acid battery including disassembly of the old and useless lead acid battery, purification of sulphuric acid electrolyte, the production of lead metal and lead dioxide by electrolyzing lead sulfate, the separation and regeneration of lead alloy as well as the production of new lead acid battery by the produced lead alloy, lead and lead dioxide. In theory, by the proposal, the raw material can be totally reused, thus achieving the aim of circularly producing the lead acid battery.

The invention discloses a magnetic biological sorbent. The sorbent uses calcium alginate as a carrier, and is embedded with phanerochaete chrysosporium powder and magnetic nanometer particles, wherein, the mass ratio of the phanerochaete chrysosporium powder to the magnetic nanometer particles to the calcium alginate is 1 to (0.5-1.25) to (8-10). The invention also discloses a method for preparing the magnetic biological sorbent. The method comprises the following steps of: adding a mixture of the magnetic nanometer particles and the phanerochaete chrysosporium powder into a 1 to 2 mass concentration calcium alginate solution with 1 to 2 mass concentration, the dosage of the mixture in the solution being between 0.125 and 0.225g/mL, stirring evenly, and obtaining the magnetic biological sorbent through an immobilization process. The magnetic biological sorbent has the advantages of high adsorption efficiency, good selectivity, low cost, simple preparation process and treatment process and so on, and can be effectively applied to the treatment of lead metal in industrial wastewater.

The invention discloses a flexible probe electrode used for recording an electric signal of a neural activity. The flexible probe electrode comprises a flexible substrate, electrode sites, metal wires, lead welding spots and flexible insulating layers, wherein both the electrode sites and the metal wire are arranged on the flexible substrate; each electrode site is connected to a corresponding lead welding spot through led metal wires; and the flexible insulating layers are arranged on the surfaces of the metal wires instead of being arranged at the electrode sites and the metal welding spots. The invention also discloses an implanting tool for inserting the flexible probe electrode into tissues. Through the implanting tool, the electrode has a high flexibility and biocompatibility and the tissue damage is reduced, so that the long-term working stability of the electrode is ensured, the problem that the own hardness of the flexible electrode cannot satisfy an inserted hardness is solved and the defects that the conventional probe electrodes can damage the tissues easily and the electric signal is instable for the long-term recording of the electrode are overcome.

A manufacturing method of an organic light-emitting diode encapsulation structure comprises the following steps of: forming an organic light-emitting component on a substrate; forming a retaining wall on the substrate, wherein the retaining wall is arranged on the periphery of the organic light-emitting component in a surrounding manner and is made of one of groups formed by calcium metal, magnesium metal, aluminum metal, carton, zinc metal, chromium metal, tin metal, lead metal and copper metal; forming a packaging plastic material on a cover plate; and bonding the cover plate with the substrate by using the packaging plastic material and then solidifying the packaging plastic material, wherein the packaging plastic material is arranged on the periphery of the organic light-emitting component in a surrounding manner, and the packaging plastic material and the retaining wall are positioned between the cover plate and the substrate to seal the organic light-emitting component.

The invention discloses a composite solder and a preparation method thereof. The composite solder comprises a metal solder as a substrate and SiC crystal whisker as a reinforcement, wherein the metal solder can be a lead metal solder or lead-free metal solder; the volume percent of the SiC crystal whisker can be 0.1-30 percent, the diameter can be 0.5-1 micron and the slenderness ratio can be 20:1 to 40:1. The composite solder has high ability of resisting creep deformation and crack extension.

The invention discloses an environment-friendly metal surface protective agent with high salt fog resistance and a production method. The metal surface protective agent is characterized by being prepared by the steps of: weighing 10-25% of resin, 10-25% of vegetable oil, 45-75% of ethyl acetate, 1.8-5% of drying agent and 0.1-0.5% of benzotriazole based on 100% by weight, burdening and mixing. The metal surface protective agent is light-yellow clear solution or colorless clear solution, is nontoxic, odorless, non-volatile and non-deliquescent, and has the film-forming speed not more than 3min. The process is simple; the solvent is free of fluorine and chlorine elements; the product is environment-friendly, can undergo the neutral salt spray test for more than 96h, does not influence the conductivity, insulativity, high-frequency characteristic and weldability of a coated piece, and is suitable for surface treatment of metal products, in particular copper, aluminum, silver, tin and lead metal products.

The invention provides a self-assembling growth method of a compound semiconductor film, and the method comprises following steps of previously leading metal source reactant onto a substrate, and decomposing the metal source reactant to form a metal thin layer under high temperature; annealing the metal thin layer to form metal island particles; feeding III-group and V-group reactants, controlling the ratio of the V/III to be ranged from 50 to 200, controlling the temperature to be ranged between 800 to 1000 DEG C, utilizing the metal island particles as growth catalyst, and longitudinal growing nano columns along the metal island; and increasing the temperature to 1050 to 1100 DEG C, increasing the ratio of V/III to 1000 to 2000, accelerating the lateral growth of the top of the nano column, and forming a continuous semiconductor film.

The invention discloses a manufacturing method for a graphene touch screen sensor. The method comprises the steps that a substrate transferred with graphene thin film serves as an object, the graphene thin film in an electrode printing area is removed in advance, a graphene overlapping area is only reserved, the overlapping area is the superposed area of the electrode printing area and the graphene thin film, the electrode printing area without the graphene thin film is printed with metal electrode paste, and the sensor is formed after patterning is conducted. According to the manufacturing method for the graphene touch screen sensor, the graphene thin film in the electrode printing area is removed in advance, the graphene overlapping area is only reserved, and then a lead metal electrode printing method is adopted, so that a printing electrode is only overlapped to graphene only on a minimal overlapping area, good electric connection or ohmic contact can be achieved, most of the metal electrode makes contact with the substrate, and the problem that the printing adhesive force of the metal paste on the graphene thin film is poor is solved.

The invention relates to a metal baseplate provided with an LED and a manufacturing method thereof, relating to the technical field of circuit board base materials, and in particular being applied to the technical field of production of a large-power LED metal baseplate. The manufacturing method comprises the following steps: successively plating a diamond-like carbon (DLC) coating on a metal plate; sputtering a metal layer capable of being carbonized on the outer surface of the diamond-like carbon coating; sputtering a thin copper layer outside the metal layer capable of being carbonized; and electroplating a thickened copper layer outside the thin copper layer and then carrying out circuit carving outside the thickened copper layer. The formed aluminium baseplate has excellent insulativity, and the adhesive strength of the diamond-like carbon coating and the baseplate is up to 20kg/cm<2>. The aluminum baseplate has the heat conductivity larger than 10W/mk which is more than twice of that of the traditional insulating layer containing glue, is particularly suitable for the application of the large power LED and can effectively reduce the optical attenuation speed.

The invention discloses a method for removing zinc in renewable aluminum, and the method comprises the following steps: a. renewable aluminum raw material is heated and melted to form a renewable aluminum melt; b. the vacuum distillation is carried out on the renewable aluminum melt in the step a to lead metal zinc therein to form steam to be discharged. The vacuum degree of the vacuum distillation is 10-50Pa, the temperature of the vacuum distillation is 650-800 DEG C, and the time of the vacuum distillation is 5-30 minutes. The method for removing the zinc in the renewable aluminum can effectively remove zinc impurities in the renewable aluminum, and the content of zinc element in the renewable aluminum melt after the vacuum distillation is not more than 0.5 percent, thereby having significant zinc removal effect, greatly reducing the using amount of primary aluminum in the late-stage component adjustment, facilitating the component adjustment of the follow-up production of the renewable aluminum, simultaneously increasing the using amount of the renewable aluminum raw material with high zinc content, greatly reducing the production cost of the renewable aluminum and improving the economy of the renewable aluminum raw material on the production and the use.

The invention belongs to the technical field of heat conducting composite materials, and particularly relates to a heat conducting composite material and an injection molding process for combining the same and a light-emitting diode (LED) metal shell. The heat conducting composite material comprises the following raw materials in part by weight: 46 to 91 parts of polyhexamethylene adipamide, 5 to 25 parts of graphite, 2 to 10 parts of molybdenum disulfide, 0.5 to 2 parts of nano calcium carbonate, 2 to 15 parts of glass fiber, 0.5 to 5 parts of coupling agent, 1 to 2 parts of antioxidant and 0.5 to 2 parts of processing auxiliary agent. The heat conducting composite material has high heat conducting property and thermal physical and mechanical properties. The injection molding process for combining the heat conducting composite material and the LED metal shell comprises the following steps of: (a) raw material drying and granulation; (b) plasticizing; (c) injection molding and filling; (d) annealing treatment; and (e) humidifying treatment. The LED metal shell prepared by the injection molding process has the advantages of high heat dissipation efficiency and safe and reliable use.

An LED interconnection apparatus and a method of electrical connection for an array of LEDs are disclosed, the LED interconnection apparatus including a back plate substrate having a plurality of adaptable through-holes formed therein and a flexible conductive pattern disposed adjacent the back plate substrate, wherein the adaptable through-holes of the back plate substrate facilitate selective access to the flexible conductive pattern to provide a simple, adaptable, and standardized method of electrical communication for an array of LEDs.

The invention discloses a through hole priority copper interconnection manufacturing method, which comprises the following steps of: depositing a medium layer on a substrate, coating a first photoresist which can form a hard film on the medium layer, and forming a through hole structure in the first photoresist; coating a micro curing material on a first photoresist pattern for curing the through hole structure, heating for reacting the micro curing material with the surface of the first photoresist, and forming an isolating film on the surface of the first photoresist; coating a second photoresist on the cured first photoresist, and forming a channel structure positioned above the through hole structure in the second photoresist, wherein the isolating film is insoluble in the second photoresist; transferring the through hole structure and the channel structure into the medium layer; and continuing subsequent lead metal and through hole metal filling. In the method, the photoresist material which can form a hard film is used, so that an etching step is reduced, the manufacturing cost is lowered greatly, and the yield is increased effectively.

The invention relates to a method for controlling air holes of a laser cladding layer by an intermittent parking machine, belonging to the technical field of surface treatment. The method comprises the following steps of: fixing a cladding sample on a platform surface of an electromagnetic vibrating platform by a clamp device, adopting a lateral and synchronous powder feeding method, assisting low-amplitude and high-frequency intermittent parking vibration in the laser cladding process, leading metal liquid to be stressed by exciting force provided by mechanical vibration intermittently in the solidification process of a melting pool, and obtaining the high-quality cladding layer. In the method, the formation of a feeding channel can be enhanced, the intermittent vibration accelerates the escaping of residual gas in the cladding process, the residue of microscopic bubbles in the cladding layer is restrained, the macroscopic surface quality after the cladding layer is solidified is improved, the subsequent processing amount is reduced, and the comprehensive surface performance of the cladding layer is improved. The method is applicable to the fields such as strengthening and forming of laser cladding surfaces of metal parts and surface repairing of medium parts and the like, and can improve the quality of the cladding layer.

The invention discloses an online measurement device for the uranium concentration in a solution. The online measurement device comprises an upper cover. First threaded holes allowing a pipeline to penetrate through are formed in the upper cover in the horizontal direction, and second threaded holes allowing circulating water to pass through are formed and are perpendicular to the first threaded holes in the horizontal direction. First O rings and hollow bolts penetrate through the pipeline and are screwed into the first threaded holes. A second O ring, a baffle and an intermediate plate are sequentially arranged at the lower portion of the upper cover. Bolts penetrate through first through holes in the bottom edge of the upper cover and second through holes in the edge of the intermediate plate and are connected with third through holes in the upper edge of a shielding bucket. A NaI crystal and a multi-channel energy disperse spectrometer are arranged inside the shielding bucket sequentially from top to bottom. Screws penetrate through threaded holes formed in the upper portion of the shielding bucket in the horizontal direction to fix the NaI crystal. A square hole allowing a power wire to penetrate through is formed in the lower portion of the shielding bucket. A base of the shielding bucket is provided with flange through holes used for fixing the base. The outer layer of the online measurement device is made of stainless steel, the inner layer of the online measurement deice is lead metal, and therefore the effect of uranium radiation resistance is good; the O rings and the threaded holes are used for fixing, so the online measurement device is simple in structure and good in sealing effect, and the testing cost is reduced.

The invention provides a cleaning technique of a diode chip, and relates to an improvement of a cleaning liquid formula used in the cleaning technique, which can further reduce metal ions of the side surface of the chip, thus avoiding the chip from generating the phenomenon of creepage in working. The cleaning technique comprises the steps of mixed acid cleaning, double phosphorus cleaning and ammonia cleaning in sequence; when in ammonia cleaning, the cleaning liquid comprises ammonia water, water and hydrogen peroxide, the weight ratio of which is as follows: 1 part : 2-3.5 parts : 0.15-0.3 part. Compared with the original formula, the cleaning technique adds the hydrogen peroxide in ammonia cleaning liquid, feeds the obtained ammonia cleaning liquid downward onto an acid cleaning disc by an acid-feeding pipeline under the condition of being fully mixed; the acid liquid is over an upper nail head (equivalently to a clamping part of the upper end surface of the chip), thus leading the reaction to be full and further being capable of leading metal purities of the side surface of the chip to be removed more thoroughly; and the materials are more stable when being used under high temperature, thus reducing the instability of electric property of the materials due to larger surface leakage.

The invention discloses a high temperature and high pressure resistant glass material for sealing and a preparation method thereof, which is prepared from the following components in parts by weight: SiO2: 9-12 parts; H3BO3: 25-27 parts; Al2O3: 4-6 parts; SrCO3 : 5 to 8 parts; Pb3O4: 50 to 53 parts; other impurity elements inevitably brought in: ≤1 part. The preparation method of the above-mentioned high temperature and high pressure resistant glass material comprises the following steps: a) batching; b) ball milling; c) pre-sintering; e) heat preservation and sintering; e) water quenching; f) ball milling; g) sieving; h )dry. The invention also provides a method for encapsulating the above-mentioned high-temperature and high-pressure-resistant sealing glass material with an alloy and a performance testing method. The sealing glass material of the present invention can be matched and sealed with Kovar alloy or other lead metals and stainless steel alloys of different grades, and has excellent sealing strength and quality; by controlling the packaging method, the sealing member can be used normally in high temperature, high pressure environment and destructive environment , with good stability and reliability.