Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Solder with composite material and preparation method thereof

A composite material and solder technology, which is applied in the field of metal solder-based ceramic whisker-reinforced composite material solder, can solve the problems of reduced interconnection strength, affecting the wetting performance of solder and pad, increasing dislocations, etc.

Inactive Publication Date: 2009-07-15
SAMSUNG ELECTRONICS CO LTD +1
View PDF1 Cites 20 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although these reinforcements can share the load borne by the matrix and increase the dislocations in the matrix, thereby improving the ability of the solder to withstand thermal fatigue and mechanical shock, these reinforcements currently studied still have many shortcomings.
For example, the addition of trace elements has very limited improvement in the performance of solder, intermetallic compounds often result in reduced interconnection strength due to the reaction with the substrate during reflow, and particles such as aluminum oxide will have agglomeration problems during reflow and affect Solder and pad wettability, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Solder with composite material and preparation method thereof
  • Solder with composite material and preparation method thereof
  • Solder with composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Refer below Figure 5a Describe the steps of preparing the composite material solder according to the present invention by means of stirring casting: provide a liquid metal solder matrix, then add an appropriate proportion of SiC whiskers to the liquid metal solder matrix, mechanically stir evenly, so that the SiC whiskers are evenly dispersed in the metal solder In the matrix, the mixture of the liquid metal solder matrix and the SiC whiskers is finally casted to obtain the metal solder / SiC whisker composite material solder.

Embodiment 2

[0036] Refer below Figure 5b Describe the steps of preparing the composite material solder according to the present invention by powder metallurgy: provide a powdery metal solder matrix, then add SiC whiskers in an appropriate proportion to the powdery metal solder matrix, stir mechanically, and finally carry out cold pressing sintering or use Hot-pressing sintering shapes the mixture of powdered metal solder matrix and SiC whiskers to obtain metal solder / SiC whisker composite material solder.

Embodiment 3

[0038] Refer below Figure 5c Describe the steps of preparing the composite material solder according to the present invention by means of squeeze casting: first, mix SiC whiskers with silica gel in an appropriate proportion, shape and dry the mixture of the two, put the obtained SiC whisker prefabricated blocks into In the mold; secondly, provide the liquid metal solder matrix, and pressurize it through the pressure head, so that the liquid metal solder matrix is ​​pressed into the pores of the SiC whisker prefabricated block, and the gas is discharged from the vent hole below; finally cast, Thus, the metal solder / SiC whisker composite material solder is obtained.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a composite solder and a preparation method thereof. The composite solder comprises a metal solder as a substrate and SiC crystal whisker as a reinforcement, wherein the metal solder can be a lead metal solder or lead-free metal solder; the volume percent of the SiC crystal whisker can be 0.1-30 percent, the diameter can be 0.5-1 micron and the slenderness ratio can be 20:1 to 40:1. The composite solder has high ability of resisting creep deformation and crack extension.

Description

technical field [0001] The invention relates to a solder suitable for interconnecting electronic components, in particular to a metal solder-based ceramic whisker-reinforced composite solder and a preparation method for the composite solder. Background technique [0002] Solder interconnection is one of the important ways of electronic interconnection at all levels, and it is mainly used in packaging technologies such as flip chip (flipchip), ball grid array package (BGA), and quad flat package (QFP). Among the solders suitable for interconnecting electronic components, tin-lead solder has become the main soldering material used in the field of electronic interconnection due to its excellent performance and low cost. Recently, lead-free solders have gradually drawn attention for the reasons of reducing and preventing environmental pollution. At present, the developed lead-free solder mainly includes binary alloy lead-free solder and multi-element alloy lead-free solder. Ex...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B23K35/22
Inventor 刘海
Owner SAMSUNG ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com