29 results about "Composite solder" patented technology

The invention discloses a preparation method and application of a low-temperature photovoltaic welding strip, and belongs to the technical field of energy conservation and environmental protection. According to the technical scheme, the method comprises the steps that a metal precursor is dissolved in an alcoholic solution, and a nano reinforced phase is prepared through regulation and control of a surfactant, ultrasonic treatment and aging calcination; the composite solder is prepared through argon smelting according to 1-6 parts of Sn, Bi, Ag, Ni, Cu, Ge, the modified glass powder and the nano reinforced phase; 99.95% electrolytic copper is subjected to vacuum melting and cold rolling to form a copper strip; the surface roughness is controlled through alkali washing degreasing and acid washing micro-etching; immersing the preheated copper strip into a molten pool for plating; and carrying out heat preservation and rosin protection treatment. According to the method, low-temperature welding at the temperature of 150-220 DEG C is achieved, an Ag-Sn intermetallic compound layer is formed after welding, the pull-off strength retention rate of a welding spot is larger than or equal to 80% after 200 times of thermal cycles, and the method is suitable for interconnection of crystalline silicon photovoltaic battery pieces.

The application discloses a MAX phase reinforced three-dimensional network tin-based lead-free solder and a preparation method thereof, and belongs to the technical field of lead-free solder. The MAX phase reinforced three-dimensional network tin-based lead-free solder is characterized in that the MAX phase reinforcing phase is distributed in the form of a three-dimensional continuous network skeleton at the grain boundary of a tin-based lead-free solder matrix; and the MAX phase reinforcing phase forms a continuous network penetrating through the whole tin-based lead-free solder matrix. The application also discloses an application of the MAX phase reinforced three-dimensional network tin-based lead-free solder in a high-temperature, high-load and high-frequency vibration scene. Through process innovation and performance optimization, the application aims to finally prepare a "high-strength, high-plasticity and high-temperature stability" tin-based three-dimensional network composite solder, solves the problem that a traditional tin-based single-component lead-free solder is prone to deformation and cracking due to thermal stress and mechanical load, improves the reliability of electronic packaging, and expands the application range of the tin-based lead-free solder in high-demand fields.

The application discloses a preparation method of a high-reliability core-shell composite solder capable of low-temperature welding, and belongs to the technical field of welding materials of electronic components. The core-shell composite solder is made of Sn-based solder powder by means of rolling plating, and a series of Sn-Bi low-temperature alloy plating layers are plated on the surface of the solder powder. The core-shell composite solder powder is produced in batches by changing the type and size of the commonly used Sn-based solder in the core to plate a series of Sn-x Bi low-temperature solder alloy plating layers on the shell, so as to produce core-shell composite solder powders of different sizes and types and composite BGA solder balls. The composite solder powder is suitable for the preparation of solder paste capable of low-temperature reflow and high-temperature service, and the composite BGA solder ball can be directly used for solder balls capable of low-temperature reflow and high-temperature service, so that the types and usability of the composite solder at the present stage are greatly improved, and the welding reliability is improved. Compared with the alloy solder prepared by the traditional melting and casting method, the method has the advantages of simple process, low cost and easy operation.

The invention relates to the technical field of battery manufacturing, in particular to a stress self-adaptive interconnection method and device for a thin film battery array based on a flexible PCB, and the method comprises the steps: processing and forming a micro-groove array on the surface of the PCB, and preparing a composite solder structure; collecting a real-time deformation field and a bonding pad position of the PCB, and generating a compensation mounting path of the thin film battery; the contact force between the thin film battery and the bonding pad is controlled to be smoothly increased; performing local thermal ultrasonic solid-phase bonding on the electrode on the thin film battery and the corresponding bonding point on the PCB; performing laser irradiation on the lower electrode of the battery and the PCB bonding pad to form a high-melting-point intermetallic compound; collecting three-dimensional shape geometric parameters of the welding spots, extracting efficiency distribution and defect characteristics of the battery, and dynamically adjusting process parameters of the upflow according to the efficiency distribution and defect characteristics; and calculating residual stress distribution, and dynamically adjusting pressure applied to different areas by a hot pressing roller in a subsequent packaging process. According to the invention, the large-scale and high-reliability manufacturing of the flexible PCB-based thin film solar wing can be effectively realized.

The application belongs to the technical field of solder processing, and discloses a composite solder piece and a preparation method thereof. The composite solder piece comprises a first low-melting-point solder layer, an Ag-based intermediate layer, a second low-melting-point solder layer and a solder coating which are stacked in sequence; wherein the first and second low-melting-point solder layers comprise a rare earth element-doped Ag-Cu-Sn alloy, and the Ag-based intermediate layer comprises a silver-based alloy doped with 0.5%-3% In and 0.1%-1.5% Ga elements. The design reduces the melting point of the intermediate layer by In / Ga doping to realize overall low-temperature brazing, and utilizes the rare earth element to refine grains and strengthen the interface, thereby synergistically improving the high-temperature strength and thermal fatigue resistance of the brazed joint. The outermost solder coating can improve wettability and provide oxidation resistance protection. The application significantly reduces the connection temperature while improving the high-temperature strength and wettability of the brazed joint, thereby ensuring excellent high-temperature reliability and process adaptability of the joint.

The application relates to the technical field of semiconductor packaging, in particular to a SnBi low-temperature hot-press bonding method and structure based on elastic microsphere enhancement, which comprises the following steps: S1, preparing SnBi-based composite solder paste containing metalized elastic microspheres, wherein the metalized elastic microspheres are uniformly distributed in the composite solder paste; S2, coating the composite solder paste to the pads of a substrate through a printing process; S3, aligning and placing a chip on the solder paste, and then preheating the chip through a heating head; S4, applying vertical pressure to the chip through the heating head and heating the chip to above the melting point of the composite solder paste, implementing hot-press bonding, so that the solder paste melts and the metalized elastic microspheres are compressed; and S5, forcibly cooling under the condition that the vertical pressure applied to the heating head is kept unchanged, and after the solder solidifies, the heating head removes the pressure, and the bonding is completed. Through the application, the problem that SnBi low-temperature solder joints are prone to brittle fracture and the problem that solder overflow leads to short circuit of the pads can be overcome.

The invention discloses a high-reliability medium-temperature composite solder and a preparation method thereof.The high-reliability medium-temperature composite solder comprises an alloy base material and a composite material, and the alloy base material comprises, by mass, 65-85 parts of Sn, 10-30 parts of In, 0.5-3 parts of Ag, 0.5-3 parts of Bi, 0.5-1.2 parts of Cu and 0.1-0.2 part of other metal elements; wherein the other metal elements comprise one of Sb, Ge, Co and Ni; the composite material comprises the following components in parts by mass: 0.1-1.0 part of nano copper powder used for inhibiting migration and remelting of an In-rich phase and forming a solid solution strengthening phase; and nano graphene powder. By means of the mode, according to the high-reliability medium-temperature composite solder and the preparation method thereof, the melting point of the whole composite solder is stabilized to be 175-200 DEG C by adjusting the In content, so that the high-reliability medium-temperature composite solder is accurately matched with a backflow technology at the temperature of 180-210 DEG C, and the thermal requirements of different electronic devices are met; and after the nano metal powder and the nano graphene powder are added, the In-rich phase remelting rate during secondary backflow is effectively reduced, the interface bonding strength is improved, and the reliability is remarkably improved.

The application discloses a kind of composite solder ball, preparation method and stacked package structure, comprising: composite core, by continuous phase matrix and strengthening phase are constituted, the strengthening phase accounts for 15%~30% of the total volume of core, the compression modulus of the composite core is ≥3GPa and thermal expansion coefficient is ≤55ppm / ℃;Metal transition layer, is coated in the polymer core;Tin silver alloy outer layer covering the metal transition layer.Composite core is constituted by continuous phase polymer matrix and strengthening phase fiber network, realizes high-temperature pressure resistance and low thermal expansion characteristics by specific volume ratio and mass ratio, maintains solid rigid characteristics in welding high temperature interval, directly bears mechanical load, completely eliminates the risk of interlayer height collapse, metal transition layer forms and the mechanical interlocking combination interface of core, tin silver alloy outer layer provides weldability and electrical connection function, realizes that composite solder ball can play the role of support and also can play the role of welding dual-functional technology fusion.

The application belongs to the technical field of tin paste, and particularly relates to a semiconductor packaging tin paste and a preparation method thereof for reducing welding cavities, which is composed of the following materials: composite solder powder: nano heterojunction composite tin powder, with a mass ratio of 85%-92%; flux: temperature-sensitive microcapsule flux, with a mass ratio of 7%-15%; trace functional additives: rheological agent, antioxidant and thixotropic agent, with a mass ratio of 0.15%-0.7%. The Mott-Schottky effect is used to enhance the interface electron transfer capacity, the organic small molecules of the flux residue can be actively catalyzed and decomposed in the welding heating stage, and the gas escape is reduced. Meanwhile, the lattice matching property of the heterojunction can inhibit the abnormal growth of the IMC layer, and the cavity problem caused by the uneven interface reaction of the traditional tin powder is solved.

This invention belongs to the technical field of lead-free solder powder for electronic soldering. The invention discloses a graphene-coated copper-tin composite solder powder and its preparation method. The core phase is a CuSn binary alloy powder, with a Cu content of 0.5~1.0 wt% and the balance being Sn; the D50 particle size is 15~45 μm, approximately spherical, and the loose packing density is 4.8~5.2 g / cm³. 3，壳相：少层还原氧化石墨烯，连续致密包覆层厚度 The graphene coating is 0.8~3.0nm, with a coating amount of 0.03~0.22wt% (based on the total mass of the composite solder powder). The interface is that the core phase and the shell phase are covalently bridged by silane coupling agent, with a coating integrity rate of ≥95%. The graphene does not agglomerate or fall off, and it plays a stable role in the reflow soldering process. The wettability, solder joint strength, and thermal fatigue performance of the solder powder reach or exceed those of SAC305 silver-containing solder powder. The process conditions are mild, highly controllable, and have good repeatability, making it suitable for large-scale industrial production. Moreover, the preparation process is environmentally friendly and generates no harmful waste.

The invention discloses composite brazing filler metal with a reinforced foamy copper structure and a preparation method of the composite brazing filler metal. The composite brazing filler metal is prepared by taking foamy copper as a framework and filling pores of the framework with composite powder composed of silver powder and copper-titanium nanoparticles. The composite brazing filler metal comprises, by mass, 1%-5% of titanium, 18%-44% of copper and the balance silver powder and inevitable trace impurities. Weighing silver powder and copper-titanium nanoparticles, and uniformly mixing the silver powder and the copper-titanium nanoparticles to obtain composite powder; filling the composite powder into pores of the foamy copper, compacting the composite powder through vibration or pressing, and pressing to prepare a brazing filler metal preform; and performing low-temperature sintering on the brazing filler metal preform to obtain the composite brazing filler metal. The capillary flow of the liquid alloy in the brazing process is promoted through the porous structure of the foamy copper, the spreadability and the interface reaction efficiency of materials difficult to wet such as ceramic are optimized by combining the uniformly distributed copper-titanium nanoparticles and the silver powder, and the overall strength, plasticity and crack propagation resistance of the composite brazing filler metal are improved.

The invention relates to a solder and a preparation method and application thereof, the solder comprises the following main components by mass: 10%-30% of Si, 10%-45% of KxALFy (wherein x is 1-3 and y is 4-6), 0.5%-2% of a water-based adhesive, 40%-70% of a solvent, 0%-0.8% of Fe, 0%-0.5% of Mn, 0%-1% of Zn, and the balance of Al and inevitable impurities, and the mass ratio of Cu is 0-1%. The preparation method comprises the following steps: taking solid-phase components including 10-30 parts by mass of Si, 10-45 parts by mass of KxALFy, 0-0.8 part by mass of Fe, 0-0.5 part by mass of Mn, 0-1 part by mass of Zn and 0-1 part by mass of Cu, taking 0.5-2 parts by mass of a water-based adhesive, and mixing the solid-phase components, the water-based adhesive and 40-70 parts by mass of a solvent; and stirring. Welding machining between two or more parts without composite solder layers is achieved, and the machining cost is reduced.

The application relates to the technical field of semiconductor welding, and discloses a multilayer composite solder preform and a preparation method thereof. At least two high-melting-point metal strips are combined into an intermediate metal composite layer through multiple rolling, annealing and surface oxygen removal treatment, and then are combined with a solder strip to obtain a multilayer composite structure in which a first solder layer, at least two high-melting-point metal layers and a second solder layer are sequentially stacked. The high-melting-point metal layer can be two or three layers, and the material is selected from pure metals or alloys of Cu, Ni, Ag, Sb and the like; and the solder layer is pure Sn or Sn-based, pure In or In-based material. The problems of the existing three-layer structure solder, such as thermal expansion mismatch, poor thermal conductivity, low diffusion rate and poor base material adaptability, are solved, low-temperature welding (<300 DEG C) and high-temperature service (>400 DEG C) are realized, the thermal expansion coefficient is reduced by 30%, the thermal conductivity coefficient is increased by 300%, a single intermetallic compound layer is formed after welding, and the reliability of the welded joint is remarkably improved.

The utility model belongs to the technical field of welding devices, and discloses a high-frequency induction composite welding flux device which comprises an input piece and an output piece, and a welding piece is installed between the input piece and the output piece. The input part comprises a conveying part, two electric push rods are symmetrically and fixedly connected to the bottom of the conveying part in the moving direction of the material belt, two moving plates are symmetrically arranged above the conveying part, a plurality of guide rollers are rotationally connected to the opposite sides of the two moving plates, and moving rods are fixedly connected to the opposite sides of the two moving plates; a connecting plate is fixedly connected between the free end of the moving rod and the telescopic end of the electric push rod. The electric push rod drives the connecting plate and the moving rods to move, so that the moving rods drive the moving plates to move, the guide rollers on the two moving plates abut against the material belt, the material belt is centered, the material belt can be conveniently aligned with a welding piece, workers do not need frequent manual intervention, the welding difficulty of the device is improved, and the welding efficiency of the device is improved.

The invention provides a tin-based composite solder with CTE gradient transition and application of the tin-based composite solder in power module connection, the solder is a preform with an internal continuous gradient structure, firstly, in the directional solidification process, macroscopic component gradient is spontaneously formed through density-driven phase separation; subsequently, during welding application, the active Ti element is migrated to and reacts with the ceramic interface to generate a high-strength interface layer, and the gradient is further sharpened and strengthened. According to the welding flux, intrinsic CTE matching with a ceramic / copper heterogeneous material is achieved, interface thermal stress can be effectively dispersed, and the connection reliability is remarkably improved. In addition, an existing welding process does not need to be changed during application, and the method has excellent engineering applicability and commercial prospects and is suitable for high-reliability IGBT, SiC and other power modules.

The invention discloses a super-thick copper circuit board solder resist printing oil technology, and relates to the technical field of printed circuit board manufacturing. The process comprises the following steps: acquiring circuit distribution data of the ultra-thick copper circuit board, and dividing the surface of the ultra-thick copper circuit board into a circuit copper layer region and a non-circuit substrate region based on a partition priority strategy; first solder resist ink is jet-printed in a non-circuit area by adopting ink-jet printing equipment in a partitioned manner, and the stacking and the thickness of the ink are regulated and controlled through multi-stage partitioning and a jet printing mode, so that efficient covering of the side wall of a copper layer and high-leveling filling of a base material are realized; and performing staged pre-baking after jet printing, then printing second solder resist ink on the whole surface through silk-screen printing to form a composite solder resist structure, and finally curing the composite solder resist structure. According to the invention, the industrial problems that the super-thick copper PCB solder mask layer is difficult to cover the high side wall, the production efficiency is low and the quality consistency is poor are effectively solved. The coating property and the leveling property of the solder resist ink are improved, the process period is shortened, and the production efficiency is improved.

The invention relates to the technical field of tin-based composite solder preparation, in particular to a preparation method of photovoltaic solder strip alloy solder which comprises 2.8%-3.2% of silver, 0.45%-0.55% of copper, 0.03%-0.1% of nickel-coated nanometer aluminum oxide, 0.005%-0.02% of germanium and the balance tin. The preparation method comprises the following steps: melting a tin block, adding copper particles and silver particles, heating until the alloy is completely melted, cooling, adding Sn-Ge master alloy, slowly adding nickel-coated nano aluminum oxide powder into the melt in a nitrogen injection and ultrasonic coupling stirring manner, heating and refining, cooling and standing to obtain an alloy solder melt, and carrying out heat treatment on the alloy solder melt. The copper strip is prepared into a photovoltaic welding strip through a hot dipping method; through coordination of nickel-coated nano aluminum oxide and germanium, the initial shear strength of a welding spot of the welding flux is improved, the welding spot can keep a high strength retention rate under cold and hot circulation and long-term high-temperature environment service, and the problem that the shear performance of the welding spot is rapidly attenuated in a severe environment is solved.

The invention relates to an aluminum alloy part manufacturing method, which comprises the following steps that a first part and a second part are provided, solder is provided, the solder comprises the following main components: 10 to 30 parts by mass of Si, 10 to 45 parts by mass of KxAlFy, 0.5 to 2 parts by mass of aqueous binder, 40 to 70 parts by mass of solvent, 0 to 0.8 part by mass of Fe, 0 to 0.5 part by mass of Mn, 0 to 1 part by mass of Zn and 0 to 1 part by mass of Cu, and solder is applied to the first part and / or the second part, and the first part and the second part are brazed after drying. Welding processing between two or more plates without composite solder layers is achieved, and the processing cost is reduced.

The invention belongs to the technical field of solder paste, and particularly relates to semiconductor packaging solder paste and a preparation method for reducing welding voids.The semiconductor packaging solder paste is composed of composite soldering tin powder, nanometer heterojunction composite tin powder, nanometer heterojunction composite tin powder, a conductive paste, a bonding agent, a bonding agent and a bonding agent, and the mass ratio of the composite soldering tin powder to the nanometer heterojunction composite tin powder is 85%-92%; the soldering flux is a temperature-sensitive microcapsule soldering flux, and the mass ratio of the temperature-sensitive microcapsule soldering flux is 7%-15%; the trace functional additives comprise a rheological agent, an antioxidant and a thixotropic agent, and the mass ratio of the rheological agent, the antioxidant and the thixotropic agent is 0.15%-0.7%; the interface electron transfer capacity is enhanced through the Mott-Schottky effect, residual small organic molecules of the scaling powder can be actively catalyzed and decomposed in the welding temperature rising stage, and gas escape is reduced; and meanwhile, the lattice matching property of the heterojunction can inhibit abnormal growth of the IMC layer, and the hole problem caused by uneven interface reaction of traditional tin powder is solved.

This invention relates to the field of tin-based composite solder preparation technology, specifically a method for preparing photovoltaic solder ribbon alloy solder. The alloy solder comprises 2.8–3.2% silver, 0.45–0.55% copper, 0.03–0.1% nickel-coated nano-alumina, 0.005–0.02% germanium, and the balance tin. After the tin block is melted, copper and silver particles are added, and the temperature is raised until the alloy is completely melted. After cooling, a Sn-Ge master alloy is added first, and then nickel-coated nano-alumina powder is slowly added to the melt by nitrogen blowing and ultrasonic coupling stirring. The melt is first heated and refined, and then cooled and allowed to stand to obtain the alloy solder melt. The copper strip is prepared into a photovoltaic solder ribbon by hot dipping. This invention improves the initial shear strength of the solder joint by synergizing nickel-coated nano-alumina and germanium, and the solder joint can maintain a high strength retention rate under thermal cycling and long-term high-temperature environment service, solving the problem of rapid decay of solder joint shear performance under harsh environment.

The invention belongs to the technical field of electronic packaging, and particularly relates to nano-copper composite solder for low-temperature interconnection and a preparation method and application of the nano-copper composite solder. The nano-copper composite solder for low-temperature interconnection comprises the following raw materials in percentage by mass: 70-85% of surface modified nano-copper, 5-20% of an organic carrier and the balance of tin-based alloy powder, the nano-copper composite solder provided by the invention can be at 1t; low-temperature sintering is achieved at the temperature of 250 DEG C, the technical bottleneck that a traditional welding flux needs to be welded at the process temperature of 250 DEG C or above is broken through, the interconnection requirement of a heat sensitive element is met, meanwhile, interface gaps can be effectively filled, excessive interface reaction is restrained, a compact and stable connection interface is formed, and the heat sensitive element is prevented from being damaged. And the obtained welding spot has high shear strength and high cold and hot impact reliability.

The invention provides a preparation method of composite brazing filler metal based on phase separation and a welding method for ceramic and metal, and relates to the technical field of welding.The preparation method of the composite brazing filler metal based on phase separation comprises the following steps that a brazing filler metal matrix phase and a brazing filler metal adding phase with the phase separation characteristic are selected, and under inert atmosphere protection, the brazing filler metal matrix phase and the brazing filler metal adding phase are subjected to phase separation; smelting is conducted through a vacuum arc smelting method or a laser smelting method, so that the brazing filler metal adding phase and the brazing filler metal matrix phase are evenly mixed; and rapid cooling is conducted at the cooling speed of 102 DEG C / s to 103 DEG C / s, and the composite brazing filler metal is obtained. The composite brazing filler metal is prepared by selecting a brazing filler metal matrix phase and a brazing filler metal additive phase with specific phase separation characteristics and adopting a controlled smelting and rapid cooling process in an inert atmosphere, so that second-phase particles are effectively prevented from being agglomerated, and formation of fine and uniform dispersion distribution of a high-melting-point and low-expansion second phase in the brazing filler metal matrix is promoted.

The utility model provides a composite solder preform and a solder assembly. The composite solder preform provided by the utility model is used for welding a first welding part and a second welding part; the composite solder preform comprises a polymer supporting structure and a solder preform, the polymer support structure surrounds the solder preform; wherein the melting point of the polymer supporting structure is greater than that of the solder preform, and the polymer supporting structure has a specified thickness; when the first welding piece and the second welding piece are welded, the composite welding flux preformed piece is contained between the first welding piece and the second welding piece and used for forming a supporting space between the first welding piece and the second welding piece in the welding process, so that the first welding piece and the second welding piece are always kept parallel in the welding process. And the molten solder preformed part forms a bonding layer with the uniform thickness between the first welding part and the second welding part by filling the supporting space, so that the first welding part and the second welding part are welded together through the bonding layer.

The invention discloses a composite welding strip and a photovoltaic module. The composite welding strip comprises a conductive core body made of an aluminum material and a copper conductive covering material covering the outer layer of the conductive core body. The total cross sectional area of the composite welding strip is S, the unit is mm, the mass per unit length of the conductive covering material in the length direction is A, the unit is g / m, A and S are in negative correlation, and the A and S meet the relation that A / S is larger than or equal to 0.32 and smaller than or equal to 23.38. Through the design, a differentiated structure that the copper layer of the thick solder strip is relatively thin and the copper layer of the thin solder strip is relatively thick is realized, so that the composite solder strips of different specifications are balanced among conductivity, light weight and economical efficiency, and the comprehensive benefits of the solder strips are remarkably improved.

The invention belongs to the technical field of power device packaging and materials, and particularly relates to non-pressure composite brazing filler metal capable of rapidly forming full IMC and a preparation method and application of the non-pressure composite brazing filler metal. According to the composite brazing filler metal, SAC305 alloy powder serves as the basis, the SAC305 alloy powder is mixed with (Cu, Ni)-coated Sn core-shell structure powder, an organic solvent in a specific proportion is added, and mixed solder paste is prepared. The mixed solder paste is suitable for a low / pressureless sintering process, a pulse electromagnetic field is adopted for auxiliary sintering, a compact and stable connection interface can be formed after sintering is carried out for several minutes at the temperature of 200-250 DEG C, a full IMC structure can be formed, the highest shear strength can reach 56.17 MPa, air tightness is good, the mixed solder paste is remarkably superior to a conventional traditional Cu-Sn system, and production and application requirements are met.

This invention discloses a high electromigration lead-free composite solder, belonging to the field of material preparation and connection technology. The lead-free composite solder comprises Cu@Ag particles and SAC305 powder in a weight ratio of 1:(60-200). This invention prepares a novel core-shell structure Cu@Ag reinforcing particles and adds them to the lead-free solder to form a novel composite solder joint, giving the composite solder joint excellent anti-electromigration performance. The reinforcing particles can play a role in local refinement and can also reduce the thickness of the intermetallic compound layer at the interface, making it another option for practical applications. The new Cu@Ag core-shell structure material prepared by this invention further enhances the role of the reinforcing particles. Cu, as the core, is wrapped in an Ag shell. Due to its stable properties, Ag not only plays a protective role, but its addition as a shell layer to the solder can also reduce costs. The lead-free composite solder provided by this invention is suitable for use in connectors for electronic packaging connections.

The utility model relates to the field of solder forming equipment, in particular to composite solder preparation equipment and composite solder particles. The composite brazing filler metal preparation equipment comprises a blank machining mechanism, a brazing flux feeding mechanism, a pressurizing mechanism and a conveying mechanism. The conveying mechanism comprises a mold tray and a conveying device, and a casting station, a feeding station and a pressurizing station are sequentially arranged on a conveying path of the conveying device; the blank machining mechanism is located at the casting station so as to cast brazing filler metal into the mold charging tray to form a brazing filler metal blank. The brazing flux feeding mechanism is located at the feeding station so as to feed brazing flux powder to the brazing filler metal blank in the mold charging tray; and the pressurizing mechanism is located at the pressurizing station so as to press the brazing flux powder and the brazing filler metal blank in the mold charging tray to form the composite brazing filler metal. According to the composite brazing filler metal preparation equipment, automatic production of composite brazing filler metal particles can be achieved, the material ratio is accurate, and the production efficiency is high; and the prepared composite brazing filler metal particles can be automatically fed, so that the production efficiency of an industrial chain is improved.

The application belongs to the technical field of solar photovoltaic module packaging, and discloses a gradient composite solder strip, a photovoltaic module containing the same and a preparation method. The gradient composite solder strip comprises, from the side in contact with the main grid line of the cell, a thermal expansion transition inner layer, an elastic support intermediate layer and a protective outer layer in sequence. The raw material for preparing the thermal expansion transition inner layer comprises silver particles, viscoelastic polymer, carbon nanotubes and low-melting-point metal powder, the elastic support intermediate layer is composed of elastic copper alloy and is pre-formed into a three-dimensional elastic structure, and the protective outer layer is composed of tin or tin-bismuth alloy. The gradient composite solder strip and the low-temperature solid-phase bonding process thereof can significantly reduce the bonding point interface resistance, stabilize it at the excellent level of milliohm, and greatly reduce the risk of hidden cracking of the cell. In addition, the process window is wide, and the compatibility with ultra-thin cells is excellent, so that a photovoltaic module with high reliability and long service life can be prepared.

The present application relates to a kind of nanoparticle enhanced low temperature interconnection, high temperature service composite spot and its preparation method, belong to advanced electronic packaging material and interconnection field, specifically, it is related to a kind of based on co-deposition electroplating process, face high-density packaging nano-enhanced low temperature interconnection composite micro-bump and its preparation method. Using nanoparticle induced full liquid phase metallurgical reaction, low melting point phase is quickly consumed and converted into high melting point phase in shorter interconnection time. Even if higher temperature is used in interconnection process to ensure full liquid phase fusion, the composite spot after reaction can obtain thermal stability significantly higher than initial melting point, and completely eliminates the risk of remelting in service environment.