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Ceramic phase reinforced copper-based composite solder and preparation method thereof

A technology of copper-based composite and composite solder, which is applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of residual joint strength and high cost, achieve excellent brazing process performance, prolong the release time, and reduce costs Effect

Inactive Publication Date: 2011-10-12
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the problems of high cost of Ag-Cu-Ti solder and low joint strength caused by residual stress in the existing ceramic connection method, and provides a copper-based composite solder with ceramic phase reinforcement and its preparation method

Method used

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Examples

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specific Embodiment approach 1

[0012] Specific embodiment one: In this embodiment, a copper-based composite brazing material reinforced by a ceramic phase is composed of 48% to 84% of Cu powder, 10% to 30% of Sn powder, 5% to 15% of Ti powder and 1% to 7% of B powder; wherein the Cu powder, Sn powder and Ti powder have a particle size of 35-75 μm, and the B powder has a particle size of 1-5 μm.

specific Embodiment approach 2

[0013] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the copper-based composite brazing material reinforced by the ceramic phase consists of 57% to 76% of Cu powder, 15% to 25% of Sn powder, 7% ~12% Ti powder and 2%~6% B powder. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0014] Specific embodiment three: the difference between this embodiment and specific embodiment one is that the copper-based composite brazing material reinforced by the ceramic phase consists of 62%~72% Cu powder, 17%~22% Sn powder 8%~ Composed of 11% Ti powder and 3%-5% B powder. Others are the same as in the first embodiment.

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Abstract

The invention discloses a ceramic phase reinforced copper-based composite solder and a preparation method thereof, relates to a copper-based composite solder and a preparation method thereof, and aims to solve the problems that an Ag-Cu-Ti solder has high cost, and low joint strength caused by residual stress in the conventional ceramic connection method. The ceramic phase reinforced copper-based composite solder comprises Cu powder, Sn powder, Ti powder and B powder. The method comprises the following steps of: mixing the Cu powder, the Sn powder, the Ti powder and the B powder to obtain mixed powder; and adding the mixed powder and ceramic balls into a ball-milling tank of a planetary ball mill, and performing ball milling for 1 to 5 hours at a rate of 300r / min under the protection of argon gas to obtain a uniformly mixed Cu-Sn-Ti-B composite solder. Soldering cost is reduced, and thermal mismatching between metal and ceramic is adjusted by growing TiB crystal whiskers in a joint in situ, so that the usability of the soldered joint is improved. The solder is applied to the soldering connection of the ceramic.

Description

technical field [0001] The invention relates to a copper-based composite solder and a preparation method thereof. Background technique [0002] The connection of ceramics and ceramics, and ceramics and metals can overcome the inherent brittleness and difficult processing of ceramic materials, meet the needs of aerospace, metallurgy and other fields for large-scale, complex-shaped parts, and expand their scope of use. Therefore, the development and application of ceramic connection technology has attracted much attention. At present, the active brazing method is mainly used for ceramic connection, and the active brazing material used is mainly Ag-Cu-Ti, but the high silver content increases the brazing cost. In addition, due to the difference in thermal matching between ceramics and brazed joints, it is easy to cause problems such as large joint stress and low strength. Usually, ceramic particles, hard metal particles, and fibers with high Young's modulus and low linear expa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/28C22C1/05
Inventor 林铁松何鹏杨敏旋
Owner HARBIN INST OF TECH
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