Lead-free compound solder by Ni particle strengthening tin and silver group and preparing method thereof

A composite brazing filler metal and particle-enhanced technology, which is applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problem of little research on brazing technology, and achieve improved thermal fatigue resistance, fewer components, and simple preparation process. Effect

Inactive Publication Date: 2008-07-23
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] At present, there is little researc

Method used

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  • Lead-free compound solder by Ni particle strengthening tin and silver group and preparing method thereof
  • Lead-free compound solder by Ni particle strengthening tin and silver group and preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] 1) Same as step 1) in Comparative Example 1;

[0033] 2) Braze the Ni (3vol%) particle-reinforced composite solder paste prepared in step 1), and keep heating at 330℃. When the composite solder paste slowly reaches 220.2℃ to melt, keep heating at 1.4℃ / sec. When the temperature of the composite solder paste reaches the peak temperature of 280℃, it will be cooled to a solid state at a cooling rate of 5.5℃ / sec. When the temperature drops to 60℃, the brazing ends, the structure is stable and reliable, and the shear strength value is 49.74MPa.

Embodiment 2

[0035] 1) Same as step 1) in Comparative Example 1;

[0036] 2) Braze the Ni (3vol%) particle-reinforced composite solder paste prepared in step 1), keep the furnace temperature at 330°C, and when the composite solder paste slowly reaches 220.2°C to melt, keep the temperature rising rate of 0.8°C / sec Heating, when the temperature of the composite solder paste reaches the peak temperature of 280°C, it begins to cool to a solid state. The cooling rate is 5.5°C / sec. After the solder solidifies, its structure will slowly develop, but it does not affect the overall performance. When the temperature drops to 60°C, the brazing ends, the structure is stable and reliable, and the shear strength value is 54.36MPa.

Embodiment 3

[0042] 1) Same as step 1) in Comparative Example 2;

[0043] 2) Braze the Ni (4.5vol%) particle-reinforced composite solder paste prepared in step 1), keep the furnace temperature at 330℃, and when the composite solder paste slowly reaches 220.2℃ to melt, keep the heating rate of 1.4℃ / sec Heating, when the temperature of the composite solder paste reaches the peak temperature of 280°C, it begins to cool to a solid state. The cooling rate is 5.5°C / sec. After the solder solidifies, its structure will slowly develop, but it does not affect the overall performance. When the temperature drops to 60°C, the brazing ends, the structure is stable and reliable, and the shear strength value is 55.53MPa.

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Abstract

The invention provides a Ni grain reinforced tin-silver-based lead-free composite solder and a preparation method thereof, belonging to the manufacture technical field of solders used for the surface assembly of an electronic element. The invention solves the problem that the existing composite solder has poor mechanical performance and is lack of effective brazing technique. The solder of the invention consists of the Ni reinforced grain with the volume percentage of 3-8.5% and the Sn-3.5Ag eutectic crystal soldering paste with the volume percentage of 91.5-97%; the particle size of the Ni grain is 2-3Mum . The Ni grains and the Sn-3.5Ag eutectic crystal soldering paste of the invention are mixed through a mixed machine according to the proportion for 20-30 minutes and are brazed with the furnace temperature kept at 330 DEG C; after the solder is melted, the solder is heated under the temperature-rising speed of 0.6-14 DEG C/sec; after the temperature reaches 280 DEG C, the solder is cooled to solid state with the cooling speed of 5.5 DEG C/sec. The Ni grains and a basic body of the invention carry out metallurgical bonding, thus keeping good physical performance and spreadability, and improving the shearing strength at the same time.

Description

Technical field [0001] The invention belongs to the technical field of solder manufacturing for the surface assembly of electronic devices, and specifically relates to a Ni particle reinforced tin-silver-based lead-free composite solder and a preparation method thereof. Background technique [0002] Sn-Pb solder is widely used in the surface assembly process of electronic and electrical components. Due to its mature technology, simple components, low cost, and good brazing process performance, good mechanical and physical properties, Sn-Pb solder has been widely used in the electronics industry. [0003] However, Pb is a toxic and harmful substance. When waste electronic appliances are landfilled, Pb in the solder will form pb when it encounters acid rain or groundwater 2+ , Dissolves in groundwater, enters people's water supply chain and enters the human body, causing lead poisoning. In consideration of environmental protection, the European Union (EU) has passed the "Directive ...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C1/02
Inventor 郭福聂京凯夏志东雷永平史耀武
Owner BEIJING UNIV OF TECH
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