95 results about "Tin-silver-copper" patented technology

The invention discloses a halogen-free cleaning-free rosin flux, and preparation and application thereof, and particularly relates to a flux suitable for surface mount lead-free welding paste, preparation of the flux and application of the flux. The flux comprises 20-50% (mass fraction, the same below) of rosin, 5-25% of film-forming agent, 30-50% of high boiling solvent, 3-8% of activator and 2-5% of thixotropic agent, and the flux does not contain any halogen. In order to control growth of interface IMC (intermediate compound) during welding, 0.3-1% of combined inhibitor is added. The welding paste prepared with the flux and lead-free tin-silver-copper powder has the advantages of excellent printing performance, fine weldability, less post-weld residue, thin and even welding spot interface IMC and excellent mechanical property, and is capable of meeting the requirement of high-end electronic products on packaging.

A tin-silver-copper contains plating solution which comprises water which is a primary medium, a sulfonic acid, a tin ion, a copper ion and a silver ion, wherein concentrations of the silver ion, the tin ion and the copper ion are 0.0015 to 0.1 mol/L, 0.21 to 2 mol/L and 0.002 to 0.02 mol/L, respectively; a plating film which has 2.6 to 3.4 weight percent of silver, 0.4 to 0.7 weight percent of copper and the substantially balanced amount of tin; an electrolytic plating method for use in forming the above plating film from the above plating solution; and a soldering method using the plating film.

A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions.

A semiconductor device having both high strength and high thermal radiation that is capable of being applied to mounting on automobiles experiencing many thermal cycles, and a manufacturing method thereof are provided. A circuit board 1a for a resin encapsulated semiconductor module device has a configuration where a silicon nitride plate 2 with a thickness of 0.635 mm has copper plates of 1.0 mm and 0.8 mm bonded to both sides thereof via active metal. A copper plate 3a is bonded to the surface side of the silicon nitride plate 2, and a prescribed circuit pattern is formed on the copper plate 3a. Tin-silver-copper cream solder layers 4a and 4b with a thickness of 200 μm are formed at a prescribed location on the circuit pattern 3a on which a semiconductor element 6 is mounted and at a prescribed location of a base plate 1 on which the circuit board 1a is disposed. Nickel particles 5 having a maximum particle size of 100 μm and an average particle size of 70 μm are dispersed in the solder 4a on the base plate 1 of good thermal conductivity. A semiconductor element (chip) 6, the circuit board 1a, and the base plate 1 are disposed on predetermined locations. Thereafter, they are set in a reflow oven (not shown in the drawings) for reflow soldering. After the inside of the reflow oven is replaced by a nitrogen atmosphere, the reflow oven is heated to 280° C. At the time when solder is melted, the inside of the oven is decompressed to 1 Pa, nitrogen is introduced, and the reflow oven is cooled to about room temperature, thereby completing the solder bonding step. After flux is washed, an outer case 7 with an insert-molded outlet terminal 8 is adhered to the base plate 1 and a predetermined connection is conducted via an aluminum bonding wire 9. Then, silicone gel 10 is injected into a package delimited via the base plate 1 and the outer case 7, and the silicone gel 10 is heat-hardened, thereby completing a resin encapsulated semiconductor device A.

A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.

A tin-silver-copper containing plating solution which comprises a medium having water as its primary component, a sulfonic acid, a tin ion, a copper ion and a silver ion, wherein concentrations of the silver ion, the tin ion and the copper ion are 0.015 to 0.1 mol/L, 0.21 to 2 mol/L and 0.002 to 0.02 mol/L, respectively; a plating film which comprises 2.6 to 3.4 wt % of silver, 0.4 to 0.7 wt % of Cu and the substantially balanced amount of tin; an electrolytic plating method for use in forming the above plating film from the above plating solution; and a soldering method using the plating film. The plating solution exhibits high stability, and the plating film has a low melting point.

The invention discloses a lead-free tin solder paste and a preparation method thereof. The lead-free tin solder paste comprises the raw materials by mass percent: 80-90% of tin-silver-copper alloy tinpowder and 10-20% of lead-free flux, wherein the tin-silver-copper alloy tin powder comprises the componentsby mass percent: 0.3-3.0% of silver, 0.5-0.7% of copper and 96.5-99.0% of tin, and the lead-free flux comprises the componentsby mass percent: 20-35% of solvent, 30-45% of rosin, 5-10% of surface active agent, 10-20% of organic acid, 3-10% of antioxidant and 2-8% of thixotropic agent. The rosin which is a mixture of hydrogenated rosin and polymerized rosin according to a weight ratio of 1:(1-3) is adopted, so that the prepared lead-free tin solder paste is good in adhesive force and stability; by adjusting a ratio of the solvent to the rosin, the prepared lead-free tin solder paste has a wider viscosity range and good printing performance; with the compounding of various organic acid, the prepared lead-free tin solder paste is halogen-free, and the activity of the lead-free tin solder paste is improved greatly; the surface active agent is compounded with the solvent with high boiling point, low viscosity and low volatility, so that the prepared lead-free tin solder paste is long in printing time, and excellent in insulating property.

The invention relates to a tin-silver-copper ternary alloy lead-free soldering paste. Alloy welding powder is made to the soldering paste through bismuth-tin binary eutectic alloy welding powder Bi48Sn42 and Sn-Ag-Cu ternary alloy welding powder with a melting point between 200 to 230 DEG C as well as scaling powder; wherein, the bismuth-tin binary eutectic alloy welding powder takes the 80 to 90 percent of mass percent; the tin-copper binary eutectic alloy welding powder takes 9.6 to 19.5 percent of mass percent; the scaling powder takes 0.1 to 0.5 percent of mass percent. The tin-silver-copper ternary alloy lead-free soldering paste keeps the peak value temperature in reflow soldering process between 210 to 215 DEG C, greatly reducing the peak value temperature and the possibility of damaging a breadboard and an element device.

A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the solder alloy, the silver content is more than 1.0 mass % and less than 1.2 mass %, the antimony content is 0.01 mass % or more and 10 mass % or less, and the bismuth content is 0.01 mass % or more and 3.0 mass % or less.

The invention discloses a preparation method for a copper/aluminium nitride ceramic composite heat-conductive substrate. The method comprises the following steps: 1) providing through holes in the surface of an aluminium nitride substrate; 2) coating copper electronic paste layers on the double surfaces of the aluminium nitride substrate; 3) filling the through holes with pre-oxidation copper cylinders; 4) carrying out overall sintering for 30 min; 5) carrying out brazing after the double surfaces of the aluminium nitride substrate being coated with tin silver copper solder materials; 6) carrying out surface polishing; and 7) carrying out copper plating processing directly and forming uniform copper layers, and thus, the copper/aluminium nitride ceramic composite heat-conductive substrate is obtained. The through holes in the copper/aluminium nitride ceramic composite heat-conductive substrate produced with the preparation method are communicated up and down; the combination between the metalized layers in the holes and the ceramic substrate is strong; the middle copper cylinders can realize the communication of the copper layers on the upper and lower surfaces; and the copper/aluminium nitride ceramic composite heat-conductive substrate helps the transmission of electrical signals and has the advantages of ideal heat-conductive effect, low thermal expansion coefficients and good conductivity and the like.

The invention discloses conducting resin for a scanning electronic microscope and a preparation method thereof, which belongs to the technical field of resin composite materials. The conducting resin adopts epoxy resin as a base material, ethylene diamine as a curing agent, and tin-silver-copper powder or silver-coated copper powder as conductive particles, and comprises the following components by mass percent: 32-34% of epoxy resin, 3-4% of ethylene diamine and 62-65% of tin-silver-copper powder or silver-coated copper powder. Ethylene diamine is added into epoxy resin and simultaneously uniformly stirred; the conductive particles are added and stirred at the same time till the conductive particles are completely uniformly dispersed and glue-like mixture reaches a substantially cured degree; the glue-like mixture is added into a die; and the glue-like mixture is dried and cured at room temperature, and then samples are taken out. The conducting resin can fully meet the requirements of SEM (scanning electron microscope) observation.

The invention relates to the field of electronic packaging, in particular to a ceramic substrate and copper clad foil low-temperature connecting soldering paste for a powder module and a production process thereof. The soldering paste is composed of brazing filler metal powder and scaling powder; the brazing filler metal powder is tin-silver-copper-titanium powder, the mass fraction of the Sn in the tin-silver-copper-titanium powder ranges from 35%-50%, the mass fraction of the Ag in the tin-silver-copper-titanium powder ranges from 15%-35%, the mass fraction of the Cu in the tin-silver-copper-titanium powder ranges from 20%-40%, and the mass fraction of the Ti in the tin-silver-copper-titanium powder ranges from 4%-8%; and the scaling powder mainly comprises, by weight, 24%-35% of rosin, 45%-50% of a solvent, 2%-6% of a corrosion inhibitor, 8% of an active agent, 6% of a thixotropic agent and 4%-15% of a thickening agent. According to connection of a ceramic substrate and copper, the process can be simplified, the connecting temperature can be remarkably reduced, the heat stress and the interface voidage are accordingly reduced, and the connector quality is accordingly improved.

The invention relates to a tin, silver and copper based lead-free composite solder with enhanced nanometer-structure and a preparation method thereof, which belong to the technical field of the manufacturing of metal-based lead-free composite solders. The existing spreading process for SnSn-Ag-Cu series lead-free solder is characterized by poor processing performance, short creep rupture service life and high cost. The composite solder of the invention consists of 97 wt percent to 99 wt percent of commercial Sn-3.0Ag-0.5Cu solder paste and 1 wt % to 3 wt % of enhanced particles (POSS1, POSS2 or POSS3). The solder paste consists of 85 wt percent of Sn-3.0Ag-0.5Cu solder and 15 wt % of flux. The tin, silver and copper based lead-free composite solder with enhanced nanometer-structure is prepared by stirring and mixing the solder paste and enhanced particles according to the component concentration for 15 to 30 minutes. The composite solder of the invention has the advantages of good wettability and good creep rupture resistance, high shearing strength, excellent mechanical property, long creep rupture service life of the soldered joint and simple preparation process, etc.

The invention relates to a low-cost anti-aging brazing filler material used for electronic packaging and a preparation method thereof, relating to a soft brazing filler material and a preparation method thereof. The invention solves the technical problems that the traditional low silver content lead free brazing filler material has higher silver content, multiple elements are added, metallurgy preparation is complex, a curing crack can be easily caused and the melting point is higher. The brazing filler material comprises the following components: 0.60-0.79% of Ag, 0.50-0.90% of Cu, 0.02-0.20% of Ni, 2.10-4.00% of Bi and the balance of Sn. The preparation method comprises the step of carrying out smelting on Sn, Ag, Cu, Ni and Bi for twice, thus the brazing filler material is obtained. The melting point of the brazing filler material is 205-219 DEG C, the wettability and weldability are good, the cost is reduced by 30-43% compared with the brazing filler material SAC305, and the jointstrength and high temperature aging resistance of the brazing filler material are improved compared with SAC305 and SAC0307. The brazing filler material provided by the invention can be applied to the fields of electronic packaging, manual welding of packaging, wave soldering and reflow soldering.

The invention provides brazing powder for ultrasonic assisted brazing and a brazing method. The brazing powder is prepared by uniformly mixing tin copper powder or tin silver copper powder, or powderof the tin copper powder mixed with the tin silver copper powder with any one kind, or any two kinds, or any three kinds, or any four kinds, or any five kinds of nickel powder, cobalt powder, copper powder, tin powder and titanium powder of active nanoparticles with the diameters being 1-1000nm according to the mass ratio being at most 20%. According to the brazing powder for ultrasonic assisted brazing and the brazing method, the temperature is low during welding, and the active nanoparticles are adopted; by oscillation heating of an ultrasonic generator, the metallurgical reaction between solder or the nanoparticles and a base material is promoted, the full-solid phase or semisolid state low-temperature interconnection of lead-free solder is realized, and the welding temperature is morethan 30% lower than conventional liquid phase interconnection; oscillating activation and friction generated by the ultrasonic generator can cause an oxidation film on the surface of the welding basematerial to be broken to achieve the effect of film removal, thus gas pollution from a welding flux is reduced, the welding pollution is less, and the joint quality is high.

Techniques have been developed to provide, in some embodiments, an attachment structure for mechanically and electrically connecting substrates that is robust to differences in coefficients of thermal expansion. In some realizations lead-free alloy columns are joined to bonding pads on electronic packages having relatively low coefficients of thermal expansion (CTEs) using Pb-free solder from the same alloy system. In some embodiments, a thermal hierarchy in the tin-silver-copper (Sn—Ag—Cu or SAC) ternary alloy system is provided. In some embodiments an attachment system with a high-liquidus alloy column, an intermediate-liquidus solder, and a low-liquidus solder, all three of which components have compositions in the SAC alloy system, is provided.

The invention relates to the technical field of automobile lamps, in particular to an LED automobile head lamp. The LED automobile head lamp comprises a stereoscopic even-temperature board, LED-COB light sources, an outer bulb metal cover, a finned heat sink and a fan. The stereoscopic board is of a T-shaped stereoscopic structure and is internally provided with a vacuum evaporation cavity and a condensation cavity, and a capillary core layer is arranged. The LED-COB light sources are pasted to the outer surfaces of the evaporation cavity, the front end of the finned heat sink is pasted to the outer surface of the condensation cavity, and the fan is arranged at the back end of the finned heat sink. The outer lamp metal cover is made of magnesium alloy materials. Besides the fan, the parts are connected in a high-temperature welded mode through tin-silver-copper environment-friendly solder paste. According to the LED automobile head lamp, the four heat sinking technical means including phase change heat sinking, metal-cooling-fin heat conduction heat sinking, air-cooling heat sinking and radiation heat sinking are integrated, and heat sinking efficiency is high; the anti-vibration effect is good, and the structure is firm; installation is convenient, focusing is accurate, an original bulb can be perfectly replaced, and the LED automobile head lamp is suitable for various vehicle types.

The invention belongs to the technical field of welding materials and discloses tin-silver-copper composite solder paste enhanced by titanium dioxide nanoparticles and a preparation method thereof. The composite solder paste is obtained by blending tin-silver-copper lead-free solder paste and the titanium dioxide nanoparticles. The preparation method includes the following steps that the titanium dioxide nanoparticles are added into the tin-silver-copper lead-free solder paste with the mass ratio being 96.5:3:0.5, the titanium dioxide nanoparticles are evenly distributed in the tin-silver-copper lead-free solder paste through mechanical stirring, and accordingly the tin-silver-copper composite solder paste enhanced by the titanium dioxide nanoparticles is obtained. According to the tin-silver-copper composite solder paste, by adding the titanium dioxide nanoparticles, growth of an Ag3Sn phase in the solder paste is restrained, microhardness and mechanical property of the composite solder paste are improved, and growth of intermetallic compounds of a solder joint interface can be effectively restrained, crystal grains of the intermetallic compounds of the solder joint interface are refined, soldering reliability is improved, and the application prospect is good.

A device fabrication method, according to which a tin-copper-alloy layer is formed adjacent to a copper-plated pad or pin that is used to electrically connect the device to external wiring. Advantageously, the tin-copper-alloy layer inhibits copper dissolution during a solder reflow process because that layer is substantially insoluble in liquid Sn—Ag—Cu (tin-silver-copper) solder alloys under typical solder reflow conditions and therefore shields the copper plating from direct physical contact with the liquefied solder.