Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Conducting resin for scanning electronic microscope and preparation method thereof

An electron microscope, conductive resin technology, applied in the field of material processing, can solve problems such as high cost, sample surface damage, and inability to sample chemical analysis.

Inactive Publication Date: 2012-06-20
BEIJING UNIV OF TECH
View PDF5 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the gold film can prevent the incidence of X-rays, so the chemical analysis of the sample cannot be carried out with a scanning electron microscope.
In addition, the metal coating method is expensive and may cause damage to the sample surface

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Conducting resin for scanning electronic microscope and preparation method thereof
  • Conducting resin for scanning electronic microscope and preparation method thereof
  • Conducting resin for scanning electronic microscope and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] In order to make plastics reach the purpose of conduction, the present invention uses raw materials: epoxy resin is as base material, ethylenediamine is as curing agent, and silver clad copper powder is as conductive particles (metal silver 18%, metal copper 82%; Particle size is diameter 30 ~50μm). Required experimental utensils: glass rod, medicine spoon, polishing liquid, polishing cloth, plastic cup, 5 cylindrical molds, and 5 copper sheets to observe the internal structure, electronic balance. Specific methods include the following:

[0040] 1. Weigh 80g of epoxy resin, 8g of ethylenediamine, and 160g of silver-coated copper powder with an electronic balance, and place them in three identical plastic cups.

[0041]2. Add ethylenediamine to the plastic cup filled with epoxy resin and stir well at the same time.

[0042] 3. Slowly add silver-coated copper powder, stirring while adding, to prevent too fast curing into agglomerates, resulting in uneven dispersion of ...

Embodiment 2

[0050] In order to reduce the cost and make the experiment more economical, the present invention can also replace the expensive silver-coated copper powder with relatively cheap tin-silver-copper powder. Experimental raw materials: base material epoxy resin, curing agent ethylenediamine, conductive particle tin-silver-copper powder (metal silver 3%, metal copper 0.5%, 96.5% metal tin; particle size is 30-50 μm in diameter), the required experiment Utensils: glass rod, medicine spoon, polishing liquid, polishing cloth, plastic cup, 5 cylindrical molds, 5 copper sheets to observe the internal structure, electronic balance. Specific methods include the following:

[0051] 1. Weigh 80g of epoxy resin, 8g of ethylenediamine, and 160g of tin, silver and copper powder with an electronic balance, and place them in three different plastic cups.

[0052] 2. Add ethylenediamine to the plastic cup filled with epoxy resin and stir well at the same time.

[0053] 3. Slowly add tin, silve...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Resistivityaaaaaaaaaa
Resistivityaaaaaaaaaa
Login to View More

Abstract

The invention discloses conducting resin for a scanning electronic microscope and a preparation method thereof, which belongs to the technical field of resin composite materials. The conducting resin adopts epoxy resin as a base material, ethylene diamine as a curing agent, and tin-silver-copper powder or silver-coated copper powder as conductive particles, and comprises the following components by mass percent: 32-34% of epoxy resin, 3-4% of ethylene diamine and 62-65% of tin-silver-copper powder or silver-coated copper powder. Ethylene diamine is added into epoxy resin and simultaneously uniformly stirred; the conductive particles are added and stirred at the same time till the conductive particles are completely uniformly dispersed and glue-like mixture reaches a substantially cured degree; the glue-like mixture is added into a die; and the glue-like mixture is dried and cured at room temperature, and then samples are taken out. The conducting resin can fully meet the requirements of SEM (scanning electron microscope) observation.

Description

technical field [0001] The invention uses material processing technology in material science and engineering to observe metal samples with a scanning electron microscope, and belongs to the technical field of resin composite materials. Background technique [0002] An optical microscope is an optical instrument that uses optical principles to magnify and image tiny objects that cannot be resolved by the human eye, so that people can extract microstructure information. Scanning electron microscope (short for "scanning electron microscope" or "SEM") is a microscopic observation method between transmission electron microscope and optical microscope, which can directly use the material properties of the sample surface material for microscopic imaging. [0003] In principle, the scanning electron microscope uses a focused very fine high-energy electron beam to scan on the sample to stimulate various physical information. By accepting, amplifying and displaying the information, t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L63/00C08K13/02C08K5/17C08K3/08C09D163/00C09D5/00C09D5/16
Inventor 郭福徐广臣吴丹殷晓飞阎海亮章亚建肖庆丰
Owner BEIJING UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com