Preparation technology of nanometer tin-silver-copper soldering powder

A preparation process, nano-tin technology, applied in manufacturing tools, welding equipment, welding media, etc., can solve problems such as unfavorable energy saving and emission reduction, high welding temperature, etc.

Inactive Publication Date: 2017-03-08
CHINA JILIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

First of all, higher soldering temperature is not conducive to energy saving and emission reduction; secondly, since the current electronic packaging technology, electronic components and packaging production lines are all developed based on Sn-Pb eutectic solder, the increase of soldering temperature has a great impact on soldering equipment, A series of systematic projects such as welding technology, electronic components and substrate material heat resistance have posed severe challenges; again, for some electronic products, such as solar thin films, LEDs, LCDs, temperature control components, and flexible boards. Low-temperature soldering is required for step-by-step soldering

Method used

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  • Preparation technology of nanometer tin-silver-copper soldering powder
  • Preparation technology of nanometer tin-silver-copper soldering powder
  • Preparation technology of nanometer tin-silver-copper soldering powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Take a beaker 1 wrapped with tinfoil, weigh 3.4360g (0.016mol) of stannous sulfate, 0.0376g (0.156mmol) of copper nitrate trihydrate, add 20mL of deionized water, add a magnet and stir to dissolve; take another beaker wrapped with tinfoil In beaker 2, weigh 0.1105g (0.650mmol) of silver nitrate, add 20mL of deionized water; add the magnet and stir to dissolve, pour the silver nitrate solution into beaker 1, rinse beaker 2 with 10mL of deionized water, wash the Pour the water into beaker 1, stir for 10 minutes, and prepare the precursor solution.

[0026] Weigh 4.840 g (0.127 mol) of reducing agent sodium borohydride, the molar ratio of sodium borohydride to metal elements is 7:1, add 100 mL of absolute ethanol to prepare sodium borohydride reducing agent solution.

[0027] In an ice-water bath at 0°C, quickly pour the reducing agent solution into the precursor solution, and vigorously stir the reaction for 1 hour to obtain a solution containing metal particles; carry ou...

Embodiment 2

[0031] The same method as in Example 1 configures the precursor solution and the reducing agent solution, then adds 1.7g of the surfactant 1,10-phenanthroline in the reducing agent solution, and the mass ratio of the metal precursor to the surfactant is 2:1. Other preparation processes are the same as in Example 1.

[0032] image 3 It is the scanning electron microscope picture and the particle size distribution map of the solder powder in Example 2. The particle size of the nanopowder is in the range of 50-150nm, and the surface of the metal particle is coated with a surfactant, so the boundaries of the particles are blurred, and more than 70% of the particles The diameter distribution is around 100nm. Figure 4 It is the thermal analysis diagram of the solder powder in Example 2. The melting point of the sample has dropped from 215.4°C in Example 1 to 211.6°C. It is confirmed that the addition of surfactant reduces the agglomeration between particles, the particle size de...

Embodiment 3

[0034] The same method as in Example 1 configures the precursor solution and the reducing agent solution, then adds 3.5g of the surfactant o-phenanthroline in the reducing agent solution, the quality of the metal precursor and the mass ratio of the surfactant are 1: 1. Other preparation processes are the same as in Example 1.

[0035] Figure 5 It is the thermal analysis chart of the solder powder of embodiment 3. The melting point of the sample is 209.5°C, demonstrating that the increase in surface activity lowers the melting point.

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Abstract

The invention discloses a preparation technology of nanometer tin-silver-copper soldering powder and belongs to the technical field of packaging materials. According to the preparation technology of the nanometer tin-silver-copper soldering powder, nanometer lead-free soldering powder is prepared through a chemical reduction method, the synthesis process conditions are regulated and controlled from the aspects of screening of a precursor and a reducing agent, the type of a surface active agent, adjustment of the concentration of the surface active agent, the reaction temperature, the drying temperature and the like, the dimensions and shapes of nanometer metal particles are effectively controlled, and therefore the melting point of the nanometer metal soldering powder is lowered. When the mass ratio between the metal precursor and the surface active agent is 1:1, the reaction temperature is 0 DEG C, the drying temperature is 20 DEG C, a reducing agent solution is rapidly poured into a precursor solution, the nanometer tin-silver-copper soldering powder with the melting point lower than that of existing nanometer tin-silver-copper alloy can be obtained according to the preparation technology, and the low-temperature soldering demand of electronic packaging is met. The preparation technology of the nanometer tin-silver-copper soldering powder is simple, convenient, mild in production condition, low in energy consumption and cost and suitable for industrial production.

Description

technical field [0001] The invention belongs to the technical field of packaging materials, and relates to a preparation process of nano tin-silver brazing powder. Background technique [0002] In today's information age, with the rapid development of portable computers, mobile communications and military electronic technology, the demand for integrated circuits has risen sharply, making microelectronic packaging technology usher in an "explosive" development period, which also promotes electronic packaging. The use of welding technology in industry is becoming more and more widespread. [0003] The application of Sn-Pb solder has a long history. It has the advantages of low melting point, abundant raw materials and low price, and has become the most important solder series in the electronics industry. However, lead is a heavy metal, and the human body may absorb lead or its compounds through breathing, eating, skin absorption, etc. Therefore, it is the trend of the times ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40B22F9/24
CPCB22F9/24B23K35/40
Inventor 沈杭燕刘文晓刘薇郭冰郭驾宇
Owner CHINA JILIANG UNIV
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