Ceramic substrate and copper clad foil low-temperature connecting soldering paste and production process thereof

A technology for ceramic substrates and production processes, applied in welding media, manufacturing tools, welding equipment, etc., can solve the problems of high connection temperature, high void ratio, and large thermal stress, to simplify the process, ensure joint quality, and reduce thermal stress. the effect of

Inactive Publication Date: 2017-01-11
HARBIN INST OF TECH AT WEIHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the defects of high connection temperature, large thermal stress and high

Method used

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  • Ceramic substrate and copper clad foil low-temperature connecting soldering paste and production process thereof

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Experimental program
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Effect test

Embodiment 4

[0026] The thickener content is 9% in embodiment 4; The thickener content is low in embodiment 1,5,6,7, is 4%. In embodiment 3, 4, 5, 7, adopted three component solvents.

[0027] The test found that the content of Sn and Ti in Example 3 was moderate, and the melting point was lowered while ensuring a good connection with the ceramic side. The three-component solvent composed of terpineol, diethylene glycol monobutyl ether and diethylene glycol methyl ether can adapt to With different combinations of thixotropic agents and activators, the viscosity of solder paste is moderate. The microstructure of the ceramics and copper interface connected by the solder paste produced by the process in Example 3 is shown in figure 1 .

Embodiment 1

[0029] The invention relates to a low-temperature solder paste for connecting a ceramic substrate with copper, which is composed of solder powder and flux paste. Among them, in the solder powder: the mass fraction of Ag is 26%, the mass fraction of Cu is 30%, the mass fraction of Ti is 4%, and the mass fraction of Sn is 40%. The solder paste is mainly composed of the following materials in weight percentage:

[0030] Rosin: water white rosin 35%

[0031] Solvent: 20% terpineol, 25% 2-ethyl-1,3-hexanediol

[0032] Thixotropic agent: polyamide wax 6%

[0033] Active agent: Alkylphenol polyoxyethylene ether 8%

[0034] Corrosion inhibitor 2%

[0035] Thickener 4%

[0036] The production process of the low-temperature solder paste connecting the ceramic substrate with copper mainly includes the following steps:

[0037] (1) weigh 40g solder powder and place it in a ball mill jar, wherein the mass fractions of the four elements tin, silver, copper and titanium are as mentione...

Embodiment 2

[0045] The invention relates to a low-temperature solder paste for connecting a ceramic substrate with copper, which is composed of solder powder and flux paste. Wherein in the solder powder: the massfraction of Ag is 20%, the massfraction of Cu is 40%, the massfraction of Ti is 5%, the massfraction of Sn is 35%, and the flux paste is mainly made up of following weight percent materials:

[0046] Rosin: dimerized rosin 33%

[0047] Solvent: terpineol 20%, diethylene glycol monobutyl ether 25%

[0048] Thixotropic agent: polyamide 6%

[0049] Active agent: Alkylphenol ethoxylate 4%, Nonylphenol ethoxylate 4%

[0050] Corrosion inhibitor 2%

[0051] Thickener 6%

[0052] The production process of the low-temperature solder paste connecting the ceramic substrate with copper mainly includes the following steps:

[0053](1) weigh 40g solder powder and place it in a ball mill jar, wherein the mass fractions of the four elements tin, silver, copper and titanium are as mentioned ...

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Abstract

The invention relates to the field of electronic packaging, in particular to a ceramic substrate and copper clad foil low-temperature connecting soldering paste for a powder module and a production process thereof. The soldering paste is composed of brazing filler metal powder and scaling powder; the brazing filler metal powder is tin-silver-copper-titanium powder, the mass fraction of the Sn in the tin-silver-copper-titanium powder ranges from 35%-50%, the mass fraction of the Ag in the tin-silver-copper-titanium powder ranges from 15%-35%, the mass fraction of the Cu in the tin-silver-copper-titanium powder ranges from 20%-40%, and the mass fraction of the Ti in the tin-silver-copper-titanium powder ranges from 4%-8%; and the scaling powder mainly comprises, by weight, 24%-35% of rosin, 45%-50% of a solvent, 2%-6% of a corrosion inhibitor, 8% of an active agent, 6% of a thixotropic agent and 4%-15% of a thickening agent. According to connection of a ceramic substrate and copper, the process can be simplified, the connecting temperature can be remarkably reduced, the heat stress and the interface voidage are accordingly reduced, and the connector quality is accordingly improved.

Description

technical field [0001] The invention relates to the field of electronic packaging, in particular to a solder paste for low-temperature connection of a ceramic substrate and a copper-clad foil and a production process thereof. Background technique [0002] Ceramics have the advantages of good heat dissipation, moisture resistance, high temperature resistance, etc., and are widely used in high-power electronic modules, such as GTG, IG-BT, high-power DC / DC power supply modules, solid state relays, semiconductor refrigeration stacks, etc. Among the current copper cladding methods for ceramic substrates, the mainstream technology is direct copper cladding (DBC). This technology can be used for alumina substrates or oxidized aluminum nitride substrates. When the ceramic substrate and copper foil are heated to about 1063 ° C, Cu and O will form a eutectic liquid phase CuO, and this Cu-O eutectic will wet Wet the aluminum oxide substrate and copper foil that are in contact with eac...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/30B23K35/363
CPCB23K35/025B23K35/262B23K35/302B23K35/3612B23K35/362
Inventor 宋晓国康佳睿付伟牛超楠刘多曹健
Owner HARBIN INST OF TECH AT WEIHAI
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