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Halogen-free cleaning-free rosin flux, and preparation and application thereof

A flux and rosin-type technology, applied in the field of rosin-type halogen-free no-cleaning flux

Active Publication Date: 2012-06-27
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the previous studies focused on alloying the solder and surface treatment of the substrate to achieve the purpose of improving the morphology of the IMC, such as YU D Q et al. in Journal of Alloys and Compounds (2004, 376 (1-2): 170- 175) reported that Sn-2.5Ag-0.7Cu alloy was alloyed with rare earth RE, and after adding rare earth, the solder matrix and the interface IMC after welding were significantly refined, and the shear strength and tensile strength were correspondingly improved; LIN Y C et al. in Scripta Materialia (2007, 56(1): 49-52) reported that the phosphorus content plays a decisive role in the growth of the SnAgCu / Ni-P interface phase Ni-Sn-P, and the IMC growth is controlled by the change of the P content; There are indeed few reports in the literature that consider solving this problem in flux

Method used

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  • Halogen-free cleaning-free rosin flux, and preparation and application thereof
  • Halogen-free cleaning-free rosin flux, and preparation and application thereof
  • Halogen-free cleaning-free rosin flux, and preparation and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A kind of soldering flux for electronic package lead-free solder paste, its component and content (wt%) are:

[0025]

[0026] Concrete preparation method: weigh methyl carbitol, diethylene glycol, and glycerol and place them in a 500-ml beaker container, and press methyl carbitol: diethylene glycol: glycerol=18:16:4 ratio Prepare 76 grams of solvent; add 70 grams of hydrogenated rosin and 30 grams of polyethylene glycol 2000 to the above-mentioned solvent in sequence, heat to 115°C, and stir until a homogeneous mixture is formed; lower the temperature of the mixture to 78°C, and add 5.6 grams of butane Diacid, 4.4 grams of glutaric acid, 3 grams of ammonium succinate, 10 grams of hydrogenated castor oil, 0.6 grams of benzotriazole, and 0.4 grams of 2-mercaptobenzothiazole were added in sequence, and kept stirring at 78 ° C until completely Dissolved; rapid cooling to room temperature at 50°C / min to obtain the desired flux.

[0027] The flux prepared in this embodim...

Embodiment 2

[0029] A kind of soldering flux for electronic package lead-free solder paste, its component and content (wt%) are:

[0030]

[0031] Specific preparation method: Weigh diethylene glycol dibutyl ether and diethyl succinate into a 500 ml beaker container, press diethylene glycol dibutyl ether: diethyl succinate=23:8.4 ratio Prepare 62.8 grams of solvent; sequentially add 80 grams of polymerized rosin, 16 grams of hydrogenated rosin, 16 grams of acrylic resin, and 8 grams of glyceryl stearate to the above-mentioned solvent, heat to 130 ° C, and stir until a uniform mixture is formed; the mixture The temperature dropped to 80°C, 4.4 grams of 2,3-dihydroxyformic acid, 3 grams of adipic acid, 3 grams of maleic anhydride, 1.2 grams of diethanolamine, 4 grams of ethylene bis stearic acid amide, 1.3 grams of benzotri Azole and 0.3 g of 8-hydroxyquinoline were added in sequence, kept at 80°C and kept stirring until completely dissolved; rapidly cooled to room temperature at 35°C / min...

Embodiment 3

[0034] A kind of soldering flux for electronic package lead-free solder paste, its component and content (wt%) are:

[0035]

[0036] Concrete preparation method: Weigh ethylene glycol, triethylene glycol butyl ether and insert in the beaker container of 500 milliliters, press ethylene glycol: triethylene glycol butyl ether=17: 25 ratio preparation solvent 84 grams; Add 30 grams of water-white rosin, 50 grams of polymerized rosin, and 14 grams of glyceryl stearate in sequence to the solvent, heat to 130°C, and stir until a uniform mixture is formed; the temperature of the mixture is lowered to 80°C, and 2 grams of stearic acid , 2 gram of citric acid, 8 gram of succinic acid, 0.4 gram of triethanolamine, 9 gram of hydrogenated castor oil, 0.3 gram of imidazole, 0.3 gram of 8-hydroxyquinoline were added successively, kept stirring at 80 ℃ until completely dissolved; °C / min rapid cooling to room temperature to obtain the required flux

[0037] The flux prepared in this embodim...

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Abstract

The invention discloses a halogen-free cleaning-free rosin flux, and preparation and application thereof, and particularly relates to a flux suitable for surface mount lead-free welding paste, preparation of the flux and application of the flux. The flux comprises 20-50% (mass fraction, the same below) of rosin, 5-25% of film-forming agent, 30-50% of high boiling solvent, 3-8% of activator and 2-5% of thixotropic agent, and the flux does not contain any halogen. In order to control growth of interface IMC (intermediate compound) during welding, 0.3-1% of combined inhibitor is added. The welding paste prepared with the flux and lead-free tin-silver-copper powder has the advantages of excellent printing performance, fine weldability, less post-weld residue, thin and even welding spot interface IMC and excellent mechanical property, and is capable of meeting the requirement of high-end electronic products on packaging.

Description

technical field [0001] The invention belongs to the field of soldering flux for electronic packaging soldering paste, and in particular relates to a rosin-type halogen-free no-cleaning flux with controllable interface IMC and a preparation and application method thereof. Background technique [0002] With the development of electronic products in the direction of miniaturization, thinning and high precision, surface mount technology (SMT) has become one of the most popular technologies and processes in the electronic assembly industry. Solder paste is an indispensable material in SMT, and its performance directly affects the quality of soldering and determines the quality of electronic products. [0003] Flux is an important component of solder paste, which is mainly composed of solvents, activators, film-forming agents, corrosion inhibitors, etc. Different components of flux play specific roles, and the main function of corrosion inhibitors is to prevent flux from Medium a...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 马运柱刘文胜邓涛
Owner CENT SOUTH UNIV
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