Halogen-free cleaning-free rosin flux, and preparation and application thereof
A flux and rosin-type technology, applied in the field of rosin-type halogen-free no-cleaning flux
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Embodiment 1
[0024] A kind of soldering flux for electronic package lead-free solder paste, its component and content (wt%) are:
[0025]
[0026] Concrete preparation method: weigh methyl carbitol, diethylene glycol, and glycerol and place them in a 500-ml beaker container, and press methyl carbitol: diethylene glycol: glycerol=18:16:4 ratio Prepare 76 grams of solvent; add 70 grams of hydrogenated rosin and 30 grams of polyethylene glycol 2000 to the above-mentioned solvent in sequence, heat to 115°C, and stir until a homogeneous mixture is formed; lower the temperature of the mixture to 78°C, and add 5.6 grams of butane Diacid, 4.4 grams of glutaric acid, 3 grams of ammonium succinate, 10 grams of hydrogenated castor oil, 0.6 grams of benzotriazole, and 0.4 grams of 2-mercaptobenzothiazole were added in sequence, and kept stirring at 78 ° C until completely Dissolved; rapid cooling to room temperature at 50°C / min to obtain the desired flux.
[0027] The flux prepared in this embodim...
Embodiment 2
[0029] A kind of soldering flux for electronic package lead-free solder paste, its component and content (wt%) are:
[0030]
[0031] Specific preparation method: Weigh diethylene glycol dibutyl ether and diethyl succinate into a 500 ml beaker container, press diethylene glycol dibutyl ether: diethyl succinate=23:8.4 ratio Prepare 62.8 grams of solvent; sequentially add 80 grams of polymerized rosin, 16 grams of hydrogenated rosin, 16 grams of acrylic resin, and 8 grams of glyceryl stearate to the above-mentioned solvent, heat to 130 ° C, and stir until a uniform mixture is formed; the mixture The temperature dropped to 80°C, 4.4 grams of 2,3-dihydroxyformic acid, 3 grams of adipic acid, 3 grams of maleic anhydride, 1.2 grams of diethanolamine, 4 grams of ethylene bis stearic acid amide, 1.3 grams of benzotri Azole and 0.3 g of 8-hydroxyquinoline were added in sequence, kept at 80°C and kept stirring until completely dissolved; rapidly cooled to room temperature at 35°C / min...
Embodiment 3
[0034] A kind of soldering flux for electronic package lead-free solder paste, its component and content (wt%) are:
[0035]
[0036] Concrete preparation method: Weigh ethylene glycol, triethylene glycol butyl ether and insert in the beaker container of 500 milliliters, press ethylene glycol: triethylene glycol butyl ether=17: 25 ratio preparation solvent 84 grams; Add 30 grams of water-white rosin, 50 grams of polymerized rosin, and 14 grams of glyceryl stearate in sequence to the solvent, heat to 130°C, and stir until a uniform mixture is formed; the temperature of the mixture is lowered to 80°C, and 2 grams of stearic acid , 2 gram of citric acid, 8 gram of succinic acid, 0.4 gram of triethanolamine, 9 gram of hydrogenated castor oil, 0.3 gram of imidazole, 0.3 gram of 8-hydroxyquinoline were added successively, kept stirring at 80 ℃ until completely dissolved; °C / min rapid cooling to room temperature to obtain the required flux
[0037] The flux prepared in this embodim...
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