Stannum-silver-copper three-part alloy leadless solder paste

A lead-free solder paste, ternary alloy technology, applied in welding media, welding equipment, metal processing equipment and other directions, can solve the problems of low reliability of solder joints, damage to PCB components, etc., to reduce peak temperature and reduce damage the possible effect of

Inactive Publication Date: 2008-09-24
CHANGSHA TAIHUI NETWORK TECH
View PDF0 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the low melting point of low-temperature solder paste made of bismuth-tin binary eutectic alloy Bi48Sn42 solder powder, the solder joints formed have low reliability during use, and tin-silver-

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] Embodiment 1: The solder powder in the lead-free solder paste is a solder paste made of bismuth-tin binary eutectic alloy (Bi48Sn42) solder powder, tin-silver-copper ternary alloy solder powder and flux. The mass percentage of bismuth-tin binary eutectic alloy solder powder is 81%, the mass percentage of tin-silver-copper binary alloy solder powder is 18.5%, and the mass percentage of flux is 0.5%. The resulting lead-free solder paste had a peak reflow temperature of 205°C.

Embodiment 2

[0009] Embodiment 2: The solder powder in the lead-free solder paste is a solder paste made of bismuth-tin binary eutectic alloy (Bi48Sn42) solder powder and tin-silver-copper ternary alloy solder powder, plus flux. The tin-copper binary alloy solder powder has a mass percentage of 84.5%, the tin-silver-copper binary alloy solder powder has a mass percentage of 15.4%, and the flux has a mass percentage of 0.1%. The resulting lead-free solder paste had a peak reflow temperature of 209°C.

Embodiment 3

[0010] Embodiment 3: The solder powder in the lead-free solder paste is a solder paste made of bismuth-tin binary eutectic alloy (Bi48Sn42) solder powder, tin-silver-copper ternary alloy solder powder and flux. The tin-copper binary alloy solder powder has a mass percentage of 88.5%, the tin-silver-copper binary alloy solder powder has a mass percentage of 11.2%, and the flux has a mass percentage of 0.3%. The resulting lead-free solder paste had a peak reflow temperature of 212°C.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Melting pointaaaaaaaaaa
Login to view more

Abstract

The invention relates to a tin-silver-copper ternary alloy lead-free soldering paste. Alloy welding powder is made to the soldering paste through bismuth-tin binary eutectic alloy welding powder Bi48Sn42 and Sn-Ag-Cu ternary alloy welding powder with a melting point between 200 to 230 DEG C as well as scaling powder; wherein, the bismuth-tin binary eutectic alloy welding powder takes the 80 to 90 percent of mass percent; the tin-copper binary eutectic alloy welding powder takes 9.6 to 19.5 percent of mass percent; the scaling powder takes 0.1 to 0.5 percent of mass percent. The tin-silver-copper ternary alloy lead-free soldering paste keeps the peak value temperature in reflow soldering process between 210 to 215 DEG C, greatly reducing the peak value temperature and the possibility of damaging a breadboard and an element device.

Description

technical field [0001] The invention relates to a lead-free solder paste, in particular to a lead-free solder paste used in the surface mounting process of electronic products. Especially a kind of tin-copper binary alloy solder powder, tin-silver-copper ternary alloy solder powder, tin-silver-bismuth ternary alloy solder powder, tin-silver binary alloy solder powder in the process of reflow soldering , tin-copper-nickel ternary alloy solder powder or tin-copper-cobalt ternary alloy solder powder compared to solder paste made of lead-free alloys. Background technique [0002] In the prior art, the lead-containing solder paste made of tin-lead alloy powder can make the circuit board And the components are not damaged and the strength of the solder joints at high temperature is guaranteed, so it is widely used. [0003] In order to meet the requirements of environmental protection, it is imperative to use lead-free soldering materials in the process of microelectronics proce...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B23K35/24B23K35/26
Inventor 谭周成莫力黄劲松
Owner CHANGSHA TAIHUI NETWORK TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap