Trimethyl-silyl polysilsesquioxane particle reinforced type tin-silver-copper composite soldering paste and preparation method thereof
A technology of polysilsesquioxane and trimethylsilyl, applied in welding equipment, manufacturing tools, welding media, etc., can solve interface cracking, difficulty in achieving ideal uniform distribution of reinforcement phase, and poor combination of reinforcement phase and matrix structure and other problems, to achieve the effect of improving mechanical properties, inhibiting formation and growth
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example 1
[0014] Firstly, the trimethylsilyl polysilsesquioxane particles with a mass ratio of 1% and the no-clean flux are put into a beaker, and after mixing, shake in an ultrasonic cleaner for 1 hour to uniformly disperse the trimethylsilyl polysilsesquioxane. The semisiloxane particles form a slurry. Then put the tin-silver-copper solder paste into a beaker and stir the dispersed slurry by hand for 30 minutes to ensure that the trimethylsilyl polysilsesquioxane particles are evenly mixed with the solder paste to obtain a composite trimethyl Silanyl polysilsesquioxane particle reinforced tin-silver-copper composite solder paste.
example 2
[0016] First, the 2% mass ratio of trimethylsilyl polysilsesquioxane particles and no-clean flux are put into a beaker, and after mixing, shake in an ultrasonic cleaner for 1 hour to uniformly disperse trimethylsilyl polysilsesquioxane. The semisiloxane particles form a slurry. Then put the tin-silver-copper solder paste into a beaker and stir the dispersed slurry by hand for 30 minutes to ensure that the trimethylsilyl polysilsesquioxane particles are evenly mixed with the solder paste to obtain a composite trimethyl Silanyl polysilsesquioxane particle reinforced tin-silver-copper composite solder paste
example 3
[0018] Firstly, the trimethylsilyl polysilsesquioxane particles with a mass ratio of 3% and the no-clean flux are put into a beaker, and after mixing, shake in an ultrasonic cleaner for 1 hour to uniformly disperse the trimethylsilyl polysilsesquioxane. The semisiloxane particles form a slurry. Then put the tin-silver-copper solder paste into a beaker and stir the dispersed slurry by hand for 30 minutes to ensure that the trimethylsilyl polysilsesquioxane particles are evenly mixed with the solder paste to obtain a composite trimethyl Silanyl polysilsesquioxane particle reinforced tin-silver-copper composite solder paste.
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