Lead-free tin solder paste and preparation method thereof

A lead-free solder paste and tin powder technology, used in welding equipment, welding media, manufacturing tools, etc., can solve the problems of poor soldering, unsatisfactory performance, halogen content, etc., and achieve long printing time and adhesion. And the effect of good stability and good printing performance

Inactive Publication Date: 2015-11-04
JIANGSU BOQIAN NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, among various lead-free solder pastes, Sn/Ag/Cu alloy is the most widely accepted solder component in the industry, but its performance in va

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Add 52g of tripropylene glycol butyl ether, 40g of hydrogenated rosin, 40g of polymerized rosin, 8g of GE-511 and 4g of trimethylbutenediol into the reaction vessel, heat to 120°C, stir until completely dissolved; lower the temperature to 100°C, Add 18g of myristic acid, 2g of succinic acid, 4g of adipic acid, 8g of glutaric acid, 3g of suberic acid, 2g of antioxidant BHT and 10g of methylimidazole, stir until completely dissolved; cool to 60℃, add ethylene 9g of base bisstearic acid amide, stir to completely dissolve, cool to room temperature, use a three-roll mill to grind the fineness of the solid particles in the mixed homogeneous solution to below 10 μm to obtain 193g of flux.

[0027] Mix 442.5g of lead-free solder powder and 57.5g of flux, stir at a stirring speed of 15 revolutions per minute for 5 minutes, extract vacuum, and continue stirring for 15 minutes to obtain 500 g of lead-free solder paste.

Embodiment 2

[0029] Add 58g of diethylene glycol dibutyl ether, 36g of hydrogenated rosin, 40g of polymerized rosin and 10g of rosin ether surfactant into the reaction vessel, heat to 116°C, stir until completely dissolved; cool to 80°C, add dipropylene Acid 14g, succinic acid 4g, adipic acid 5g, glutaric acid 7g, suberic acid 2g, methylbenzotriazole 2g and methylimidazole 12g, stir until completely dissolved; reduce the temperature to 65℃, add thixotropic Mix 7500 10g of flux 7500 to completely dissolve, cool to room temperature, use a three-roll mill to grind the fineness of the solid particles in the uniform solution to below 10μm to obtain 195g of flux.

[0030] Mix 442.0g of lead-free solder powder and 58.0g of flux, stir for 5 minutes at a stirring speed of 15 revolutions / minute, draw a vacuum, and continue stirring for 15 minutes to obtain 500 g of lead-free solder paste.

Embodiment 3

[0032] Add 48g of diethylene glycol monohexyl ether, 41g of hydrogenated rosin, 41g of polymerized rosin, 8g of GE-511 and 5g of trimethylbutenediol into the reaction vessel, heat to 110°C, stir until completely dissolved; cool to At 90℃, add 18g myristic acid, 2g succinic acid, 4g adipic acid, 8g glutaric acid, 4g suberic acid, 2g antioxidant BHT and 10g methylimidazole, stir until completely dissolved; cool down to 60℃, Add 9 g of ethylenebisstearic acid amide, stir until completely dissolved, cool to room temperature, and grind the fineness of the solid particles in the mixed uniform solution to below 10 μm with a three-roll mill to obtain 192 g of flux.

[0033] Mix 443.5g of lead-free solder powder and 56.5g of flux, stir at a stirring speed of 15 rpm for 5 minutes, draw a vacuum, and continue stirring for 15 minutes to obtain 500 g of lead-free solder paste.

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PUM

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Abstract

The invention discloses a lead-free tin solder paste and a preparation method thereof. The lead-free tin solder paste comprises the raw materials by mass percent: 80-90% of tin-silver-copper alloy tinpowder and 10-20% of lead-free flux, wherein the tin-silver-copper alloy tin powder comprises the componentsby mass percent: 0.3-3.0% of silver, 0.5-0.7% of copper and 96.5-99.0% of tin, and the lead-free flux comprises the componentsby mass percent: 20-35% of solvent, 30-45% of rosin, 5-10% of surface active agent, 10-20% of organic acid, 3-10% of antioxidant and 2-8% of thixotropic agent. The rosin which is a mixture of hydrogenated rosin and polymerized rosin according to a weight ratio of 1:(1-3) is adopted, so that the prepared lead-free tin solder paste is good in adhesive force and stability; by adjusting a ratio of the solvent to the rosin, the prepared lead-free tin solder paste has a wider viscosity range and good printing performance; with the compounding of various organic acid, the prepared lead-free tin solder paste is halogen-free, and the activity of the lead-free tin solder paste is improved greatly; the surface active agent is compounded with the solvent with high boiling point, low viscosity and low volatility, so that the prepared lead-free tin solder paste is long in printing time, and excellent in insulating property.

Description

technical field [0001] The invention relates to the technical field of solder paste, in particular to a lead-free solder paste and a preparation method thereof. Background technique [0002] Solder paste is a paste mixture formed by mixing solder powder, flux, surfactant, thixotropic agent, etc. It is an extremely important auxiliary material in the production of electronic products today. With the rapid development of the electronic information industry, electronic products are becoming more and more light, thin, short, small and high-performance. While electronic assembly technology is developing towards high precision, high density and high reliability, international environmental protection Awareness has also increased, and higher requirements have been put forward for solder paste that plays a key role in electronic assembly. Lead-free, halogen-free, low-temperature energy-saving, precision molding, and high reliability have become the development direction of current ...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/40
Inventor 尹计深戴爱斌黄栋臣
Owner JIANGSU BOQIAN NEW MATERIALS
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