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Nanostructure-enhanced tin-silver-copper-base leadless compound solder and preparation thereof

A technology of nanostructure and composite brazing material, which is applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of low creep fracture life, poor spreading process performance, high melting point, etc., and achieve long creep fracture life , Improved reliability and creep rupture life, and high shear strength

Inactive Publication Date: 2008-10-08
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are also shortcomings such as high melting point (near 217°C), poor spreading process performance, low creep rupture life, and high cost, which limit its industrial application.

Method used

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  • Nanostructure-enhanced tin-silver-copper-base leadless compound solder and preparation thereof
  • Nanostructure-enhanced tin-silver-copper-base leadless compound solder and preparation thereof
  • Nanostructure-enhanced tin-silver-copper-base leadless compound solder and preparation thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Take 0.05g of POSS1 with a size of 10-100nm and 4.95g of Sn-3.0Ag-0.5Cu solder paste, mechanically stir for 30min to make a composite solder, store it at low temperature for future use, wherein the weight ratio of POSS1 in the composite solder 1%.

Embodiment 2

[0022] Weigh 0.1g of POSS1 with a size of 10-100nm and 4.9g of Sn-3.0Ag-0.5Cu solder paste, mechanically stir for 30min to make a composite solder, store it at low temperature for future use, wherein, the weight of POSS1 in the composite solder The ratio is 2%.

Embodiment 3

[0024] Weigh 0.15g of POSS1 with a size of 10-100nm and 4.85g of Sn-3.0Ag-0.5Cu solder paste, mechanically stir for 30min to make a composite solder, store it at low temperature for future use, wherein the weight ratio of POSS1 in the composite solder 3%.

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Abstract

The invention relates to a tin, silver and copper based lead-free composite solder with enhanced nanometer-structure and a preparation method thereof, which belong to the technical field of the manufacturing of metal-based lead-free composite solders. The existing spreading process for SnSn-Ag-Cu series lead-free solder is characterized by poor processing performance, short creep rupture service life and high cost. The composite solder of the invention consists of 97 wt percent to 99 wt percent of commercial Sn-3.0Ag-0.5Cu solder paste and 1 wt % to 3 wt % of enhanced particles (POSS1, POSS2 or POSS3). The solder paste consists of 85 wt percent of Sn-3.0Ag-0.5Cu solder and 15 wt % of flux. The tin, silver and copper based lead-free composite solder with enhanced nanometer-structure is prepared by stirring and mixing the solder paste and enhanced particles according to the component concentration for 15 to 30 minutes. The composite solder of the invention has the advantages of good wettability and good creep rupture resistance, high shearing strength, excellent mechanical property, long creep rupture service life of the soldered joint and simple preparation process, etc.

Description

technical field [0001] The invention belongs to the technical field of manufacturing metal-based lead-free composite solder, and in particular relates to a nanostructure-reinforced tin-silver-copper-based lead-free composite solder and a preparation method thereof. Background technique [0002] The miniaturization of components and the development of surface assembly technology have put forward higher requirements for the microstructure stability, mechanical properties, especially creep resistance of brazed joints used in the electronic information industry. Especially at present, the original traditional Sn-Pb solder is toxic due to the lead element. All countries in the world are working hard to study lead-free solder. In order to improve the service ability of lead-free solder, many researches focus on Add nano-scale or micron-scale reinforcing particles to the material to make composite solder. [0003] The important basic data of lead-free solder should include: wettab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22
Inventor 郭福邰枫刘彬夏志东雷永平史耀武
Owner BEIJING UNIV OF TECH
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