Nanostructure-enhanced tin-silver-copper-base leadless compound solder and preparation thereof

Abstract

The invention relates to a tin, silver and copper based lead-free composite solder with enhanced nanometer-structure and a preparation method thereof, which belong to the technical field of the manufacturing of metal-based lead-free composite solders. The existing spreading process for SnSn-Ag-Cu series lead-free solder is characterized by poor processing performance, short creep rupture service life and high cost. The composite solder of the invention consists of 97 wt percent to 99 wt percent of commercial Sn-3.0Ag-0.5Cu solder paste and 1 wt % to 3 wt % of enhanced particles (POSS1, POSS2 or POSS3). The solder paste consists of 85 wt percent of Sn-3.0Ag-0.5Cu solder and 15 wt % of flux. The tin, silver and copper based lead-free composite solder with enhanced nanometer-structure is prepared by stirring and mixing the solder paste and enhanced particles according to the component concentration for 15 to 30 minutes. The composite solder of the invention has the advantages of good wettability and good creep rupture resistance, high shearing strength, excellent mechanical property, long creep rupture service life of the soldered joint and simple preparation process, etc.

Description

technical field [0001] The invention belongs to the technical field of manufacturing metal-based lead-free composite solder, and in particular relates to a nanostructure-reinforced tin-silver-copper-based lead-free composite solder and a preparation method thereof. Background technique [0002] The miniaturization of components and the development of surface assembly technology have put forward higher requirements for the microstructure stability, mechanical properties, especially creep resistance of brazed joints used in the electronic information industry. Especially at present, the original traditional Sn-Pb solder is toxic due to the lead element. All countries in the world are working hard to study lead-free solder. In order to improve the service ability of lead-free solder, many researches focus on Add nano-scale or micron-scale reinforcing particles to the material to make composite solder. [0003] The important basic data of lead-free solder should include: wettab...

AI Technical Summary

Problems solved by technology

However, there are also shortcomings such as high melting point (near 217°C), poor spreading process performance, low creep rupture life, and high cost, which limit its industrial application.

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