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118results about How to "Lower wetting angle" patented technology

Preparation method of disc type full silicon carbide filtering membrane

PendingCN107619296AStrong hydrophilic and oil repellentStrong chemical stabilityCeramicwareWork in processCross-flow filtration
The invention relates to a preparation method of a dynamic cross flow filtration disc type full silicon carbide filtering membrane, and belongs to the technical field of preparation of advanced ceramics. The preparation method comprises the following steps: weighing a coarse silicon carbide powder I, a fine silicon carbide powder II, a plasticizer and a pore forming material, stirring and dissolving the plasticizer into warm water, sequentially adding the coarse silicon carbide powder I, the fine silicon carbide powder II and the pore forming material, and mixing evenly; conducting compressionmoulding after drying and screening to obtain a biscuit; using the fine silicon carbide powder II and a binder to prepare a concentrated slurry, spraying the concentrated slurry on the outer edge ofthe biscuit, and adhering two biscuits together; sintering to obtain a support body for the disc type full silicon carbide filtering membrane; weighing a fine silicon carbide powder III, a dispersingagent and the binder, adding deionized water, and grinding to obtain a membrane coating solution; spraying the membrane coating solution on the outer surface of the support body, and drying to obtaina semi-finished product of the filtering membrane; and sintering the semi-finished product of the filtering membrane to obtain a finished product of the disc type full silicon carbide filtering membrane. The prepared silicon carbide ceramic membrane has the characteristics of high filtering precision and large separating flux.
Owner:SHANDONG UNIV OF TECH

Energy filtrated magnetron sputtering plating method and apparatus for applying the method

The invention discloses an energy filtration magnetron sputtering coating method and a device for implementing the method. The method is as follows: a conductive filter screen which is connected with an anode is arranged between the surface of a substrate to be coated and sputtering target materials; ions generated by bombarded cathodic sputtering target materials during the sputtering coating process are filtered by the conductive filter screen and then sent to the coating growth surface of the substrate to be coated on the anode; when the ions generated by the sputtering target materials pass through the conductive filter screen, the conductive filter screen with high anode potential absorbs high-energy electrons in the ions and repels high-energy positive ions in the ions. The device can arrange the conductive filter screen with the high anode potential on an outer cover of the substrate on the basis of the prior device so as to inhibit the damage of high-energy particle bombardment on the substrate during the process of preparing a film by the magnetron sputtering technology, and surface grains of the prepared film are made to be more fine and more uniform and have higher flatness. Moreover, the device can be formed by modifying the prior device, is not large in modification and is easy to realize.
Owner:ZHENGZHOU UNIV

Method for manufacturing SnAgCu lead-free solder

The invention discloses a method for manufacturing SnAgCu lead-free solder, which comprises the following steps of: mixing raw materials according to proportions, heating to 500 DEG C under the protection of a covering agent and nitrogen gas or under the vacuum condition, smelting for 0.5-1h to obtain alloy melt; heating the alloy melt to a temperature not lower than a temperature range that the alloy melt generates liquid-state structure transformation, and preserving heat for 15-30min; cooling to 500 DEG C, preserving heat for 0.5h, and then casting and solidifying to obtain a lead-free solder alloy ingot; and finally machining the alloy ingot into lead-free solder by adopting a transmission machining way. According to the lead-free solder prepared by adopting the method disclosed by the invention, solidification tissues are remarkably thinned and evenly distributed; in the welding process, a reaction layer at the joint part is remarkably thinned and the roughness is reduced; the solder is easy to melt, and the expandability of the solder and the wettability of the solder with a copper substrate are remarkably improved; besides, the thermal stability of welding joint tissues is remarkably improved, and therefore the operation reliability of related products in the service process is improved.
Owner:HEFEI UNIV OF TECH

Lead welding technique for packaging semiconductor power device

The invention discloses a lead welding technique for packaging a semiconductor power device and belongs to the technical field of semiconductor power device packaging and manufacturing. According to the technique, lead connection is achieved through a brazing technique, and the brazing process is achieved through lasers, wherein lead connection refers to the completion of the welding process of a lead and a chip and the welding process of the lead and two welding points of a frame. In the welding process, the lead, the frame and a chip welding pad are preheated through direct laser spot radiation, the diameter of laser spots is 1 mm, and laser radiation time is 10 ms; and a brazing wire is heated through direct laser spot radiation, the diameter of the laser spots is 1 mm, and laser radiation time is 10 ms. By the adoption of the technique, the wet aluminum pad and the frame can be melted directly to achieve stable and reliable connection of the lead, the chip and the frame, the aluminum pad and the frame cannot be melted due to the fact that the temperature does not reach the melting point, and the aluminum pad and the frame are just preheated, so that the surfaces are stretched fully to assist in combination of the aluminum pad and liquid brazing filler metal and combination of the frame and the liquid brazing filler metal, and therefore mechanical damage, thermal damage and the stress problem existing in a traditional routing technique are avoided.
Owner:王伟

Method for preparing copper-tungsten contact through electron beam infiltration

The invention discloses a method for preparing a copper-tungsten contact through electron beam infiltration. The method comprises the following steps in sequence: s1, preparing a contact material; s2, setting heat source parameters according to an electron beam fuse apparatus; s3, preheating a tungsten blank by continuous defocusing of an electron beam in a graphite boat; s4, adjusting an orientation relation between the electron beam and copper wires, and generating energy to convert molten metal copper wires by interaction between the high-speed-motion electron beam and copper wires; s5, moving a working platform at a constant speed; and s6, returning to the step s4 until the infiltration process is finished. The method has the advantages as follows: the electron beam infiltration method is particularly suitable for small-batch copper-tungsten alloy preparation of different mass fraction proportions, and only the copper wire lengths which can satisfy the mass fraction proportions need to be calculated in the manufacturing process; and meanwhile, the vacuum environment equipped in the electron beam apparatus is suitable for preparation of the copper alloy, so that oxidization can be avoided to the maximum degree and the infiltration effect can be improved.
Owner:XIAN ZHIRONG METAL PRINTING SYST CO LTD

Metal corrosion inhibitor and preparation method thereof

The invention discloses a metal corrosion inhibitor and a preparation method thereof. The preparation method comprises the process steps of a natural gas storage CO2 liquid-phase corrosion inhibitor and a natural gas storage CO2 gas-phase corrosion inhibitor. The preparation method of the CO2 liquid-phase corrosion inhibitor for the natural gas storage comprises the following steps: S1, carrying out amidation and cyclization reaction on cis-octadecenoic acid-9-enoic acid and triethylenetetramine serving as main components, and dehydrating twice to form a five-membered heterocyclic imidazolineintermediate; s2, the imidazoline intermediate and benzyl chloride are subjected to quaternization, and oil solubility is converted into water-soluble imidazoline quaternary ammonium salt; and S3, reacting the imidazoline quaternary ammonium salt with ethyl sulfur nitrogen, and introducing an ethyl sulfur nitrogen polar group, so that the imidazoline quaternary ammonium salt has more active adsorption sites to obtain the natural gas storage CO2 liquid-phase corrosion inhibitor 2-ethylthio-amino-ethyl-benzyl-1-heptadecenyl-imidazoline quaternary ammonium salt. The corrosion inhibitor has gas-phase corrosion inhibition and liquid-phase corrosion inhibition functions at the same time, and the use concentration of the corrosion inhibitor can be reduced to a low degree on the premise that the function of the corrosion inhibitor is not affected.
Owner:盘锦天诚源科技有限公司

Rare-earth multi-element alloy coating and hot-dip galvanizing method thereof

The invention discloses a rare-earth multi-element alloy coating and a hot-dip galvanizing method thereof. The rare-earth multi-element alloy coating comprises the following main components: rare earth, aluminum, nickel, magnesium and zinc. The hot-dip galvanizing method comprises the following steps: (1) mix-melting intermediate alloys, namely Al-RE-Mg and Zn-Ni; (2) mix-melting a multi-element rare-earth alloy; (3) dredging slag; (4) casting; and (5) applying. The rare-earth multi-element alloy coating and the hot-dip galvanizing method thereof have the advantages that: firstly, difficulty of directly adding multiple elements with different melting points into a zinc liquid to melt and the impossibility problem of adding high-melting-point elemental metal elements into the zinc liquid to melt are solved; secondly, the multiple elements can be completely and quickly molten and dispersed, so that the hot-dop galvanizing method is easy to operate and control in a practical production process; thirdly, the dilution capability, the dispersive capacity, the mobility and the uniformity of the zinc liquid are strengthened, so that the zinc consumption is reduced by 5%-15%, the cost is reduced and the benefits are increased; and fourthly, the corrosion resistance of the rare-earth multi-element alloy coating is doubled in comparison with that of a conventional hot dip galvanized coating.
Owner:江苏中远稀土新材料有限公司
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