Energy filtrated magnetron sputtering plating method and apparatus for applying the method

Abstract

The invention discloses an energy filtration magnetron sputtering coating method and a device for implementing the method. The method is as follows: a conductive filter screen which is connected with an anode is arranged between the surface of a substrate to be coated and sputtering target materials; ions generated by bombarded cathodic sputtering target materials during the sputtering coating process are filtered by the conductive filter screen and then sent to the coating growth surface of the substrate to be coated on the anode; when the ions generated by the sputtering target materials pass through the conductive filter screen, the conductive filter screen with high anode potential absorbs high-energy electrons in the ions and repels high-energy positive ions in the ions. The device can arrange the conductive filter screen with the high anode potential on an outer cover of the substrate on the basis of the prior device so as to inhibit the damage of high-energy particle bombardment on the substrate during the process of preparing a film by the magnetron sputtering technology, and surface grains of the prepared film are made to be more fine and more uniform and have higher flatness. Moreover, the device can be formed by modifying the prior device, is not large in modification and is easy to realize.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering coating, in particular to an energy filtering magnetron sputtering coating method and an energy filtering magnetron sputtering coating device implementing the method. Background technique [0002] Magnetron sputtering coating is an important thin film preparation technology, which is widely used in scientific research and industrial production. For example, various metal, semiconductor and oxide films can be prepared by magnetron sputtering coating method, and ITO transparent conductive glass can be produced industrially. Magnetron sputtering coating is a technology that uses energetic ions to bombard the surface of the target in a vacuum, so that the bombarded target particles are deposited on the surface of the substrate to prepare a thin film. This technology has many advantages, such as easy preparation of thin films of high melting point substances; uniform film formation over a...

AI Technical Summary

Problems solved by technology

However, this technology also has its limitations. First of all, the bombardment of high-energy particles will cause damage to the substrate that is not resistant to bombardment or the existing film layer that is not resistant to bombardment on the substrate in the process of preparing thin films with this technology, causing material changes. Second, the surface morphology of the film prepared by this technology is often rough, which cannot meet the needs of some applications

These disadvantages limit the scope of use of the technology

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