No-clean flux high in welding passing rate

Abstract

The invention discloses no-clean flux high in welding passing rate, and belongs to the technical field of flux. The no-clean flux is specifically prepared from a solvent, an active agent, a film-forming agent, a surface active agent, a stabilizer and a corrosion inhibitor. The flux is high in welding aid capacity; the bad phenomena of hard skin films, caking, viscosity changing and the like are avoided; the viscosity is stable; corrosiveness is avoided; no residual solid exists on the surface of a welded object; cleaning is not needed; the phenomena of joint welding and short circuits are avoided after welding; the welding passing rate of a precision device can be guaranteed; and the no-clean flux is suitable for single-face circuit boards or copper plated and nickel plated circuit boards hard to weld.

Description

technical field [0001] The invention belongs to the technical field of soldering flux, in particular to a no-cleaning soldering flux with high soldering pass rate. Background technique [0002] With the development of electronic science and technology, surface mount technology plays an increasingly important role in electronic assembly, and solder paste is a kind of solder that emerged with surface mount technology, and it is also an extremely important component in surface mount technology. auxiliary materials. Solder paste is a mixture of flux and tin powder. When used, the solder paste is first applied and printed on the circuit board (PCB), and then the electronic components are inserted onto the substrate. During the process, the substrate passes through the reflow oven. A method of heating and dissolving in a reflow oven to solder component pins. Among them, the flux in the solder paste can remove the oxides on the surface of the solder and the product to be soldered...

AI Technical Summary

Problems solved by technology

[0003] Existing fluxes usually have poor film-forming performance and covering performance, and it is easy to absorb moisture when the humidity is high, resulting in a short circuit, reducing the electrical performance of electronic components, causing certain safety hazards, and after welding High solid residues, residues need to be cleaned, which increases production costs

In addition, with the continuous optimization and shrinking of electronic devices, the pin spacing of components has been continuously reduced, from about 0.6mm to less than 0.3mm, which will increase the difficulty of soldering and lead to a low soldering pass rate