34results about How to "Excellent soldering performance" patented technology

The invention relates to a chemical soldering flux in the electronic industry, in particular to a solder paste used for arranging electronic elements and the alloy welding powder is lead-free alloy. The technical scheme of the invention is as follows: the lead-free and halogen-free solder paste for electronic industry comprises 85-94wt% of alloy welding powder and 6-15wt% of flux, wherein the flux comprises 20-60wt% of resin, 10-60wt% of solvent, 1-10wt% of rheology control agent, 0.1-40wt% of activator and the balance stabilizer; and the alloy welding powder is lead-free welding powder and is characterized in that the activator contains one or more of shikimic acid with the constitutional formula shown in formula I, shikimate with the constitutional formula shown in formula II and amide of shikimic acid with the constitutional formula shown in formula III. The beneficial effect of the invention is as follows: shikimic acid or a derivative thereof is used as the activator so as to increase the wettability of the halogen-free product so as to reduce bad effects caused by the solderability in production.

The invention discloses non-cleaning flux for low temperature paste, and a preparing method of the flux and belongs to the technical field of welding flux. The flux comprises, by mass percent, 79 to 82% of a compound solvent, 7 to 14% of an active agent, 2 to 5% of a thixotropic agent, 0.1 to 0.5% of a corrosion inhibitor, 1 to 8% of a pH conditioning agent, 0.5% of an antioxidant and 0.25% of a film-forming agent. The compound solvent is composed of a high-boiling-point organic solvent with the boiling point exceeding 200 DEG C and a low-boiling-point organic solvent with the boiling point lower than 200 DEG C, the high-boiling-point organic solvent is a mixture of ethylene glycol and ethylene glycol butyl ether, the low-boiling-point organic solvent is a mixture of one or two of ethyl alcohol and isopropyl alcohol, the active agent is lactic acid, the thixotropic agent is castor oil, the corrosion inhibitor is benzotriazole, the pH conditioning agent is organic amine, the antioxidant is toluic acid butyrate, and the film-forming agent is polyethylene glycol 2000. The method is simple in technology, operation is easy, the flux can be used in cooperation with flux powder with the melting point lower than 100 DEG C, activity is high, wettability is good, post-welding residue is little, corrosion resistance is high, and no tin sweat phenomenon happens.

The invention relates to the technical field of soldering flux, in particular to lead-free no-clean soldering flux and a preparation method thereof. The soldering flux has the advantages of no halogen, strong soldering ability and no corrosion; and solids are not remained on the surface of a soldered object without cleaning, and the phenomena of no joint soldering and no short circuit can be avoided after soldering; and therefore, the lead-free no-clean soldering flux is particularly suitable for single-side circuit boards which are difficult to solder or copper-plating and nickel-plating circuit boards.

The invention relates to a chemical soldering flux in the electronic industry, in particular to a soldering flux for arranging electronic elements. The technical scheme of the invention is as follows: the soldering flux for electronic industry comprises solvent, resin, activator and surfactant and is characterized in that the activator contains one or more of shikimic acid with the constitutionalformula shown in formula I, shikimate with the constitutional formula shown in formula II and amide of shikimic acid with the constitutional formula shown in formula III. The soldering flux can increase the wettability of the halogen-free product so as to reduce bad effects caused by the solderability of the traditional halogen-free soldering flux in production.

The invention discloses a steel no-clean welding flux. The steel no-clean welding flux is characterized by comprising the following components in weight percent: 10-35% of organic silicon modified acrylic resin, 15-80% of mixed alcohol solvent, 5-30% of active mixed component and 1-20% of benzenediol. The invention further discloses a preparation method for the steel no-clean welding flux. The steel no-clean welding flux is an environment-friendly novel welding flux which is no-clean, good in weld assistant property, large in expansion rate, non-corrosive and residue-free.

The invention discloses a preparation method for an electronic substrate welding assistant and belongs to the technical field of welding assistants. Aiming at the defects that a large number of halide ions are contained in residues of current electronic substrate welding flux, the electric insulation performance is lowered, and pollution is liable to occur, the preparation method adopts succinic acid and oxalic acid triethanolamine are adopted as core materials, acrylic resin serves as a shell material, and microencapsulation compound active substances are obtained; then rosin of masson pine rosin serves as raw materials to prepare maleopimaric acid polyethylene glycol ester; and finally, the maleopimaric acid polyethylene glycol ester is mixed with the microencapsulation compound active substances, benzotriazole and the like to prepare the electronic substrate welding assistant. According to the preparation method, the microencapsulation compound active substances are prepared, thus the surface activity of the welding assistant is increased, the compatibility between the welding assistant and a welding assistant is enhanced, maleic anhydride and other volatile assistants overcome the defects that the electric insulation performance is lowered due to the fact that too many halide ions are left in residues of traditional welding flux, so that the environment pollution degree is lowered, and wide economic prospects are achieved.

A through hole is formed in a printed board. Conductor patterns are formed on an upper face and a lower face of the printed board in such a manner that the conductor patterns are electrically connected to each other, by means of a through hole solder. A lead terminal of an electronic component is inserted into the through hole and soldered with a lead free solder. According to this invention, an area of an opening of the through hole is set to be four times or more as large as a cross sectional area of the lead terminal. In this manner, heat conduction on occasion of soldering can be enhanced, and the soldering can be favorably performed, even when the lead free solder having a high melting point is used.

The invention discloses a soldering flux composition containing cyclohexane citrate, and also discloses a method for preparing the cyclohexane citrate and an application of the cyclohexane citrate as an additive of the soldering flux. The cyclohexane citrate has the purity of above 99 percent and is prepared by the method comprising the following steps of: 1, taking citric acid, adding pure water, heating and dissolving completely, and then filtering and clarifying; 2, slowly adding the filtered citric acid solution in the corresponding quantity of cyclohexane under the condition of stirring, reacting at a temperature of 60-90 DEG C, and finally adding the cyclohexane or citric acid to regulate pH to be 7.5-9; 3, heating and concentrating until a crystal coating occurs, pouring a heat solution in a tray while heating for cooling to be in a block shape; and 4, cutting the blocky cyclohexane citrate in the tray into small blocks, and drying at a temperature of 80-95 DEG C to obtain the soldering flux composition. The soldering flux composition containing the cyclohexane citrate has low cost, less environment pollution and enhanced soldering capacity.

The invention relates to a flux, in particular to a soldering flux and a preparation method thereof. In the soldering production process of electronic products, a flux containing halide is generally used; and after soldering, more residues are generated, and the residues contain halide ions to gradually cause such problems as reduction of electric insulation performance and short circuit. In order to realize the purpose of the invention, the invention provides the soldering flux; and the soldering flux comprises the following components in percentage by weight: 25-35% of rosin, 55-70% of ethanol, 2-6% of triethanolamine, and 1-3% of aniline. In addition, the invention further provides the preparation method of the soldering flux; and the flux prepared according to the formula and the method contains no halide ions, cannot gradually cause such problems as reduction of electric insulation performance and short circuit, has no need to clean the flux residues on an electronic printed board, is simple in components and preparation process, and is excellent in fluxing effect.

The invention discloses resin type scaling powder which comprises the following ingredients: 5-30 parts of rosin, 4-20 parts of rosin derivative, 40-60 parts of organic solvent, 0.2-2 parts of organic acid, 0.1-5 parts of palmitate and 0.01-0.5 part of benzotriazole. The scaling powder has an excellent solder-aiding effect, is capable of improving the electrical insulating property and expandability of an electric welding product without washing and drying and is convenient in use; and the scaling powder is applicable to automatic wave-soldering, dip soldering and manual soldering of a printed circuit board, and also can be used for carrying out anti-oxidation pre-coating on the leads of whole electronic components of the printed circuit board.

The invention discloses a halogen-free low-carbon environment-friendly flux. The flux comprises the following components in percentage by mass: 50% to 80% of polyethylene glycol, 1% to 3.5% of oxidized polyethlene wax, 2.5% to 4.5% of fatty acid ester surface active agent, 1.3% to 3.5% of high-quality abieten, 0.8% to 2.6% of active reinforcing agent, 1.5% to 4.3% of stabilizing agent, and the balance of high-boiling point deionized water as a solvent. By adopting the method, the halogen-free low-carbon environment-friendly flux has the advantages that the halogen is not contained, the insulation resistance is high, and the welding assisting performance is good; compared with the traditional alcohol-based flux, the flux uses water as the solvent, the carbon content is lower, and the emission of carbon dioxide is reduced.

The invention discloses an ultrasonic welding device and an ultrasonic welding method, the ultrasonic welding device comprises a welding head and a welding seat, two symmetrical sides of the welding head are provided with welding parts, the welding parts are connected through a connecting part, the welding parts are internally provided with a plurality of welding teeth arranged at intervals, and the welding teeth are neatly arranged to form a straight strip with a notch. According to the invention, the damage of the welding teeth at the edge of the welding part to the tab foil is reduced, the problem of tab foil breakage is avoided, and the product percent of pass is improved.

The invention discloses an adjustable reducing pipe butt joint positioning device and a using method thereof, and belongs to the field of boiler manufacturing. The problems that the machining precision is low and the production efficiency is low when a steel pipe is welded at present are solved. The device comprises an adjusting bent plate, short fixing angle steel, long fixing angle steel, a first pressing mechanism, a second pressing mechanism, a first supporting arm and a second supporting arm; one end of the adjusting bent plate is connected with the long fixing angle steel, the other endof the adjusting bent plate is connected with the short fixing angle steel, the first pressing mechanism is inserted into a first threaded hole of the first supporting arm, a first mounting arm is fixedly mounted at one end of the adjusting bent plate, the second pressing mechanism is inserted into a second threaded hole of the second supporting arm, and the second supporting arm is fixedly mounted at the other end of the adjusting bent plate. The reducing pipe butt joint positioning device is simple in structure and convenient to disassemble and assemble, the using method is concise in step,a large amount of manpower is saved, and the machining efficiency and the machining precision are improved.

The invention discloses an automatic rotary welding device for a bent pipe fitting. The automatic rotary welding device comprises a supporting mechanism, pull rod assemblies and a rotary positioning mechanism, wherein the pull rod assemblies are arranged on the supporting mechanism, and the rotary positioning mechanism is arranged between the pull rod assemblies and the supporting mechanism. The rotary positioning mechanism comprises a support, a rotary assembly, a driving assembly and a pipe fitting centering assembly, wherein the support is arranged on the supporting mechanism, the rotary assembly is rotationally connected with the support, the driving assembly is arranged on the supporting mechanism and used for driving the rotary assembly to rotate, the pipe fitting centering assemblyis arranged on the rotary assembly, and the positioning center of the pipe fitting centering assembly and the center of the rotary assembly are located on the same central axis. The device is reliableto use and convenient to operate, the specific rotary positioning mechanism is designed according to the characteristics of complex space bending of an aero-engine, the pipeline can automatically rotate when the complex space bending of the aero-engine and pipelines with different diameters are welded, manual argon arc welding is located at a flat welding position, the number of times of arc starting and stopping is one, and the welding effect is effectively improved.