Lead-free no-clean soldering flux and preparation method thereof

A flux and no-cleaning technology, applied in the direction of welding equipment, welding medium, manufacturing tools, etc., can solve the problems of electronic components such as electrical performance degradation, poor film forming performance and coverage performance, easy to absorb moisture, etc., to achieve good soldering Performance and electrical insulation performance, improved solderability, and strong soldering ability

Active Publication Date: 2012-09-26
广东剑鑫科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the flux is usually a mixture of common rosin, resin, halide-containing activator, additive and organic solvent. The common rosin used in this kind of flux has poor film-forming and covering properties, resulting in certain For example, when the humidity is high, it is easy to absorb moisture, which will lead to short circuit and reduce the electrical performance of electronic components;

Method used

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  • Lead-free no-clean soldering flux and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] The lead-free no-clean flux of the present invention is made up of the raw material of following percentage by weight:

[0076] Hydrogenated rosin methyl ester 0.8~3.5%

[0077] Hydrogenated rosin 0.3~2%

[0078] Adipic acid 0.2~2%

[0079] Glutaric acid 0.2~2%

[0080] Succinic acid 0.5~2.5%

[0081] Dimalonic acid 0.1~2%

[0082] Surfactant 0.1~1.5%

[0083] Lubricant 0.1~1.5%

[0084] Triethylene glycol butyl ether 2~5%

[0085] Anhydrous ethanol 80~95%

[0086] in:

[0087] The purity of absolute ethanol is 99.5%.

[0088] Specifically, the surfactant is a nonionic or cationic fluorocarbon surfactant.

[0089] In this embodiment, the surfactant selected is FT900.

[0090]FT900 surfactant is produced by German OATEN company. The boiling point of this surfactant is 260°C. It is a colorless liquid and has no residue after welding. It can effectively increase the brightness of solder joints and make the surface of the soldered object more transparent and clea...

Embodiment 2

[0097] The lead-free no-clean flux of the present embodiment is made up of the raw material of following percentage by weight:

[0098] Hydrogenated rosin methyl ester 1~3%

[0099] Hydrogenated rosin 0.5~1.5%

[0100] Adipic acid 0.2~0.8%

[0101] Glutaric acid 0.2~0.8%

[0102] Succinic acid 1~2%

[0103] Dimalonic acid 0.2~0.5%

[0104] FT900 Surfactant 0.2~1%

[0105] Nonylphenol polyoxyethylene ether 0.2~1%

[0106] Triethylene glycol butyl ether 2~4%

[0107] Anhydrous ethanol 90~95%;

[0108] Wherein: the purity of absolute ethanol is 99.5%.

[0109] The preparation method is the same as in Example 1.

Embodiment 3

[0111] The lead-free no-clean flux of this embodiment, on the basis of embodiment 2, the features not explained in this embodiment, adopt the explanation in embodiment 2, the difference between this embodiment and embodiment 2 is:

[0112] Lead-free no-clean flux, composed of the following raw materials by weight percentage:

[0113] Hydrogenated rosin methyl ester 2%

[0114] Hydrogenated rosin 1%

[0115] Adipic acid 0.5%

[0116] Glutaric Acid 0.5%

[0117] Succinic Acid 1.5%

[0118] Malonate 0.3%

[0119] FT900 Surfactant 0.2%

[0120] Nonylphenol ethoxylate 0.2%

[0121] Triethylene glycol butyl ether 3%

[0122] Absolute Ethanol 90.8%.

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Abstract

The invention relates to the technical field of soldering flux, in particular to lead-free no-clean soldering flux and a preparation method thereof. The soldering flux has the advantages of no halogen, strong soldering ability and no corrosion; and solids are not remained on the surface of a soldered object without cleaning, and the phenomena of no joint soldering and no short circuit can be avoided after soldering; and therefore, the lead-free no-clean soldering flux is particularly suitable for single-side circuit boards which are difficult to solder or copper-plating and nickel-plating circuit boards.

Description

technical field [0001] The invention relates to the technical field of flux, in particular to a lead-free no-clean flux and a preparation method thereof. Background technique [0002] In the production process of electronic products, in order to ensure the smooth progress of the welding process during the assembly of electronic components (such as capacitors, resistors, diodes, PCBs), fluxes are usually used to remove solder and oxides on the surface of the soldered products, so that the metal surface reaches The purpose of necessary cleanliness, thus improving welding performance. Therefore, the performance of the flux directly affects the quality of electronic products. [0003] In the prior art, the flux is usually a mixture of common rosin, resin, halide-containing activator, additive and organic solvent. The common rosin used in this kind of flux has poor film-forming and covering properties, resulting in certain For example, when the humidity is high, it is easy to a...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 邓剑明
Owner 广东剑鑫科技股份有限公司
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