Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Lead-free and halogen-free solder paste for electronic industry

A technology of electronics industry and solder paste, applied in the field of soldering chemicals used in the electronics industry, can solve problems such as poor soldering performance, reduce defects and improve wettability

Inactive Publication Date: 2012-11-21
SICHUAN UNIV +1
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The purpose of the present invention is to provide a new type of lead-free and halogen-free soldering solder paste, which overcomes the shortcomings of existing halogen-free products with poor soldering performance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lead-free and halogen-free solder paste for electronic industry
  • Lead-free and halogen-free solder paste for electronic industry
  • Lead-free and halogen-free solder paste for electronic industry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] In this embodiment, the solder alloy powder is Sn96.5Ag3.0Cu0.5, its content is 88% (mass percentage), and the content of solder is 12% (mass percentage). The components of the flux and the content of each component are shown in Table 1. The solder powder and flux are thoroughly mixed to prepare a solder paste. The product should be refrigerated at 0-10 degrees Celsius.

Embodiment 2-3

[0036] In this embodiment, the alloy solder powder is Sn99Ag0.3Cu0.7, its content is 88% (mass percentage), and the content of solder is 12% (mass percentage). The components of the flux and the content of each component are shown in Table 1. The solder powder and flux are thoroughly mixed to prepare a solder paste. The product should be refrigerated at 0-10 degrees Celsius.

Embodiment 4-5

[0038] In this embodiment, the solder alloy powder is Sn96.5Ag3.8Cu0.7, its content is 88% (mass percentage), and the content of solder is 12% (mass percentage). The components of the flux and the content of each component are shown in Table 1. The solder powder and flux are thoroughly mixed to prepare a solder paste. The product should be refrigerated at 0-10 degrees Celsius.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
Login to View More

Abstract

The invention relates to a chemical soldering flux in the electronic industry, in particular to a solder paste used for arranging electronic elements and the alloy welding powder is lead-free alloy. The technical scheme of the invention is as follows: the lead-free and halogen-free solder paste for electronic industry comprises 85-94wt% of alloy welding powder and 6-15wt% of flux, wherein the flux comprises 20-60wt% of resin, 10-60wt% of solvent, 1-10wt% of rheology control agent, 0.1-40wt% of activator and the balance stabilizer; and the alloy welding powder is lead-free welding powder and is characterized in that the activator contains shikimic acid with the constitutional formula shown in formula I, shikimate with the constitutional formula shown in formula II and amide of shikimic acid with the constitutional formula shown in formula III. The beneficial effect of the invention is as follows: shikimic acid or a derivative thereof is used as the activator so as to increase the wettability of the halogen-free product so as to reduce bad effects caused by the solderability in production.

Description

technical field [0001] The invention relates to soldering flux chemicals used in the electronic industry, in particular to solder paste for electronic component installation, the alloy solder powder of which is a lead-free alloy. Background technique [0002] The electronics industry needs to install a large number of electronic components on the printed circuit board by soldering. Good and reliable solder joint formation requires wetting, diffusion and metallurgical bonding of molten solder on very clean metal surfaces. However, the possibility of oxidation of printed circuit boards, electronic components, or other metal surfaces that are welded is almost 100% during manufacturing, storage, transportation, and reproduction. Therefore, the treatment of the oxide layer on the surface of the welding material is very critical in the production of the electronics industry. It is often necessary to use a large amount of flux chemicals to clean the oxide layer and pollutants on t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363
Inventor 黄艳李英卢志云邓小成郑伟民
Owner SICHUAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com