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Non-cleaning flux for low temperature paste and preparing method of flux

A flux and no-cleaning technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of poor wettability, inability to play a role in fluxing, and many residues, and achieve easy operation, good fluxing effect, The effect of less residue after welding

Inactive Publication Date: 2017-12-08
NORTHEASTERN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the soldering flux used with this type of solder alloy has good solderability, it has poor wettability when used at 100°C, and there are many residues after soldering, which cannot play a role in soldering.

Method used

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  • Non-cleaning flux for low temperature paste and preparing method of flux
  • Non-cleaning flux for low temperature paste and preparing method of flux
  • Non-cleaning flux for low temperature paste and preparing method of flux

Examples

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preparation example Construction

[0034] The present invention also provides a method for preparing the no-clean flux for low-temperature solder paste as described above, comprising the following steps:

[0035] S0. Mix ethylene glycol, ethylene glycol monobutyl ether, isopropanol and ethanol at a mass ratio of 5:2:(40~95):(0.1~55), and stir at room temperature (25±2°C) until Dissolve completely to obtain compound solvent.

[0036] S1. Heat and stir the compound solvent, thixotropic agent, and film-forming agent at a mass ratio of (79-82):(2-5):0.25 at a temperature of 38° C. to 42° C. until they are completely dissolved to obtain a matrix solution;

[0037] S2. Add 7-14% active agent by mass percentage, 0.5% corrosion inhibitor by mass percentage and 0.1-0.5% antioxidant by mass percentage to the matrix solution obtained in step S1, at 38°C-42°C Stir at a temperature until completely dissolved;

[0038] S3. Add a pH regulator with a mass percentage of 1-8% to the solution obtained in step S2, and stir at a ...

Embodiment 1

[0056] Put 41.95% ethanol, 31.66% isopropanol, 3.96% ethylene glycol, and 1.58% ethylene glycol monobutyl ether in a container with a polytetrafluoro stirring bar, and place the container on a magnetic stirrer and stir at room temperature 3 to 4 hours until it is completely dissolved to obtain the compound solvent; add 0.25% polyethylene glycol 2000 and 5% castor oil to the container containing the compound solvent, place the container in a water bath and heat it to 40°C in a water bath, and stir at a constant speed 2.5 to 3.5 hours to completely dissolve to obtain a matrix solution; after the above stirring is completed, add 13.5% lactic acid, 0.5% benzotriazole, and 0.1% toluate butyrate to the container, and stir at a constant speed for 0.5 to 1.5 hours to Completely dissolve; finally, add 1.5% ethylenediamine into the container, stir for 0.5-1h until completely dissolved, and then you can get the no-cleaning flux.

Embodiment 2

[0058] Put 41.95% ethanol, 31.66% isopropanol, 3.96% ethylene glycol, and 1.58% ethylene glycol monobutyl ether in a container with a polytetrafluoro stirring bar, and place the container on a magnetic stirrer and stir at room temperature 3 to 4 hours until it is completely dissolved to obtain the compound solvent; add 0.25% polyethylene glycol 2000 and 5% castor oil to the container containing the compound solvent, place the container in a water bath and heat it to 40°C in a water bath, and stir at a constant speed 2.5 to 3.5 hours to completely dissolve to obtain a matrix solution; after the above stirring is completed, add 12% lactic acid, 0.5% benzotriazole, and 0.1% toluate butyrate to the container, and stir at a constant speed for 0.5 to 1.5 hours to Completely dissolve; finally, add 3% ethylenediamine into the container, stir for 0.5-1 hour until completely dissolved, and then you can get the no-cleaning flux.

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Abstract

The invention discloses non-cleaning flux for low temperature paste, and a preparing method of the flux and belongs to the technical field of welding flux. The flux comprises, by mass percent, 79 to 82% of a compound solvent, 7 to 14% of an active agent, 2 to 5% of a thixotropic agent, 0.1 to 0.5% of a corrosion inhibitor, 1 to 8% of a pH conditioning agent, 0.5% of an antioxidant and 0.25% of a film-forming agent. The compound solvent is composed of a high-boiling-point organic solvent with the boiling point exceeding 200 DEG C and a low-boiling-point organic solvent with the boiling point lower than 200 DEG C, the high-boiling-point organic solvent is a mixture of ethylene glycol and ethylene glycol butyl ether, the low-boiling-point organic solvent is a mixture of one or two of ethyl alcohol and isopropyl alcohol, the active agent is lactic acid, the thixotropic agent is castor oil, the corrosion inhibitor is benzotriazole, the pH conditioning agent is organic amine, the antioxidant is toluic acid butyrate, and the film-forming agent is polyethylene glycol 2000. The method is simple in technology, operation is easy, the flux can be used in cooperation with flux powder with the melting point lower than 100 DEG C, activity is high, wettability is good, post-welding residue is little, corrosion resistance is high, and no tin sweat phenomenon happens.

Description

technical field [0001] The invention belongs to the technical field of solder, and relates to a no-clean flux for low-temperature solder paste and a preparation method thereof. Background technique [0002] No-clean flux for low-temperature solder paste is a new type of flux that does not contain halide activators and does not require cleaning after soldering. It has the advantages of no pollution, low cost, simple process, and short production cycle. It is widely used. Flux is used as a solder paste auxiliary material, and its performance can directly affect the quality of electronic packaging products. [0003] At present, most of the fluxes on the market are developed to match the temperature of electronic packaging, and their theoretical use temperature is relatively high. At 217-227°C, the melting point of traditional Sn-Pb eutectic solder is 183°C, the melting point of low-temperature mounting solder such as Sn-Bi eutectic solder is 139°C, and the melting point of Sn-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362B23K35/363B23K35/40
CPCB23K35/3612B23K35/362B23K35/40
Inventor 李晓东叶灵敏孙旭东张牧
Owner NORTHEASTERN UNIV
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