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Rosin halogen-free scaling powder for lead-free soldering paste

A lead-free solder paste, rosin-based technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve problems such as non-cleaning flux, unsuitable lead-free solder paste, residual corrosion, etc. To achieve the effect of excellent quality stability, good flux and good fluidity

Inactive Publication Date: 2005-12-21
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the flux for soldering paste published by the patent 95117301.4 (a patent applied by the United States in China) mainly solves the problem that the SnPb-based near-eutectic alloy solder paste hardens or solidifies over time, but it cannot solve the problem of near-eutectic alloys such as SnAgCu-based Serious high-temperature oxidation of alloy lead-free solder paste; patent 99810452.3 (patent applied by Japan in China), patent 01117345.9 (patent applied by Japan in China) and 01800016.9 (patent applied by Japan in China) for solder paste flux , they are mainly aimed at SnZn or SnPb solder, which solves the problem of the aging effect and aging of SnZn solder paste, but because the flux contains halogen, the residue after soldering will cause corrosion; patent 00137388.9 (patent applied by Japan in China ) published flux for solder paste, mainly to solve the problem of the drop in reliability caused by the presence of dew or attached dust in the past, but it is mainly for SnPb solder, but also because of containing halogens resulting in post-soldering Residues cause corrosion; the rosin-type flux disclosed in patent 89105911.3 is mainly used for wave soldering, not for preparing solder paste, and because it uses a low-boiling solvent, it cannot solve the serious high-temperature oxidation of lead-free solder in the brazing process The problem; the flux disclosed in the patent 200410026717.X is suitable for lead-free solder, but it is also mainly used for wave soldering, not suitable for the preparation of lead-free solder paste
Patent 200410022403.2 discloses a flux for preparing lead-free solder paste, but it contains halogen and is not a no-clean flux

Method used

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  • Rosin halogen-free scaling powder for lead-free soldering paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Embodiment 1: This is a rosin-type halogen-free flux for lead-free solder paste that does not contain surfactants, and the mass percentage of each raw material content is:

[0028] polymerized rosin: 67

[0029] Glutaric acid 4

[0030] Polyethylene glycol 2000 1

[0031] Diethylene glycol ether 26.5

[0032] Hydrogenated castor oil 1

[0033] Paraffin 0.5

[0034] Specific preparation method: The specific preparation method is a conventional method, that is, adding an organic solvent into a clean enamel kettle with stirring, then adding polymerized rosin to the solvent, heating, stirring, dissolving, and clarifying, then adding other raw materials in turn, and continuing Stir until the solid matter is completely dissolved, mix evenly, stop stirring, make up the amount of solvent reduced due to volatilization through calculation, mix evenly, let stand, and cool with water, that is, rosin-type halogen-free flux for lead-free solder paste; Mix flux and lead-free solder...

Embodiment 2

[0035] Embodiment 2: This is a kind of rosin-type halogen-free flux for lead-free solder paste containing surfactant and two-component organic acid, and the mass percentage of each raw material content is:

[0036] polymerized rosin: 19

[0037] Hydrogenated rosin 10

[0038] Succinic acid 15

[0039] Glutaric acid 15

[0040] Nonylphenol polyoxyethylene ether 0.5

[0041] Polyethylene glycol 6000 2

[0042] Diethylene glycol butyl ether 22.5

[0043] Hydrogenated castor oil 8

[0044] Paraffin 8

[0045] The preparation method is the same as in Example 1.

Embodiment 3

[0046] Embodiment 3: This is another kind of rosin-type halogen-free soldering flux for lead-free solder paste containing surfactant and single-component organic acid, and the mass percentage of each raw material content is:

[0047] polymerized rosin: 25

[0048] Disproportionated Rosin 15

[0049] Salicylic acid 4

[0050] Octylphenol ethoxylate 10

[0051] Polyethylene glycol 4000 11

[0052] Butyl Cellosolve 25

[0053] Hydrogenated castor oil 5

[0054] Paraffin 5

[0055] The preparation method is the same as in Example 1.

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PUM

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Abstract

The invention relates to a scaling powder, especially applying to the alloy's department such as SnAgCu, SnAgCuRE and SnAg and so on. The quality percent of the present invention is the activation dosage of the organic acid which consists of the duality acid, the three-member acid, the hydroxyl acid, the balminess acid in the fattiness race 4-30wt%,the changed capable colophony which is one or more mixed of the converged colophony, the hydrogen sulfide colophony and the divergent colophony 29-67wt%, the becoming electuary which is one or more mixed of the assembled glycol2000,the assembled glycol4000 and the assembled glycol6000 1-20wt%,the olefin as the tranquilization dosage 0.5-8wt%,the touched and altered dosage which one or more mixed of the hydrogen sulfide castor oil and the compound of the acyl and amine 1-8wt% and the remain is the impregnant of the high boiling point which is one or more mixed of the butyl dissolved fine dosage, the calorie certain alcohol of the cymene and the calorie certain alcohol of the second radicle. The invention doesn't contain the halogen and penetrate the copper mirror after welding. It has high insulated resistances, the excellent function of the assisting burning. Also it solves the problem of oxidation in the high temperature and the appropriate viscosity of the welding cream.

Description

technical field [0001] The invention relates to a soldering flux, which is especially suitable for preparing rosin-type halogen-free soldering flux for lead-free soldering paste of alloy systems such as SnAgCu, SnAgCuRE and SnAg. Background technique [0002] The technology of Sn-Pb alloy solder is mature, and it has the incomparable advantages of other solders, and is widely used in electrical and electronic products. However, when waste electronic appliances are disposed of in landfills, Pb in the solder meets acid rain or groundwater to form Pb 2+ , dissolve in groundwater, enter people's water supply chain and thus enter human body, leading to lead poisoning. [0003] In consideration of environmental protection, the European Union (EU) has passed the Waste Electrical and Electronic Equipment (WEEE), which clearly declares that electrical and electronic products must be lead-free from July 1, 2006. [0004] Nowadays, people are actively looking for substitutes for SnPb...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362
Inventor 史耀武王友山雷永平夏志东
Owner BEIJING UNIV OF TECH
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